“Our focus has always been to evolve with our customers’ needs,” said Andy Zanelli, CEO of VCC. “The addition of sound devices brings another dimension to our HMI offering, giving engineers and manufacturers more tools to build intuitive and dependable systems.”

With this addition, VCC customers gain access to high-performance audio components that provide reliable signalling in critical applications. From industrial automation and transportation to medical equipment, IoT, and energy systems, the new portfolio is engineered to ensure clear, consistent alerts in environments where sound is essential for safety and performance.

• Magnetic Indicators: Compact and efficient options that deliver dependable tones in limited-space designs.
• Magnetic Transducers: Energy-efficient components that balance volume, tone, and power consumption.
• Piezo Indicators: Lightweight, durable, and highly reliable, designed for long service life.
• Piezo Transducers: High-output solutions with wide frequency choices to match demanding design requirements.

The new sound devices are available today through VCC’s established global distribution network, complementing its broad range of illuminated and custom HMI solutions.

https://vcclite.com

The TeleCANesis lean middleware platform lets developers address trends in sectors such as healthcare, smart industry, communications, and e-mobility. Embedded devices in these industries now typically demand complex distributed systems comprising multi-channel sensing, edge computing, gateways, and cloud services. Connecting the domains to capture, process, store, and analyze data, and communicate with actuators and HMIs, involves more than mere protocol translation to handle the different data formats, timing requirements, security, safety, and other issues. Conventional approaches call for intimate engagement with the different communication standards and even a simple application can involve writing tens of thousands of lines of code, which can add several months to a project. TeleCANesis now offers an alternative.

“The TeleCANesis framework builds on our own experience in embedded projects, tackling the same connectivity issues and facing the same coding challenges again and again,” said Jonathan Hacker, TeleCANesis Founder and CTO. “Developers facing these issues can now get to market faster and cut their development costs by up to 70 percent with TeleCANesis’ tools and support. Embedded World visitors can find out how by coming to our booth, 2062, any time during the show or, better still, arranging an appointment in advance.”

The event will feature live demonstrations of TeleCANesis running on the NXP i.MX 95 using QNX and DiSTI GL Studio, as well as on a Toradex i.MX 8 Yavia board using Linux and Slint. Additionally, an Ottawa Infotainment DragonFire Pro buck will be showcased, leveraging Crank Storyboard for its HMI capabilities, and TeleCANesis for connectivity.

With TeleCANesis, developers can design robust distributed systems and use automated code generation to bring them up quickly. Its powerful runtime core abstracts the complexity of connectivity, simplifying system integration. TeleCANesis supports a wide range of hardware buses, including—CAN, GPIO, and Modbus—and protocols like MQTT, ZeroMQ, and REST, with flexible data formats (JSON, BSON, CAN, RAW, and more). It also integrates seamlessly with HMI environments such as Crank Storyboard, DiSTI GL Studio, Slint, and Unity.

https://telecanesis.com/

Compared to the precision analogue version launched in May 2025, the digital interface of the HRF15 simplifies system integration and reduces setup time through an intuitive GUI, accelerating product development timelines. It also improves reliability with advanced monitoring and programming features. Power supply status flags provide visibility into system health and performance, enhancing uptime and protecting sensitive instruments. Data logging features and real-time diagnostics developed by XP Power converts complex internal data into clear, actionable insights, helping users make quick, informed decisions that enhance application safety and lower operating costs. The multi-unit synchronization capability enables scalable power architectures.

The HRF15 series is suitable for noise-sensitive applications, featuring extremely low ripple down to 0.001%(10ppm), which is critical for achieving high performance. The units exhibit high stability over time at 10ppm/hr (or 25ppm/8hrs), ensuring consistency and repeatability in sensitive processes. Excellent load and line regulation, down to 0.001%, delivers high performance even in load-dependent applications or where input voltage fluctuates. The HRF15 series also features a low temperature coefficient of 25ppm/°C, minimizing environmental influences on performance.

Housed in a case measuring 33.0 x 72.4 x 161.0 mm (1.3” x 2.85” x 6.4”) and weighing approximately 465g (1.03lb), the compact unit eases integration into space-constrained applications. As standard, the single output voltages can be specified as 10kV, 12kV, and 15kV. Each unit can deliver 15W of power from a +24VDC input, and the output rail is fully adjustable for Constant Current (CC) and Constant Voltage (CV) from 0 to 100%, addressing a wide range of loads. The product also carries UL61010 and UL62368 safety approvals.

