“Our focus has always been to evolve with our customers’ needs,” said Andy Zanelli, CEO of VCC. “The addition of sound devices brings another dimension to our HMI offering, giving engineers and manufacturers more tools to build intuitive and dependable systems.”

With this addition, VCC customers gain access to high-performance audio components that provide reliable signalling in critical applications. From industrial automation and transportation to medical equipment, IoT, and energy systems, the new portfolio is engineered to ensure clear, consistent alerts in environments where sound is essential for safety and performance.

• Magnetic Indicators: Compact and efficient options that deliver dependable tones in limited-space designs.
• Magnetic Transducers: Energy-efficient components that balance volume, tone, and power consumption.
• Piezo Indicators: Lightweight, durable, and highly reliable, designed for long service life.
• Piezo Transducers: High-output solutions with wide frequency choices to match demanding design requirements.

The new sound devices are available today through VCC’s established global distribution network, complementing its broad range of illuminated and custom HMI solutions.

https://vcclite.com

“The ACS37100 marks a critical inflection point for magnetic sensors. Our TMR technology is enabling current sensors that are ten times faster and four times lower noise versus typical Hall-based products,This leap in performance solves important challenges in high-voltage power conversion, especially related to wide bandgap solutions,” said Matt Hein, Business Line Director of Current Sensors at Allegro. “”

The new ACS37100 TMR current sensor helps power system designers master the control signal chain and unlock the full potential of fast-switching GaN and SiC FETs. Tailored to the needs of electric vehicles (xEVs), clean energy power conversion systems, and AI data centre power supplies, the ACS37100 achieves an industry-leading 50 ns response time, providing the high-fidelity data needed for optimal efficiency and protection in demanding high-frequency applications.

Migration to GaN and SiC promises greater power density and efficiency, but their faster switching speeds create significant control challenges. At sub-megahertz frequencies, conventional magnetic current sensors lack the speed and precision to provide the high-fidelity, real-time data required for stable control and protection loops. This can leave advanced systems vulnerable to damage and may prevent them from operating at their full potential.

The ACS37100 is engineered to solve this control challenge. Its industry-leading bandwidth and response time provide the high-fidelity current sense feedback essential for demanding control loops in high-speed switching applications. This magnetic current sensor enables designers to confidently and reliably control faster systems, maximise efficiency, and increase power density. Leveraging advanced TMR technology, the device delivers exceptionally low noise of 26 mA root mean square (RMS) across the full 10MHz bandwidth — enabling precise, high-speed current measurements for more accurate and responsive system performance.

The ACS37100 minimises energy loss while maximizing operational efficiency and reliability, making it the ideal choice for a variety of automotive and industrial uses like xEV charging, clean energy power conversion, and AI data centre power supplies.

The ACS37100 is available in the SOICW-16 package that supports a working reinforced isolation up to 565 V_RMS (basic 1,097 V_RMS) with 8 mm creepage and clearance. It features a voltage reference output and an adjustable overcurrent fault.

www.allegromicro.com/acs37100.

]]> https://www.electronicsworld.co.uk/new-image-sensors-from-st-aimed-at-industrial-automation-security-and-retail-applications/39771/ Mon, 20 Oct 2025 08:03:13 +0000 https://www.electronicsworld.co.uk/?p=39771 STMicroelectronics (ST) has introduced a new family of 5MP CMOS image sensors: VD1943, VB1943, VD5943, and VB5943. These advanced ST BrightSense sensors are designed to accelerate the development of innovative vision applications across industries, including advanced industrial automation with enhanced machine and robotic vision, next-generation security including biometric identification and traffic management, and smart retail applications such as inventory management and automated checkout. A longtime leader in optical sensing technology for consumer applications, ST continues to expand its offering for new applications with its industry-leading design, 3D stacking expertise and high-volume manufacturing for market-leading performance.

“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimize image capture, ensuring motion-artifact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking. This architecture is unique on market today and provides unmatched flexibility, performance, and integration. We continue to broaden our portfolio of solutions for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications,” said Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group.

The VD1943, VD5943, VB1943, and VB5943 sensors, part of the ST BrightSense portfolio, are ready for evaluation and sampling, with mass production scheduled to begin in February 2026.

The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4×4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both color and infrared imaging.

The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.

Using 2.25 µm pixel technology and advanced 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 mm by 4.46 mm, with a package size of 10.3 mm by 8.9 mm, and an industry-leading 73%-pixel array-to-die surface ratio. This compact design enables integration into space-constrained embedded vision systems without compromising performance.

