The TeleCANesis lean middleware platform lets developers address trends in sectors such as healthcare, smart industry, communications, and e-mobility. Embedded devices in these industries now typically demand complex distributed systems comprising multi-channel sensing, edge computing, gateways, and cloud services. Connecting the domains to capture, process, store, and analyze data, and communicate with actuators and HMIs, involves more than mere protocol translation to handle the different data formats, timing requirements, security, safety, and other issues. Conventional approaches call for intimate engagement with the different communication standards and even a simple application can involve writing tens of thousands of lines of code, which can add several months to a project. TeleCANesis now offers an alternative.

“The TeleCANesis framework builds on our own experience in embedded projects, tackling the same connectivity issues and facing the same coding challenges again and again,” said Jonathan Hacker, TeleCANesis Founder and CTO. “Developers facing these issues can now get to market faster and cut their development costs by up to 70 percent with TeleCANesis’ tools and support. Embedded World visitors can find out how by coming to our booth, 2062, any time during the show or, better still, arranging an appointment in advance.”

The event will feature live demonstrations of TeleCANesis running on the NXP i.MX 95 using QNX and DiSTI GL Studio, as well as on a Toradex i.MX 8 Yavia board using Linux and Slint. Additionally, an Ottawa Infotainment DragonFire Pro buck will be showcased, leveraging Crank Storyboard for its HMI capabilities, and TeleCANesis for connectivity.

With TeleCANesis, developers can design robust distributed systems and use automated code generation to bring them up quickly. Its powerful runtime core abstracts the complexity of connectivity, simplifying system integration. TeleCANesis supports a wide range of hardware buses, including—CAN, GPIO, and Modbus—and protocols like MQTT, ZeroMQ, and REST, with flexible data formats (JSON, BSON, CAN, RAW, and more). It also integrates seamlessly with HMI environments such as Crank Storyboard, DiSTI GL Studio, Slint, and Unity.

https://telecanesis.com/

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex.

The acquisition is a strategic plan to further strengthen Molex in aerospace and defence sectors, following its acquisition of AirBorn last November.

“The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways,” said Nelligan.

Smiths Interconnect designs and manufactures innovative electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications.

Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the US, UK, Canada, Mexico, Costa Rica, France, Germany, Italy, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

www.molex.com.

“ADI Power Studio is more than a set of tools — it’s a design ecosystem,” said Robert Reay, Vice President and Fellow, Power Products, ADI. “By integrating new system-level and IC-level design capabilities into a single product family, we’re enabling engineers to streamline power management design and optimisation so they have the potential to get solutions to their customers faster.”

Today’s electronic systems require more power density than ever, with dozens or even hundreds of power rails and interdependent voltage domains. That complexity creates bottlenecks and requires rework during architecture decisions, component selection and validation. Power Studio addresses these challenges by providing a unified, intuitive workflow that helps engineering teams make better decisions earlier by simulating real-world performance with accurate models and automating key outputs, such as bill of materials and report generation. Together, the family of tools can facilitate shorter development cycles, reduce rework and increase speed at which engineers bring power-dense systems to market.

Power Studio Planner and Power Studio Designer are available now as part of the ADI Power Studio. These tools represent the first phase of ADI’s vision to deliver a fully connected power design workflow for customers, with ongoing updates and product announcements planned in the months ahead.

www.analog.com.

Developers with ideas on how to revolutionise industries with new thermography apps can win up to $5,000 in cash, as well as Flir thermal cameras.

The global call is out for developers to create innovative Android apps using the Flir ACE SDK (Software Development Kit). Flir’s Hackathon App Challenge is an opportunity to harness thermal imaging for real-world impact, presenting coders, engineers, and creative thinkers with a chance to win big while overcoming genuine industry challenges. The idea is to build game-changing apps for sectors that include industrial condition monitoring, building diagnostics, or indeed any kind of ‘wildcard’ application the imagination conjures.