The HRF15 digital series is available from Avnet Abacus or direct from XP Power with a 3-year warranty.

https://www.xppower.com/product/HRF15-Series

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex.

The acquisition is a strategic plan to further strengthen Molex in aerospace and defence sectors, following its acquisition of AirBorn last November.

“The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways,” said Nelligan.

Smiths Interconnect designs and manufactures innovative electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications.

Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the US, UK, Canada, Mexico, Costa Rica, France, Germany, Italy, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

www.molex.com.

“ADI Power Studio is more than a set of tools — it’s a design ecosystem,” said Robert Reay, Vice President and Fellow, Power Products, ADI. “By integrating new system-level and IC-level design capabilities into a single product family, we’re enabling engineers to streamline power management design and optimisation so they have the potential to get solutions to their customers faster.”

Today’s electronic systems require more power density than ever, with dozens or even hundreds of power rails and interdependent voltage domains. That complexity creates bottlenecks and requires rework during architecture decisions, component selection and validation. Power Studio addresses these challenges by providing a unified, intuitive workflow that helps engineering teams make better decisions earlier by simulating real-world performance with accurate models and automating key outputs, such as bill of materials and report generation. Together, the family of tools can facilitate shorter development cycles, reduce rework and increase speed at which engineers bring power-dense systems to market.

Power Studio Planner and Power Studio Designer are available now as part of the ADI Power Studio. These tools represent the first phase of ADI’s vision to deliver a fully connected power design workflow for customers, with ongoing updates and product announcements planned in the months ahead.

www.analog.com.

The MHO900 Series integrates a wealth of functions into a compact, portable design. Additionally, the limited MHO98 Special Edition features 1GHz bandwidth and 500Mpts memory, a built-in 2-channel 100MHz AWG, and upgraded styling. The MHO98 is also bundled with a PLA2216 16-channel logic probe, a complete serial protocol decoding package (I²C, SPI, UART, CAN, LIN, etc.), and a dedicated carrying case.

The MHO900 Series is designed to handle high-speed signal challenges, and its standard 4 analog channels provide flexible support for complex system debugging. At its core is a 12-bit high-resolution ADC, delivering 16 times the detail of traditional 8-bit instruments — making even the smallest anomalies visible. Combined with an ultra-long 100/500Mpts memory depth, this ensures long-duration capture and analysis of complex signals without missing any detail.

The MHO900 series provides a powerful all-in-one time-domain workstation. With 16 digital channels provided, it allows perfect synchronization and analysis of analogue and digital signals, providing complete insight into mixed-signal systems. Additionally, an optional built-in dual-channel 50/100MHz signal generator is seamlessly integrated with the scope’s powerful Bode Plot analysis function. This makes an ideal solution for complex analysis and testing challenges such as power supply loop stability, or protocol decoding, with LAN, HDMI, and USB interfaces to address diverse embedded system debugging needs. By bringing multiple instrument functions together in one compact device, the MHO900 significantly boosts efficiency.

The MHO900 is equipped with standard Bluetooth and Wi-Fi adapters, allowing engineers full remote network access and control, enabling unattended automated testing or long-distance data monitoring, greatly improving efficiency and safety. Bluetooth connectivity expands the possibilities for peripheral devices without occupying any physical ports and eliminating cumbersome cables. This creates a cleaner and neater testing environment.

Small in size (10.5” x 6.4” x 3.0”) and light in weight (3.5lb), these oscilloscopes are available from Saelig, Rigol’s US distributor.

https://www.saelig.com.

Developers with ideas on how to revolutionise industries with new thermography apps can win up to $5,000 in cash, as well as Flir thermal cameras.

The global call is out for developers to create innovative Android apps using the Flir ACE SDK (Software Development Kit). Flir’s Hackathon App Challenge is an opportunity to harness thermal imaging for real-world impact, presenting coders, engineers, and creative thinkers with a chance to win big while overcoming genuine industry challenges. The idea is to build game-changing apps for sectors that include industrial condition monitoring, building diagnostics, or indeed any kind of ‘wildcard’ application the imagination conjures.

For industrial condition monitoring, innovative apps are required that facilitate the use of thermal imaging to keep power flowing and machines running – negating downtime that can cost thousands of dollars every minute. With a well-executed condition monitoring program, inspectors are able to locate and diagnose early failure signs in machines or electrical systems, prompting targeted and efficient rectification. An app idea here might include collecting and annotating the temperature of electrical components, and suggesting actions based on trends.