“Industrial and security imaging are pushing sensor performance to new levels, enabling functions from identification to robotic guidance, gauging and advanced monitoring and inspection,” said Florian Domengie, PhD Principal Analyst Imaging at Yole Group. “By 2030, this image sensor market is projected to reach $3.9 billion with over 500 million units shipped. Key advances will include enhanced low-light performance, on-chip intelligence, and hybrid global/rolling shutter operation, combining low noise with high-precision temporal sensing.”

 www.st.com

Previously, detecting mechanical rotational motion required two ICs, each capable of sensing magnetic flux in only one direction. The S-57W1/W2, however, contains a single chip with built-in Hall elements that detect magnetic flux density in two different directions, enabling detection with just one IC. With the industry’s highest magnetic sensitivity of 0.8 mT (typ.) (*2), the IC achieves high-resolution rotational detection.

The product is available in the standard SOT-23-5 package (2.9 × 2.8 × t1.3 mm) and the HSNT-6 package (2025, 1.96 × 2.46 × t0.5 mm), which is the industry’s thinnest (*3) 2D dual hall effect latch IC package, making it suitable for space-constrained applications.

With the rise of vehicle electrification and advances in autonomous driving, the number of motors in automobiles continues to grow, components such as power windows, sunroofs, power sliding doors, and power liftgates now require smooth operation and precise positioning. The S-57W1/W2 detects the rotational speed and direction of motors driving these components with high precision, all on a single chip.

Its high sensitivity enables detection of weak magnetic flux in multi-pole ring magnets. Increasing the number of magnetic poles on a ring magnet is an effective way to improve the resolution of rotational detection. However, adding more poles reduces the volume of each magnetized section, which in turn weakens the magnetic flux density.

The S-57W1/W2 series includes a high-sensitivity version with a value of 0.8 mT typ., enabling detection of even weak magnetic flux densities. This makes it suitable for use with ring magnets featuring a high number of poles.

It has industry’s thinnest small package for low-profile motor applications. Motors must meet various size and thickness requirements depending on their application. The S-57W1/W2 is offered in the HSNT-6 (2025) package, the thinnest small package for a 2D dual hall effect latch IC. This makes it ideal for compact, low-profile motor applications with limited mounting space.

The S-57W1/W2 has a short output delay time of 8.4 µs typ., allowing it to detect rapid changes in the magnetic field. This allows reliable rotational detection for high-speed motors.

www.ablic.com/en/semicon/

St. Albans, 18^th June 2025 – Ideal for heavy duty indoor and outdoor applications, the new Flexi Mobile Safety Controller from SICK Sensor Intelligence is the ultimate solution for ensuring safety in dynamic mobile robots.

The robust, intelligent, easy-to-install solution has been designed specifically by the global sensor company to meet the needs of both indoor and outdoor automated guided vehicles (AGVs) and autonomous mobile robots (AMRs). It brings together SICK’s decades of experience in encoders and autonomous vehicle technology in a single smart device with durable aluminium housing. SICK’s Flexi Mobile delivers excellent environment perception and safe motion monitoring for AGVs/AMRs in indoor and outdoor settings to optimise the productivity and safety of automated processes even in confined spaces.

Flexible, advanced design and intuitive configuration

As demand for autonomous mobile applications and more integrated automation equipment increases, new flexible safety solutions are required. Flexi Mobile’s cabinet-free intelligent installation concept and excellent autonomous vehicle capabilities provide greater freedom and more cost-effective design, enabling quick, space-saving integration into driverless trucks for up to two axes. It is possible to safely connect sensors in series without additional wiring via rectangular multi-pin connectors on wire harnesses, supporting cost-efficient series production of mobile machines, and making adding and removing individual safety devices simple.

Flexi Mobile is programmable using a total of 512 function blocks, including TUV-certified dedicated differential drive function blocks to accelerate the development of standard-compliant AGVs and AMRs. Safe motion solutions are possible up to PLe/SIL 3, including almost all safe motion function blocks from the SICK Flexisoft controller, meeting required safety performance levels for dynamic mobile platforms. Safe kinematics increase productivity even in confined environments and Flexi Mobile facilitates omnidirectional drive concepts.

