“Our focus has always been to evolve with our customers’ needs,” said Andy Zanelli, CEO of VCC. “The addition of sound devices brings another dimension to our HMI offering, giving engineers and manufacturers more tools to build intuitive and dependable systems.”

With this addition, VCC customers gain access to high-performance audio components that provide reliable signalling in critical applications. From industrial automation and transportation to medical equipment, IoT, and energy systems, the new portfolio is engineered to ensure clear, consistent alerts in environments where sound is essential for safety and performance.

• Magnetic Indicators: Compact and efficient options that deliver dependable tones in limited-space designs.
• Magnetic Transducers: Energy-efficient components that balance volume, tone, and power consumption.
• Piezo Indicators: Lightweight, durable, and highly reliable, designed for long service life.
• Piezo Transducers: High-output solutions with wide frequency choices to match demanding design requirements.

The new sound devices are available today through VCC’s established global distribution network, complementing its broad range of illuminated and custom HMI solutions.

https://vcclite.com

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex.

The acquisition is a strategic plan to further strengthen Molex in aerospace and defence sectors, following its acquisition of AirBorn last November.

“The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways,” said Nelligan.

Smiths Interconnect designs and manufactures innovative electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications.

Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the US, UK, Canada, Mexico, Costa Rica, France, Germany, Italy, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

www.molex.com.

The MHO900 Series integrates a wealth of functions into a compact, portable design. Additionally, the limited MHO98 Special Edition features 1GHz bandwidth and 500Mpts memory, a built-in 2-channel 100MHz AWG, and upgraded styling. The MHO98 is also bundled with a PLA2216 16-channel logic probe, a complete serial protocol decoding package (I²C, SPI, UART, CAN, LIN, etc.), and a dedicated carrying case.

The MHO900 Series is designed to handle high-speed signal challenges, and its standard 4 analog channels provide flexible support for complex system debugging. At its core is a 12-bit high-resolution ADC, delivering 16 times the detail of traditional 8-bit instruments — making even the smallest anomalies visible. Combined with an ultra-long 100/500Mpts memory depth, this ensures long-duration capture and analysis of complex signals without missing any detail.

The MHO900 series provides a powerful all-in-one time-domain workstation. With 16 digital channels provided, it allows perfect synchronization and analysis of analogue and digital signals, providing complete insight into mixed-signal systems. Additionally, an optional built-in dual-channel 50/100MHz signal generator is seamlessly integrated with the scope’s powerful Bode Plot analysis function. This makes an ideal solution for complex analysis and testing challenges such as power supply loop stability, or protocol decoding, with LAN, HDMI, and USB interfaces to address diverse embedded system debugging needs. By bringing multiple instrument functions together in one compact device, the MHO900 significantly boosts efficiency.

The MHO900 is equipped with standard Bluetooth and Wi-Fi adapters, allowing engineers full remote network access and control, enabling unattended automated testing or long-distance data monitoring, greatly improving efficiency and safety. Bluetooth connectivity expands the possibilities for peripheral devices without occupying any physical ports and eliminating cumbersome cables. This creates a cleaner and neater testing environment.

Small in size (10.5” x 6.4” x 3.0”) and light in weight (3.5lb), these oscilloscopes are available from Saelig, Rigol’s US distributor.

https://www.saelig.com.

“Enclustra is committed to pushing the boundaries of FPGA and SoM innovation. This launch strengthens our ability to deliver Edge AI solutions that empower industries to scale AI adoption efficiently,” said Philipp Baechtold, CEO of Enclustra.

The Modalix SoM provides a high-performance, energy-efficient solution that enables organisations in manufacturing, robotics, industrial automation, aerospace, and defence to integrate advanced AI capabilities faster, more reliably, and at scale.

Its benefits include seamless integration and flexibility – compact design with extensive I/O options ensures compatibility with GPU-based SoMs and existing architectures; the SiMa.ai’s ONE platform for Physical AI, including the Palette and Palette Edgematic software suites, streamlines development with Python, PyTorch, and OpenCV; and advanced thermal management and performance monitoring ensure dependable operation across industries with demanding requirements.