For building diagnostics and energy efficiency, apps can help maintain the health of a facility. Inspectors use thermal cameras to detect issues such as missing or defective insulation, moisture build-up, water infiltration, inefficient HVAC systems, and air leaks. Documenting and reporting issues is key for this industry as it deals with insurance companies and other stakeholders. How about developing an app that allows inspectors to collect data and easily report issues to building owners and insurance companies?

The 2025 Flir Hackathon App Challenge is about more than apps alone – it is about building directly into the Flir ACE platform that powers the new iXX-Series cameras (i34, i64, i35, and i65). The code runs directly on the camera, creating customized inspection workflows and tools. With built-in LTE and cloud connectivity, apps securely share thermal data and reports from the field, without Wi-Fi access.

By developing apps for Flir ACE, entrants to the Flir Hackathon App Challenge 2025 could be shaping how technicians around the world capture, analyse and act on thermal data in real time. It represents a chance to code the future of inspections by giving users a ‘sixth sense’.

Places are limited, so applicants are advised to register as soon as possible. The official deadline is 29 December 2025. Following idea submission, competition applicants can participate in the ‘Kick-off Webinar’ to learn more about the challenge and how to make their idea stand out. The opportunity also exists to team up with Flir experts and industry leaders to help develop the project.

Further details and registration are available at https://Flir.kreativdistrikt.com/

Flir is a Teledyne Technologies company, focusing on intelligent sensing solutions for industrial applications

The Pi Vision 10.1 CM5 brings the power and flexibility of the Raspberry Pi Compute Module 5 to an industrial-grade, fully enclosed HMI platform. Designed for developers, makers and OEMs ready to move from prototyping to professional deployment, it delivers the full Raspberry Pi experience — now in a rugged, production-ready form.

Built from a solid aluminium structure and featuring a 10.1-inch multi-touch display with IP66 front protection, the Pi Vision 10.1 CM5 is engineered for durability in demanding environments. Every component, from the panel-mount enclosure to the high-brightness display, has been designed for continuous industrial operation.

With native compatibility with Raspberry Pi OS and full support for Clea OS, SECO’s Yocto-based secure operating system, developers can choose between rapid prototyping on Raspberry Pi OS and enterprise-grade management with Clea OS. This flexibility makes Pi Vision 10.1 CM5 the perfect bridge between the Raspberry Pi community and industrial-scale applications.

Running Clea OS, SECO’s Yocto-based operating system, Pi Vision 10.1 CM5 provides secure fleet management, real-time data processing, and AI-at-the-edge capabilities. Clea OS enables enterprises to manage connected devices, deploy and update applications seamlessly, and provides developers with an open, ready-to-use environment to accelerate innovation.

By combining the Raspberry Pi ecosystem with SECO’s industrial reliability, the Pi Vision 10.1 CM5 enables rapid development of intelligent HMI solutions with long-term durability and broad software compatibility. Its flexibility makes it ideal for a wide range of applications, including smart building and HVAC, industrial and factory control, retail and kiosk, vending and smart appliances.

The Pi Vision 10.1 CM5 is available in two configurations — 2 GB RAM / 16 GB eMMC and 8 GB RAM / 64 GB eMMC — both included in the limited launch offer.

Early access registration is now open to secure priority availability of the first production units and the exclusive launch price: SECO: Pi Vision 10.1 CM5

www.seco.com

“Each year, our Halloween competition highlights the ingenuity of the Element14 Community. It is an opportunity for makers and engineers to share ideas, learn from one another, and celebrate their passion for electronics in a unique and engaging way,” said ,” Andreea Teodorescu, Global Director of Product Marketing & Element14 community.

This year’s challenge encourages participants to design and build projects that capture the spirit of Halloween using electronic components. Example submissions could include electronic decorations, zombie defences, automatic spooking machines, or wearable electronic costumes and props.

The competition will award prizes across multiple categories, including one first-place winner, three second-place winners, and three runner-up winners. Each winning participant will be able to select from a set of prizes.

To qualify, participants must submit a project write-up detailing their design and build process by 9 November 2025. Submissions should be made directly on the official competition page.

The competition is open to both new and long-standing community members, with a focus on creativity, effort, and knowledge-sharing.

For full details and to enter the competition, visit: https://community.element14.com/challenges-projects/halloween/b/news/posts/join-the-element14-community-2025-halloween-competition.