Intuitive, step-by-step configuration via SICK Safety Designer

Comprehensive, process-oriented intuitive configuration of Flexi Mobile devices can be achieved using SICK’s free-to-use, drag-and-drop Safety Designer Software. Safety Designer makes it easy to configure, document and evaluate complete safety applications across a wide range of SICK safety components with just one tool. Providing essential safety data, reports and continuous diagnostics, SICK Safety Designer reduces unplanned downtime and provides legal certainty in the form of reliable, detailed, standard-compliant safety documentation. It is even possible to virtually create applications before purchasing hardware at no cost.

Flexi Mobile is ideal for a wide range of mobile applications

The Flexi Mobile safety controller can be mounted on mobile vehicles in tough environments without a control cabinet. Its robust shock and vibration-resistant aluminium housing provides protection against environmental influences (IP66, IP67 & IP69K) ensuring excellent capabilities against dirt and ingress. The device has high passive cooling capacity and has been rigorously tested to resist high pressure, as well as surface temperatures ranging from -40C – +80 C. Flexi Mobile also has an impressive 4 m/s cycle time, is rated up to PLe/SIL3, features Modbus TCP fieldbus for diagnostics and can accommodate up to three Flexi Loop chains.

Its modular design means Flexi Mobile can be tailored to meet the needs of different autonomous mobile applications, with a variety of I/O expansion modules as well as Ethernet, Modbus TCP, SLMP, CAN and CANopen interfaces available. The new SICK safety controller is ideally suited to both indoor and outdoor off-highway autonomous vehicles (AMRs, AGVs, IMRs) and machinery, including indoor service robots, driverless trucks, service robots and transport vehicles. Key applications range from off-road, logistics and agricultural uses to material handling, mining, logistics, municipal machinery, ports, airports and construction.

Dr Martin Kidman, SICK Safety Product Manager, says, “We are excited to launch the SICK Flexi Mobile range, bringing together all the benefits of SICK’s Flexi Soft technology and our decades of experience in autonomous mobile applications. Robust, rugged and easily configured using dedicated function blocks and the unique free SICK Safety Designer tool, Flexi Mobile is capable of withstanding the rigorous demands of AMR and AGV applications whilst meeting all the relevant safety standards without the need for a control cabinet, providing easy and fast design and validation of mobile platforms.”

The GD5F1GM9 series combines the high-speed read performance of NOR Flash with the large capacity and cost-effectiveness of NAND Flash. These innovations address key industry challenges of slow response times and vulnerability to bad block interference associated with traditional SPI NAND Flash. The GD51GM9 launch will open new growth opportunities for SPI NAND Flash, making it the ideal choice for fast-boot applications in sectors such as security, industrial, and IoT.

The GD5F1GM9 series high-speed QSPI NAND Flash is built on a 24nm process node. The series supports both 3V and 1.8V operating voltages as well as high-speed read modes including Continuous Read, Cache Read, and Auto Load Next Page. Continuous Read and Auto Load Next Page modes are newer read features added on this series, offering users versatile read options to further accelerate code and data fetch. These read modes utilize the new parallel computation approach for its ECC (Error Correction Code) design, replacing the previous serial computation method. This innovation significantly reduces the calculation time for the built-in ECC.

The 3V version of the series achieves a continuous read rate of up to 83MB/s in Continuous Read mode, operating at a maximum clock frequency of 166MHz. The 1.8V version has a continuous read rate of up to 66MB/s and supports a maximum clock frequency of 133MHz. The results in GD5F1GM9’s read speeds are up to 3 times faster than traditional SPI NAND products at the same frequency. These design advantages improve data access throughput, reduce system boot time, and lower overall system power consumption.

As bad blocks from the factory are inherent issues in NAND Flash, the GD5F1GM9 incorporates an on-chip Advanced Bad Block Management (BBM) to ensure comprehensive functionality of Continuous Read mode. Continuous Read allows read access of the full memory array with a single Read command in aid of the executed BBM that link bad block addresses to good block addresses. Read access will then automatically skip the bad block due to the established link access to the remap and linked good physical block address.

From the factory, the GD5F1GM9 series guarantees the first 256 blocks are good blocks. While there will be bad blocks from the factory and possible new bad blocks may arise during usage that needs to be managed, the BBM feature can create a logical block address to the physical block address link, allowing users to swap and replace bad blocks and the associated access will be on a good block once the BBM link is setup.

The device can support up to 20 Look Up Table BBM Links to further compliment Continuous Read mode functionality. This not only significantly improves resource utilization but also simplifies system design.