“The introduction of our Modalix SoM represents a critical expansion into Physical AI, addressing the diverse needs of robotics, automation, and autonomous systems. Together with Enclustra, we are removing integration barriers and making it remarkably simple for companies worldwide to upgrade from legacy systems to Modalix’s superior performance,” said Krishna Rangasayee, CEO and Founder of SiMa.ai.

Engineering samples of the MLSoC Modalix SoM are available now through Enclustra’s exclusive Early Access Program. Customers can order today.

www.enclustra.com

ETAL UK is part of Kamic Group’s Magnetic Division and will be joined at the event by other members, including AGW Electronics, Avon Magnetics, Talema, SIGA Electronics and GST. With expertise spanning numerous sectors and applications, over 1,100 employees, manufacturing operations in four countries and customers located across the world, the group is a global force in the magnetics and components market.

“As a business we have continued to grow over the past 12 months, adding new expertise to an already impressive portfolio of market-leading products.  We have six world-class manufacturing sites that all offer different capabilities, and I am excited to meet customers old and new at EDS 2025 and showcase the breadth of solutions we can offer them,” said Stefan Ruuth, Sales Manager BA at ETAL Group.

Exhibiting on stand D4, visitors will have the opportunity to explore some of the group’s portfolio of customisable magnetic components and transformers, which are tailored for multiple industries, including aerospace, automotive, defence, transport, telecommunications and medical technology.

www.etalgroup.com/

• Hardware-backed model encryption – AI model encryption key is secured by OPTIGA Trust M security solution. Each device has a unique AES 256-bit key securely stored in OPTIGA Trust M, which is used to secure the AI Model encryption key. This means that the AES key is used for encryption and decryption inside the OPTIGA Trust M only. Even if a device is lost, decommissioned, or disassembled, the manufacturer’s IP embedded in the model is still efficiently protected. At launch, this feature is enabled on the Infineon OPTIGA Trust M security solution.
• Secured model provenance – in OTA updates, the Thistle platform enables cryptographically signed, tamper-evident delivery of AI models and firmware directly from the training platform to the device, taking care that every installed instance of a model can be traced and verified.
• Signed data and data lineage – device-generated or collected data can be signed on-device and tagged with provenance metadata. This means that downstream systems which might use the data to train or refine AI models can check the provenance of the data, and of the version of the model that the device was running when it generated the data.

Thistle Technologies

www.infineon.com/OPTIGA-TRUST-M

“As a result of close collaboration on development and integration with Tobii, we have created a new generation of interior sensing technology that is reliable, user-friendly, and ready for widespread adoption across the automotive industry,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.

Tobii’s and ST’s integrated approach allows automotive OEMs to install just one camera inside the cabin, providing the most mature, efficient, and cost-effective solution available on the market.

The system combines Tobii’s attention-computing technology with STMicroelectronics’s VD1940, an advanced image sensor designed primarily for automotive applications. This sensor features a single 5.1MP hybrid pixel design, sensitive to both RGB (color in daytime) and infrared (IR at nighttime) light. Its wide-angle field of view covers the entire cabin, delivering exceptional image quality. Tobii’s algorithms process dual video streams to support both the Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS).

“Image quality is critical, and thanks to our strong collaboration with ST, we’ve achieved a unique balance that allows a single-camera solution to meet rigorous safety standards, while also unlocking enhanced user experiences. By combining visible and IR sensing, we’re enabling intelligent in-cabin environments that truly understand human presence, behaviour, and context,” said said Adrian Capata, senior vice president of Tobii Autosense.

The VD1940 image sensor is part of the SafeSense by ST, an advanced sensing technology platform designed by STMicroelectronics for DMS and OMS. which embeds functional safety and cyber security features and is dedicated to automotive safety applications. With this innovative product portfolio ST is delivering reliable, high-quality, and cost-effective solutions tailored to the automotive industry. As an Integrated Device Manufacturer (IDM), STMicroelectronics masters the complete image sensor supply chain, with full control over both design and manufacturing processes. This ensures supply security through production of its imaging solutions in its European fabs, with these devices already in mass production and ready for integration by Tier 1s and OEMs.

www.tobii.com

www.st.com

“We’ve reached a point where Simkiss Group is not only competing but leading in our sectors. Our expansion into larger premises earlier this year gave us the capacity to increase the amount of projects we can deliver, and the recruitment drive we are undertaking reflects the demand we’re seeing from clients. Growth for us isn’t just about size –  it’s about capability. We’re investing in people, in skills and in the systems that will keep us at the forefront of this industry,” said Simon Bodill, Managing Director at Simkiss Group.

