Among the key enhancements are:

PulsonixSim – Fully Integrated ngspice-based Simulator
Pulsonix 14 introduces PulsonixSim, the new simulation option is built on the ngspice engine and tightly integrated into the Pulsonix schematic environment. It allows designers to attach models, place stimuli and run mixed-mode SPICE analysis, including transient, AC, DC, Monte Carlo, noise, transfer functions, and more – all without leaving the design environment and utilising the same library used for design and PCB layout. Simulation results can be plotted to full screen graph windows or local ‘in-design’ graphs.

3D Flexi Bend & Clipping Plane Enhancements
A new “lift-off” state for Flexi bend regions allows the flexible portion of the board to originate inside existing boundaries rather than exiting the board edge. The bend region transforms adaptively based on bend-radius parameters.

Additionally, a 3D clipping plane feature lets users selectively hide parts of the design along X, Y or Z axes (and reverse clipping direction) to inspect internal layers or buried elements more effectively.

Interactive HTML BOM & Graphical Comparison Tools
Pulsonix 14.0 supports the Interactive HTML BOM option that exports design and BOM data into a searchable, browser-friendly HTML format.

The Symbol / Footprint Compare and Design Revision Analyser tools highlight differences between design versions or symbols, either in dialog view or using overlaid graphics with dimming/lowlighting.

Usability Upgrades & Window Workflow
The user interface sees multiple enhancements: tear-off windows, dock bars, “find in dialog grids,” and faster category switching to streamline navigation and reduce friction when working with large designs or complex dialogs.

Circular Hatching Style
Pulsonix 14 adds a circular hatching style alongside traditional linear hatching. Circular hatching reduces sharp corner effects during etching, which helps minimise impedance variation for tracks adjacent to hatched copper zones

Major Update to Scripting and Automation
Version 14.0 replaces the legacy ActiveX automation system with a completely re-engineered, modern scripting framework developed in-house by Pulsonix. The new scripting environment provides greater flexibility, improved security, faster execution, and direct access to more Pulsonix objects and functions. Users can now automate complex design operations, customise workflows, and build bespoke productivity tools using industry-standard scripting languages.

Vault Integration & Version Control Enhancements
Vault improvements in Version 14 include visual thumbnail previews of items, “synchronise selected items” folder path alignment, definable permissions, Spice Model and Formal files in Vault and type-specific revision naming schemes – helping design teams maintain data integrity and traceability.

Pulsonix Version 14.0 is available now. Learn more about the new features and enhancements, by visiting www.pulsonix.com/latestversion

Researchers at UC Irvine have recently developed a method to produce ultra-thin bismuth crystals using a process akin to a tortilla press. These crystals, which exhibit important quantum oscillations, hold the potential to revolutionize the manufacturing of affordable, flexible electronics and quantum devices, making cost-effective flexible electronics an everyday reality.

GlobalData’s proprietary technology innovation intelligence tool “Technology Foresights” indicates a consistent increase in the number of patents associated with flexible electronic circuits over the years, totaling 2,882 between 2015 and 2023. The addition of 13 new companies in 2022 and 11 in 2023 to the patent landscape, demonstrates a growing emphasis on innovation with patents distributed across leading themes such as climate change, emissions reduction, and renewable energy.

Rahul Kumar Singh, Senior Analyst of Disruptive Tech at GlobalData, comments: “Flexible circuits enable new features and functionalities in electronic devices by conforming to the unconventional shapes and integrating with different components. A significant rise in patents related to climate change and emissions reduction highlights how these circuits are being leveraged to create more sustainable technologies. Moreover, innovations in printed circuit manufacturing, which account for more than 40% of flexible electronic circuit patents, are enabling more efficient production processes that reduce waste and energy consumption.”

An analysis of GlobalData’s Disruptor Intelligence Center highlights the recent innovations, notable partnerships, and strategic funding driving the sustainable manufacturing of flexible electronic circuits. For example, in April 2024, US-based ENNOVI introduced a sustainable method for producing flexible circuits in EV battery cell contact systems, aligning with the industry’s sustainability focus.

UK-based Smartkem collaborated with FlexiIC in February 2024 to streamline flexible circuit design and production using open-source EDA tools, enhancing rapid and low-cost production for new applications in sensors and IoT.

In the same month, US-based NextFlex secured $6.49 million in funding for seven projects under Project Call 8.0 to advance sustainability in flexible hybrid electronics manufacturing.