“Currently, the generally slow read speed of SPI NAND Flash has become a major bottleneck in enhancing boot performance of key applications,” said Ruwei Su, GigaDevice vice president and general manager of Flash BU, “The launch of GD5F1GM9 series high-speed QSPI NAND Flash sets a new performance benchmark in the market. This series effectively addresses the read speed limitations of traditional SPI NAND Flash and offers a new solution for bad block management, making it an ideal alternative for NOR Flash users with growing capacity needs. In the future, GigaDevice will continue to refine its underlying technologies to provide customers with more efficient and reliable storage solutions.”

The GD5F1GM9 series offers 1Gb capacity with 3V/1.8V voltage options and supports WSON8 8x6mm, WSON8 6x5mm, and BGA24 (5×5 ball array) 5×5 ball package options. For detailed information and product pricing, please contact your local sales representative.

Lumissil Microsystems expanded its automotive MCU portfolio with the introduction of the IS32CS8976 and IS32CS8978 family of AEC-Q100 general purpose 8-bit MCU featuring an integrated LIN Controller and Physical Layer and Gen 3 touch key controller.

For flexibility, the IS32CS8976 and IS32CS8978 integrate 64KB ECC (Error Correction Code) flash memory that can be used to customize GPIO pins and features up to 20 Gen 3 touch sensors with auto wake and sleep modes. The IS32CS8976 and IS32CS8978 also feature onboard touch sensors that are reconfigurable from self-capacitance to mutual-capacitance mode. In mutual-capacitance mode, Shield is offered as a feature which provides dust and water immunity and offers proximity detection. Further, the integrated LIN protocol handler is compliant with SAE J2602 LIN 2.0A, LIN 2.1A and LIN 2.2A standards, ensuring seamless communication and interoperability with electrical sub-systems within vehicle’s LIN networks.

To support this claim, Lumissil submitted an MCU with LIN stack to iHR Automotive®, a third-party LIN test house for LIN 2.2 OSI Layer 2 data link layer certification. LIN conformity ensures that a LIN master can transmit 19.2kbps LDF (LIN Definition Frames) to the IS32CS8976 and IS32CS8978 and makes certain that the devices process LDF commands as a protocol handler.

To address EMI concerns, the IS32CS8976 and IS32CS8978 incorporate oscillators with spread-spectrum modulation which effectively disperses energy at the operating frequency thereby reducing EMI-related radiated noise. To further ease the design, the IS32CS8976 and IS32CS8978 were designed to utilize an easy-to-use software calibration GUI which eliminates touch calibration issues and are designed around VS Code, a popular off-the-shelf IDE.

The new IS32CS8976 and IS32CS8978 MCU’s enable command-control GPIO applications while simultaneously processing touch key functions. “Automotive engineers can achieve LIN command-control operation while processing touch sensor operations with the IS32CS8976 and IS32CS8978,” said Ven Shan, VP of Lumissil Marketing. “Both the IS32CS8976 and IS32CS8978 will facilitate the development of complex MCU applications by providing LIN command-control initiated by user interaction.”

The IS32CS8976 and IS32CS8978 feature a built-in LIN Physical Layer LDO capable of 100mA and are available in 3.3V or 5V options. For cost sensitive applications, the IS32CS8976 is available in a TSSOP-24 package offering 16kB flash ECC and 10 GPIO pins while the IS32CS8978 is available in a compact wettable flank WQFN-40 package and features large 64kB flash ECC and 20 GPIO pins. Both devices are RoHS compliant and Pb-Free available with a 2,500 unit per reel MOQ.

About Lumissil Microsystems
Lumissil Microsystems specializes in analog/mixed-signal products for automotive, Communications, industrial, and consumer markets. Lumissil’s primary products are LED drivers for low to mid-power RGB color mixing and high-power lighting applications. Other products include audio, sensors, high-speed wire communications, optical networking, and application specific microcontrollers. Lumissil Microsystems has worldwide offices in the US, Taiwan, Japan, Singapore, mainland China, Europe, Hong Kong, India, Israel, and Korea.  

Website: https://www.lumissil.com

BGF, the UK and Ireland’s most active growth capital investor, led the round with funding from existing backers including Octopus Ventures, Northern Gritstone, and Foresight.

The funding will accelerate Phlux’s expansion into optical communications and sensing industries by leveraging its world-first antimonide-based semiconductor technology to deliver faster, more energy-efficient sensor and connectivity systems.