For industrial condition monitoring, innovative apps are required that facilitate the use of thermal imaging to keep power flowing and machines running – negating downtime that can cost thousands of dollars every minute. With a well-executed condition monitoring program, inspectors are able to locate and diagnose early failure signs in machines or electrical systems, prompting targeted and efficient rectification. An app idea here might include collecting and annotating the temperature of electrical components, and suggesting actions based on trends.

For building diagnostics and energy efficiency, apps can help maintain the health of a facility. Inspectors use thermal cameras to detect issues such as missing or defective insulation, moisture build-up, water infiltration, inefficient HVAC systems, and air leaks. Documenting and reporting issues is key for this industry as it deals with insurance companies and other stakeholders. How about developing an app that allows inspectors to collect data and easily report issues to building owners and insurance companies?

The 2025 Flir Hackathon App Challenge is about more than apps alone – it is about building directly into the Flir ACE platform that powers the new iXX-Series cameras (i34, i64, i35, and i65). The code runs directly on the camera, creating customized inspection workflows and tools. With built-in LTE and cloud connectivity, apps securely share thermal data and reports from the field, without Wi-Fi access.

By developing apps for Flir ACE, entrants to the Flir Hackathon App Challenge 2025 could be shaping how technicians around the world capture, analyse and act on thermal data in real time. It represents a chance to code the future of inspections by giving users a ‘sixth sense’.

Places are limited, so applicants are advised to register as soon as possible. The official deadline is 29 December 2025. Following idea submission, competition applicants can participate in the ‘Kick-off Webinar’ to learn more about the challenge and how to make their idea stand out. The opportunity also exists to team up with Flir experts and industry leaders to help develop the project.

Further details and registration are available at https://Flir.kreativdistrikt.com/

Flir is a Teledyne Technologies company, focusing on intelligent sensing solutions for industrial applications

Among the key enhancements are:

PulsonixSim – Fully Integrated ngspice-based Simulator
Pulsonix 14 introduces PulsonixSim, the new simulation option is built on the ngspice engine and tightly integrated into the Pulsonix schematic environment. It allows designers to attach models, place stimuli and run mixed-mode SPICE analysis, including transient, AC, DC, Monte Carlo, noise, transfer functions, and more – all without leaving the design environment and utilising the same library used for design and PCB layout. Simulation results can be plotted to full screen graph windows or local ‘in-design’ graphs.

3D Flexi Bend & Clipping Plane Enhancements
A new “lift-off” state for Flexi bend regions allows the flexible portion of the board to originate inside existing boundaries rather than exiting the board edge. The bend region transforms adaptively based on bend-radius parameters.

Additionally, a 3D clipping plane feature lets users selectively hide parts of the design along X, Y or Z axes (and reverse clipping direction) to inspect internal layers or buried elements more effectively.

Interactive HTML BOM & Graphical Comparison Tools
Pulsonix 14.0 supports the Interactive HTML BOM option that exports design and BOM data into a searchable, browser-friendly HTML format.

The Symbol / Footprint Compare and Design Revision Analyser tools highlight differences between design versions or symbols, either in dialog view or using overlaid graphics with dimming/lowlighting.

Usability Upgrades & Window Workflow
The user interface sees multiple enhancements: tear-off windows, dock bars, “find in dialog grids,” and faster category switching to streamline navigation and reduce friction when working with large designs or complex dialogs.

Circular Hatching Style
Pulsonix 14 adds a circular hatching style alongside traditional linear hatching. Circular hatching reduces sharp corner effects during etching, which helps minimise impedance variation for tracks adjacent to hatched copper zones

Major Update to Scripting and Automation
Version 14.0 replaces the legacy ActiveX automation system with a completely re-engineered, modern scripting framework developed in-house by Pulsonix. The new scripting environment provides greater flexibility, improved security, faster execution, and direct access to more Pulsonix objects and functions. Users can now automate complex design operations, customise workflows, and build bespoke productivity tools using industry-standard scripting languages.