As part of this momentum, Simkiss Group has completed the acquisition of Instrument Control Services (ICS) Ltd, a business with more than three decades of experience in low, medium and high-voltage systems. The addition of ICS brings expertise in panel build, testing and commissioning, preventative maintenance, cabling and jointing up to 33kV, and containerised electrical solutions. This acquisition is more than a growth move –  it positions Simkiss as a one-stop shop for complete, end-to-end solutions delivered through a single trusted partner.

“From the very beginning, our goal has been to evolve alongside our clients and offer them more of what they need, all under one roof. ICS shares that same approach, and bringing the two companies together feels like a natural fit. The combined capabilities mean our customers can expect a seamless service – from design to delivery to long-term support – with the reassurance of working with one team,” said Paul Simkiss, Chairman and Founder.

ICS will continue trading under its existing name and operating from its Stoke-on-Trent premises, ensuring continuity for its long-standing clients. At the same time, ICS’s people will become part of the wider Simkiss Group family, contributing to the culture of growth and innovation that defines the business today.

“This is an energising time for our teams,” added Bodill. “We are building something sustainable, forward-looking, and ambitious. Growth like this doesn’t happen by accident –  it comes from having talented people and a clear vision of where we’re going. The future for Simkiss Group is very bright.”

Founded in 1999 by Paul Simkiss, the business has grown steadily by supporting blue-chip clients with an ever-broadening range of services. Today, Simkiss Group operates at scale across the UK, delivering complex projects in design, manufacture, installation, commissioning and maintenance. Its growth is underpinned by a clear strategy to expand capabilities and invest in its people continually.

www.simkiss.co.uk

“The solutions that are being brought to life through our partnership with Grinn utilize AI capabilities and advanced connectivity, enabling a wide variety of benefits in the SOM and wireless module space,” said CK Wang, General Manager of the IoT Business Group at MediaTek.

The partnership with MediaTek also helps Grinn to develop innovative and effective custom embedded computing solutions for its customers, enabling it to draw directly on advanced technical support from MediaTek, early access to MediaTek product roadmaps, and privileged supply-chain support.

“The MediaTek Genio 700 makes it possible for Grinn to effectively address a diverse range of IoT applications and market segments,” said Wang.

The Grinn GenioSOM-700’s processor features dual 2.2GHz Arm Cortex-A78 cores for intensive compute workloads, six 2.0GHz Cortex-A55 cores for efficient multi-tasking, and an Arm Mali-G57 graphics processing unit (GPU) for sophisticated graphics and smooth image rendering. The MT8390 supports real-time AI operation thanks to an on-chip 4 TOPS neural processing unit (NPU).

The Grinn GenioSOM-700, which supports demanding compute and AI workloads in machine vision and audio applications, offers a combination of high-speed interfaces, image signal processing and video codecs.

This is a high-performance SOM for smart home devices, industrial automation equipment and computer vision systems which require high-throughput vision processing capability and advanced AI acceleration. The industry’s smallest SOM based on the Genio 700 processor, it is supplied in an LGA-312 format which has a footprint of just 37.0mm x 42.6mm.

Grinn also added the Grinn GenioSOM-510 based on the MediaTek Genio 510 processor, and featuring dual 2.2GHz Arm Cortex-A78 cores and four Cortex-A55 cores, this SOM also features a an on-chip NPU.

The Grinn GenioEVB gives developers a versatile evaluation platform for the Grinn GenioSOM family of modules. Featuring a wide range of headers, the Grinn GenioEVB ensures effortless integration of sensors and modules with Grinn GenioSOM products. It serves as an ideal reference for developers, streamlining the creation of schematics and PCB layouts for new product development.

The Grinn GenioSOM-700, Grinn GenioSOM-510 and Grinn GenioEVB are available to order online now from grinn-global.com.

grinn-global.com.