Building on its world-leading research from the University of Sheffield, Phlux will use the investment to scale its team, ramp up production, and launch two new product ranges targeting optical communications and sensing systems.

Phlux’s ultra-low-noise infrared sensors are set to dramatically improve the performance of communications systems to enable up to 5x higher data rates for free-space and fibre-optic communication systems, enhancing global connectivity. Early engineering samples have shown sensitivity improvements of 5dB or more are realisable, compared to current commercial devices. Additionally, Phlux’s infrared sensors will play a crucial role in advanced sensing technologies that include driver-assisted safety features in vehicles, industrial automation, defence and security, and high-precision gas sensing.

Scaling to Meet Global Demand

Since its £4 million seed funding round led by Octopus Ventures in 2022, the company has built a global, fabless supply chain to address high volume markets and already serves customers in Asia, Europe and North America. Phlux has ambitions to become the world leader in infrared sensing and with this new funding, will expand its engineering and commercial teams, ramp up production, and accelerate the commercial launch of its new product lines. The company will also deepen partnerships with leading industry players, ensuring widespread adoption of its technology in global communication networks.

Commenting on how the new funds will be used, Phlux CEO, Ben White, said, “This funding comes at a pivotal moment as demand for high-speed optical communication systems is growing enormously. By developing world-class, high-performance infrared sensors, we are enabling industries to push the boundaries of connectivity, efficiency, and security by removing a technology bottleneck that has persisted for over 20 years.”

Luke Rajah, Partner at BGF, said, “Phlux has developed a game-changing technology in a sector that’s long overdue for disruption. With strong academic roots, early commercial traction, and a compelling roadmap, the team is well-positioned to lead in infrared sensing. Backed by BGF’s deep tech investment experience, we’re excited to support Phlux in scaling globally across the sensing and telecommunications markets.”

Owen Metters, Investor at Octopus Ventures, said, “When we first invested in Phlux, we were impressed with both the team’s expertise in developing novel semiconductor materials, and their ambition to revolutionise infrared sensing. We’ve been delighted with their progress to date and are excited to see this funding deployed to grow the team and bring two exciting new product ranges to market.”

For Northern Gritstone, CEO, Duncan Johnson added, “Infrared sensors are advancing many critical everyday areas such as providing internet access to people’s homes and aiding advanced safety and mobility. Phlux is a fantastic example of semiconductor innovation in the North of England and Northern Gritstone is proud to continue supporting the Phlux team under Ben White’s leadership.”

element14, an Avnet Community, in partnership with TDK, has launched a new design challenge, inviting engineers, makers and technology enthusiasts to develop innovative projects utilizing TDK’s waterproof ultrasonic range sensors in real-world applications.

Participants will integrate TDK USSM Plus-FS sensors into a functional project that demonstrates the versatility and accuracy of ultrasonic distance sensing technology. Selected applicants will receive an evaluation kit from TDK, which includes two TDK USSM Plus-FS ultrasonic range sensors, a TDK evaluation board, and a set of sensor connector cables.

Participants are encouraged to explore a range of potential applications for ultrasonic sensing technology, such as object detection, industrial control sensing, human-robot interaction, movement boundary control, conveyor belt monitoring, smart delivery robots, autonomous lawnmowers, and liquid level sensing.

Andreea Teodorescu, Global Director of Product Marketing & element14 Community, stated, “This design challenge provides our community with the opportunity to explore the power of ultrasonic sensing technology with hands-on experience in real-world applications.”

Applications are open till 28 March. Once selected, participants have until 16 June to build their projects. Challengers must post their progress including the final project and at least five blog posts before the closing date. Posts that include photos, videos and code samples will be judged more favorably.

The grand prize winner will receive an Apple iPad Pro 11-inch (4^th gen) 128GB and an iRobot Roomba self-emptying robot vacuum cleaner, the runner-up will receive an iPad Mini 10.9 inch 64GB and an iRobot Roomba self-emptying robot vacuum cleaner, and other finishers of the challenge (anyone who completes five blogs and a project with the featured product) will receive a MultiComp Pro Multimeter Set.

For more information on the design challenge and to register, please visit: https://community.element14.com/challenges-projects/design-challenges/in-reach-ultrasonic-sensor-sensing-challenge.