Vault Integration & Version Control Enhancements
Vault improvements in Version 14 include visual thumbnail previews of items, “synchronise selected items” folder path alignment, definable permissions, Spice Model and Formal files in Vault and type-specific revision naming schemes – helping design teams maintain data integrity and traceability.

Pulsonix Version 14.0 is available now. Learn more about the new features and enhancements, by visiting www.pulsonix.com/latestversion

ETAL UK is part of Kamic Group’s Magnetic Division and will be joined at the event by other members, including AGW Electronics, Avon Magnetics, Talema, SIGA Electronics and GST. With expertise spanning numerous sectors and applications, over 1,100 employees, manufacturing operations in four countries and customers located across the world, the group is a global force in the magnetics and components market.

“As a business we have continued to grow over the past 12 months, adding new expertise to an already impressive portfolio of market-leading products.  We have six world-class manufacturing sites that all offer different capabilities, and I am excited to meet customers old and new at EDS 2025 and showcase the breadth of solutions we can offer them,” said Stefan Ruuth, Sales Manager BA at ETAL Group.

Exhibiting on stand D4, visitors will have the opportunity to explore some of the group’s portfolio of customisable magnetic components and transformers, which are tailored for multiple industries, including aerospace, automotive, defence, transport, telecommunications and medical technology.

www.etalgroup.com/

To enhance the overall quality of the rail sector and drive innovation, IRIS certified companies can be awarded one of three performance levels — Bronze, Silver, or Gold. Achieving a higher quality performance level requires companies to boost customer satisfaction and improve the efficiency of their rail business. Moxa’s steadfast commitment since 2013 to ensure the quality, reliability, and safety of its rail products and solutions comply with the rigid rail industry standards has helped elevate Moxa’s performance level from Bronze to Silver.

Key performance areas for evaluation included customer satisfaction, timely delivery to customers, requirement management, project management, external supplier management, and traceability. Remarkable performance in these areas has significantly boosted Moxa’s scores in the overall audit categories, which cover Enablers, Process Performance, and Customer Perception.

The most recent IRIS Certification Revision 04 covers the latest version of the ISO 22163:2023 standard, the IRIS Certification Performance Assessment issued by UNIFE (Union of European Railway Industries) in July 2023, and the IRIS Certification Technology. It outlines a railway quality management system that integrates the ISO 9001 quality management standards along with railway-specific requirements.

With over 15 years of experience and expertise in digitalising the rail industry, Moxa has developed more than 500 product offerings dedicated to helping build successful railway-specific applications. These applications include, but are not limited to, closed-circuit television (CCTV), computer-based train control (CBTC), train control and monitoring systems (TCMS), onboard passenger information systems (PIS), public address (PA) systems, passenger Wi-Fi, condition monitoring, and Wi-Fi 6 train-to-ground (T2G) communication.

Moxa’s rail solutions are certified for a wide range of industrial standards, including EN 50155, EN 50121, IEC 62443-4-1/-2 cybersecurity, and EN 18031 for the wireless-capable product portfolio. This robust certification framework supports Moxa’s track record of over 1,000 successful deployments across 200 cities in over 50 countries.

With involvement in railway projects around the world, Moxa is proud to partner with many industry leaders in the global rail market to define advanced, industry-transforming technologies and co-develop standards like IEC 61375. Moxa is also an active participant in key rail working groups such as Safe4Rail and ITxPT to help advance Ethernet train communication networks and improve interoperability and integration for public transport.

Visit the Moxa Rail Portal.

“Chiplet integration is reshaping how the industry thinks about performance, scaleability and time to market,” said Robin Davis, VP of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to develop a chiplet solution that combines different chips, process nodes, sizes and even die from multiple foundries delivering more efficient and cost-effective products.”