Background Suppression Diffuse sensing to detect portions of cheese as they approach a packaging station. The high-speed packaging machines, use in-line buffering stations to regulate the movement of the cheese portions so that it arrives at the packaging machine at the perfect time to optimise the packaging machine’s throughput.

CUSTOMER APPLICATION

To increase the capacity of a packaging line for individually packaged cheese portions, robust reliable detection was required to detect the presence of each cheese portion to control the speed of in-line buffering units. These feed a packaging machine, in a high-volume, hygienic production facility.

Once cut to size, cheese portions travel on a food-grade conveyor to a packaging station; the duration of the packaging cycle is dependent on the type of cheese and the portion size.

Prior to end-of-line packaging, a buffering station is used to produce a regular flow of portions with a predetermined spacing to optimise the packaging machine’s throughput. The two operations must be synchronized, so the manufacturer requires a sensor system that detects the presence of each cheese portion as it leaves the buffering station, triggering the packaging cycle.

Detection sensitivity parameters for each portion type and size are sent to the sensor for each production batch using IO-Link. This remote configuration eliminates the requirement to sanitise the sensor after a manual adjustment of the sensor.

Sensors must be food-grade certified and withstand the aggressive cleaning agents used during washdown routines. They must also accommodate the full range of portion sizes without the need for manual adjustment to minimise the changeover time between product batches.

CUSTOMER SOLUTION

Diffuse-mode photoelectric sensors with Background Suppression from Contrinex’s C23PA family of sensors where selected as being ideal for this application. The tiny cubic sensors are mounted above product conveyors immediately before a buffering station to detect the presence of cheese portions as they pass underneath. The Background Suppression feature enables the sensor to measure the distance to the fast-moving conveyor and ignore or suppress it so that the sensor is not falsely triggered by movements in the conveyor, for example, if it jumps upwards slightly.

Mounting the sensors was simplified, and savings were made by using Contrinex’s range of stainless steel mounting brackets specially designed for this family of sensors. The sensor’s industry-standard PNP normally-open output and M8 connector made installation and integration easy.

IO-Link the standardised point-to-point serial connection protocol for sensors and actuators, which is enabled on PNP versions at no additional cost, provides the advantages of digital communication without the need for special cabling. A second output provides a stability alarm in the event of reduced sensitivity, flagging the need for preventative maintenance before any performance degradation occurs.

The small (20mm x 30mm x 10mm) robust sensors provide reliable operation in the demanding washdown environment. They are rated to IP67 and Ecolab-certified. An operating range between 15mm and 250mm, adjustable via a teach button or via IO-Link, accommodates the range of portion sizes without compromise.

A brief one- or two-step teach procedure simplifies the initial set-up of the sensor. If a new portion size is introduced, process engineers can teach the target object and, optionally, the background. Once taught, sensitivity parameters are stored on the sensor’s inbuilt memory and may be retrieved or updated remotely via IO-Link, eliminating the need for manual adjustment.

The C23PA family of sensors covers all sensing technologies including a choice of both visible and UV-based transparent-object-detection.

The C23PA family of photoelectric sensors, offers 5 sensing technologies, being Background Suppression, Diffuse, Reflex, and Through-beam, plus Transparent Object Detection using either conventional visible-light or uniquely, Ultra-violet illumination.

The sensors are available with choices of PNP/NPN, Light-on/Dark-on, Cable or Socket, and can be adjusted using a teach button or IO-Link. They exceeded the customer’s need for reliable operation with little or no manual intervention and so were highly cost-effective. The choice of 4 different low-cost stainless-steel mounting and protection brackets simplifies installations, which can create significant cost savings.

A range of low-cost stainless-steel mounting and protection bracketry designed for the C23PA family of sensors, speeds up their installation.

Contrinex sensors and more information are available from PLUS Automation Ltd, whose aim is to help you “make sense of sensors”. www.PLUSAutomation.co.uk

Eyesential SW provides leading-edge performance in sensitivity, low noise and ease-of-use for machine vision, scientific imaging and spectroscopy, where delivering affordability is key
 
Lynred will showcase Eyesential SW, 640×512, 10 µm pitch shortwave infrared (SWIR) imaging sensor at SPIE Photonics West, San Francisco (CA), January 28 – 30, booth #5029
 
Grenoble, France, January 21, 2025 – Lynred, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets, today announces the launch of Eyesential SW, its latest VGA format shortwave (SWIR) infrared sensor for machine vision. It is designed to offer the ideal cost-performance ratio for visible-like imaging to address specific performance needs in machine vision. Eyesential SW has the performance and features that industry is looking for at half the price of comparable IR sensors on the market. It also includes specific functions for spectroscopy applications, such as spectral line selection/deselection.
 