Chiplet technology offers significant advantages in semiconductor design and manufacturing by enabling a more-than-Moore approach. Designers can go beyond traditional scaling to deliver enhanced functionality and performance and get products to market faster. Chiplets allow the reuse of existing IP and can facilitate the mixing of advanced process nodes with less expensive legacy geometries. By utilizing the most appropriate die technology for a particular function, chiplets provide a versatile, efficient and economical pathway for advanced semiconductor innovation.

“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet-based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver a comprehensive package of IP, simulation tools and advanced assembly and engineering services necessary for successful chiplet development and productization.”

This collaboration combines Deca’s M-Series fan-out and Adaptive Patterning technologies with SST’s industry-leading SuperFlash embedded flash technology. The companies are applying their system-level integration expertise to deliver a bundled offering that empowers customers to design, verify and commercialize NVM chiplets. By enabling greater architectural flexibility, the solution offers both technical and commercial advantages over traditional monolithic integration.

The collaborative solution provides a modular, memory-centric foundation for advanced multi-die architectures by combining the strengths of both companies. The chiplet package leverages SST’s SuperFlash technology, along with the interface logic and physical design elements required to function as a self-contained chiplet. This is paired with Adaptive Patterning-based redistribution layer (RDL) design rules, simulation flows, test strategies and manufacturing paths through Deca’s ecosystem of qualified partners.

Deca and SST will jointly support customers from early design through qualification and prototype manufacturing. By streamlining integration and accelerating design cycles, the companies aim to enable broader adoption of heterogeneous integration, engaging with customers globally to bring chiplet solutions to market.

SST website  Deca website

“We have always looked to partner with like-minded companies to ensure our customers have an ecosystem of options that seamlessly integrate, extend value, and bring the future of IoT communications to drive their business,” said Steve Ericson, Senior Vice President and General Manager of Digi OEM Solutions.

Digi International supplies secure embedded technology and connectivity such as system-on-modules, wireless communication systems, and cloud management software to developers in a diverse range of industries, including education, energy, industrial, medical, retail, smart cities and transportation. In every case, it is committed to ensuring that each customer is provided with precisely the right technology for their wireless connectivity requirements. Its technologies include a range of solutions to support Bluetooth, cellular IoT, edge computing, Fixed Wireless Access, LoRaWAN, 5G, Zigbee Wireless Mesh, and more.

Digi solutions can be ordered online from Farnell in EMEA, element14 in APAC and Newark in North America.

Software framework company RTI is the trusted partner for Navantia’s advanced naval projects, including combat systems, navigation systems, and new research initiatives within its Center of Excellence (COEX) for Naval Systems, part of the broader Navantia COEX network.

RTI Connext supports Navantia’s diverse technology stack, which includes C++ and Linux for combat systems, and a mix of Python, C++, and Android in the COEX division. Connext streamlines system development, cutting debugging time to mere hours.

“Connext simplifies our development processes, allowing our teams to focus resources on other time sensitive challenges rather than low-level communication issues. Its robust tools and extensive documentation make it an ideal solution for our integration needs, especially with third-party components and other shipbuilders,” said Luis Arce, Head of Systems Engineering at Navantia.”Connext is deeply embedded into our operational framework and provides the real-time connectivity essential for our most complex systems .”

Navantia needed a solution that would reduce integration complexity and strengthen compatibility with partners and third-party technologies within its ecosystem. By working with RTI, Navantia benefits from a more optimised and standardised platform—saving time and improving data modelling. RTI’s comprehensive tools and on-the-ground support in Spain also play a key role in driving these tangible results.

“Navantia’s trust in RTI for its most advanced naval programs underscores the reliability of our technology and the essential role Connext plays in enabling complex systems to evolve and innovate at scale,” said John Breitenbach, Director of Aerospace and Defense Markets at RTI. “We’re proud to continue this valued partnership and support Navantia in accelerating scaleable, interoperable systems that will help shape the future of naval defence.”

Beyond powering core naval operations, Connext ensures all systems remain current and supported while providing access to newer technology capabilities for future development and deployment.

Find out more here.

With the rapid rise of AI clusters, cloud computing, and next-generation telecom networks, the demand for precise, reliable cooling has never been greater. Tark Thermal Solutions will showcase new thermoelectric designs that enable optical transceivers and high-performance imaging systems to operate at peak stability and efficiency.

“With the surge in power density across optoelectronic systems, thermal management is now a critical enabler of innovation. At ECOC, we’ll demonstrate how our advanced thermoelectric coolers help customers push the limits of speed, precision, and reliability in AI, cloud, and telecom applications.” – Andrew Dereka, Thermoelectrics Product Director, Tark Thermal Solutions.

Tark Thermal Solutions on Stand C1402
More than a simple product showcase, Tark Thermal Solutions will present targeted solutions for key application areas:

– AI clusters & optical transceivers: OptoTECTM MBX Series micro thermoelectric coolers, designed for temperature stabilization of EML and coherent lasers in high-density computing
– High-end imaging & sensing: OptoTECTM MSX Series micro multistage thermoelectric coolers for deep cooling of high-performance image sensors.
– High-temperature environments (up to 150 °C): Hi-Temp ETX Series thermoelectric coolers for autonomous systems, machine vision, and digital light processors
– Battery backup cooling: Outdoor Cooler Series thermoelectric assembly
– Precision laboratory imaging: Nextreme NRC400 thermoelectric recirculating chiller for cooling image sensors in cameras

www.tark-solutions.com

Helping customers throughout their product lifecycle, Clea OS enables the deployment of value-added services at the edge, such as remote OS and application updates, opening new scenarios for service offerings and recurring revenue streams. These services can include everything from optimised AI workloads and enhanced security to integrated payment systems. By building on Clea OS, companies can significantly reduce complexity, costs, and risks associated with meeting stringent new standards, while delivering new services to end-users.

In response to escalating cybersecurity threats like device vulnerabilities, insecure communication, and data breaches, this new version provides a solid foundation for intelligent devices. As an integral part of the comprehensive Clea Framework, it is designed to help Original Equipment Manufacturers (OEMs) accelerate development, meet emerging cybersecurity regulations, and reduce the total cost of ownership.

This new release model makes Clea OS ready for the future of digital product regulation. With the upcoming enforcement of new legal frameworks like the EU’s Cyber Resilience Act (CRA) and the Radio Equipment Directive (RED), which prescribe mandatory cybersecurity provisions for connected devices, Clea OS v2.0 provides a clear and streamlined path to compliance. The cybersecurity services package, offered under licence, will enable OEMs to directly address key regulatory requirements, such as the automated generation of a Software Bill of Materials (SBOM) as mandated by the CRA, alongside integrated vulnerability management and regular security patching. For customers with advanced needs, thanks to SECO’s partnership with Exein – a leading company in embedded security – premium AI-based solutions for device monitoring and protection are also available.

Clea OS is designed to support the introduction of a formal Long-Term Support (LTS) model, which will be made available with the next updates. Clea OS v2.0 will be delivered as a direct update for all SECO hardware devices that are currently under an active maintenance plan: this new structure ensures a stable and secure software foundation for the entire product lifetime. Customers will benefit from quarterly updates published in the public code repository, which include not only new features and bug fixes, but also crucial CVE patching to address relevant security vulnerabilities. All changes are managed through a robust CI/CD pipeline and are meticulously tracked and documented with detailed release notes, offering full transparency and simplifying maintenance. While SECO provides this comprehensive support framework, customers retain the flexibility to evolve their own operating system, manage integration testing, and handle their update lifecycle independently.

All SECO hardware devices currently under active maintenance will receive the Clea OS upgrade. The operating system can also be tested in a QEMU-emulated environment. For legacy SECO devices not covered by a maintenance plan or for third-party hardware, SECO provides professional engineering services to support the porting process, accessible through the Company’s commercial channels.

Clea OS 2.0 is available now. To get started and explore its new features, please visit: https://clea.ai/products/clea-os/demo.