Featuring a high-frame rate (300Hz full frame / 1200 Hz ¼ full frame), leading-edge performance in sensitivity and low noise, Eyesential SW is suited to the automation and data exchange trends in industry 4.0 manufacturing, which require enhanced detection capabilities and improved real-time detection on production lines.
 
“Lynred’s latest innovation, Eyesential SW, strikes the right balance between performance and cost for machine vision, making it a top choice for shortwave infrared sensors on the market. This SWIR sensor puts an end to the dilemma of equipment makers having to compromise on performance or price,” said Pierre Jenouvrier, cooled product division director at Lynred. “The integrity of our InGaAs technology, underpinning Eyesential SW and focusing on affordability, will give customers a new level of cost-effective VGA format SWIR sensors which better address machine vision market demands.”
 
Through Eyesential SW, a 640×512, 10 µm pitch, SWIR (0.9-1.7µm) sensor with 14-bit digital output and COTS (Commercial-Off-The-Shelf) packaging, Lynred aims to bolster Europe’s supply chain in SWIR sensors as well as strengthen its global offering in the machine vision market. This new sensor complements Lynred’s SWIR product portfolio, which includes Snake SW (640×512 / 15 µm), dedicated to high-end machine vision applications, and its recently acquired NIT SWIR modules.
 
Machine vision, scientific imaging and spectroscopy
SWIR wavelengths are able to pass through many solid materials, including silicon. Distinguishing materials and detecting humidity make them ideal for on-line industrial inspection and non-destructive control. Due to these key characteristics, Eyesential SW has many industrial applications, for example, recycling operations to sort different types of plastics at high speed. Due to its sensitivity, high-frame rate and capacity to select/deselect spectral lines, the SWIR sensor is also well suited to infrared spectroscopy, an application for identifying and quantifying almost any chemical species and for scientific imaging.
 
In the kit Lynred offers to operate Eyesential SW are an electronic board, including mechanical and optical interfaces (C-Mount), and the Lynred Software Toolbox. 
 
Eyesential SW will be on display at SPIE Photonics West on booth #5029, taking place in San Francisco (CA), January 28 – 30, 2025.

MANCHESTER, NH – January 15, 2025 – Allegro MicroSystems, Inc. (“Allegro”) (Nasdaq: ALGM), a global leader in power and sensing solutions for motion control and energy-efficient systems, today announced the launch of two new current sensor ICs – the ACS37030MY and the ACS37220MZ.

Leveraging Allegro’s cutting-edge sensing technology, these ICs provide low internal conductor resistance, high operating bandwidth and reliable performance across a wide range of automotive, industrial and consumer applications. 

“We’re excited to introduce our latest current sensor ICs, as Allegro continues to push the boundaries of sensor IC technology,” said Ram Sathappan, Vice President of Global Marketing and Applications at Allegro MicroSystems. “Our newest sensors establish new standards for precision and reliability, empowering customers to overcome design and efficiency standards, while also demonstrating how our technology is driving a smarter, more efficient future.” 

Allegro’s new current sensor ICs are designed for precise current sensing in a compact and durable package. Featuring a widebody design, the ACS37030MY and ACS37220MZ deliver higher isolation in a 40 per cent smaller footprint compared to the existing 16-pin packages on the market. The new innovative designs also incorporate lower resistance, which helps to reduce power dissipation. 

The ACS37030MY is a fully integrated current sensor IC with industry’s fastest response time for protection of wide bandgap GaN devices. It uses a combination of Hall-effect and inductive coil signal paths to sense current over a wide frequency range. This innovative package offering enables a product which is both 5x faster than existing solutions, but also 40 per cent smaller. ACS37030 is also available in a narrow-body package for lower isolation requirements. 

The ACS37220MZ fully-integrated, Hall-effect current sensor features a 150 kHz bandwidth and fault pin. This device is designed for value-line current sensing applications as a successor to the popular ACS724/5 family of products. The new package of the ACS37220MZ offers a 40 per cent smaller solution size and lower resistance for lower power dissipation.    

To learn more about Allegro MicroSystems latest current sensor ICs, visit  ACS37030MY and ACS37220MZ.