UK-based Pragmatic Semiconductor raised $231 million in Series D funding in December 2023 to expand flexible IC production for smart packaging and wearables, reflecting growing investment in flexible electronic circuits.

Singh concludes: “While the progress in flexible electronic circuits is excellent, challenges associated with scalability persist. Ensuring that these circuits can be produced at scale without compromising quality or increasing costs is crucial. Moreover, integrating flexible circuits into the existing manufacturing processes and ensuring their durability under various conditions is key. However, the continuous rise in patent activity and strategic investments suggest a bright future for flexible electronics.”

It’s near impossible to avoid PCBs’ exposure to contaminants during their fabrication, transport and storage processes. Yet, dust, oils, flux residue and uncured solder pastes can lead to poor solder joints, bridging, dendrite growth, incomplete conformal coating adhesion and other issues, resulting in PCB failure.

Vapour degreasing

With increased complexity and miniaturisation, PCBs have become more difficult to access and clean properly, and cleaning PCBs in avionics is an even more challenging task due to their intricate designs and often tightly-packed components. Hence, developing effective cleaning procedures that reliably remove contaminants without damaging delicate components is crucial.

One cleaning method that has emerged as highly efficient for avionic PCBs is vapour degreasing. This process involves immersing the PCBs in a cleaning fluid within a vapour degreaser machine. The fluid is continuously filtered and distilled inside the vapour degreaser to dissolve or lift contaminants from the PCB’s surface. In some instances, ultrasonic agitation is added for additional cleaning power.

After being lifted from within the cleaning fluid, PCBs undergo vapour rinse and drying. The cleaning fluid condenses and drips back into the vapour degreaser for re-use. The vapour degreaser recycles and re-uses the cleaning fluid hundreds of times before it needs to be refreshed or replaced. This helps reduce the cost of hazardous waste removal.

After a typical cleaning cycle of up to 20 minutes, the PCBs come out clean, rinsed, dried and ready for conformal coating, assembly and packaging.

Vapour degreasing is fast, efficient, offers high throughput, and engineers can easily integrate it into standard production lines. However, its effectiveness relies heavily on the choice of appropriate cleaning fluid. Most modern cleaning fluids are a mixture of compounds that can include hydrocarbons like mineral spirits, isopropanol and ethanol. The vapour degreaser can use just one type of cleaning fluid, or fluid suppliers can mix and blend custom formulas to remove a specific soil from a specific substrate, maximising cleaning effectiveness.

Fluid characteristics

There are several important characteristics to consider when choosing the right vapour degreasing cleaning fluid. Non-flammable cleaning fluids are highly recommended, as they ensure safer handling and storage and don’t need fire or explosion-proof equipment. Most vapour degreasers are designed to work seamlessly with non-flammable cleaning fluids.

Opting for low-boiling cleaning fluids is advantageous in terms of energy efficiency and safety. Cleaning fluids with a boiling point below 100°C can still clean PCBs effectively whilst enabling the vapour degreaser to be more energy efficient. Moreover, using lower boiling temperatures allows for the safe cleaning of delicate PCB components without risking damage.

The cleaning fluid’s surface tension and viscosity are other critical characteristics. Low surface tension and viscosity ensure the entire PCB surface is entirely wetted and can penetrate all tight spaces, including under low-mounted components.

High density cleaning fluids are particularly beneficial when dealing with particulates like dust, dirt or cloth fibres that can’t be dissolved. High density fluids are typically 20-30% heavier than water and 50% heavier than alcohol and can easily move particulates off the PCB surface.

The solvency or strength of the cleaning fluid is also a crucial consideration. Cleaning fluid strengths are often indicated by a Kb value, which ranges from mild to strong. Kb (Kari-Butanol) refers to a standardised ASTM test that measures the relative strength of a non-aqueous cleaning fluid. It is important to choose a cleaning fluid with a high enough Kb value and solubility parameter, to effectively dissolve and remove contaminants without causing damage to the PCB substrate.

Maintenance-free cleaning fluids are also desirable. Many modern-day vapour degreasing fluids remain stable, eliminating the need for acid acceptance testing, lab analysis or other maintenance. This ensures a hassle-free cleaning process and reduces the time and effort required for maintenance tasks.

Lastly, environmental stability should also be a key consideration. Newer formulations of vapour degreasing fluids offer excellent performance whilst addressing environmental concerns. These fluids have low ‘global warming potential’, reducing the impact on greenhouse gas emissions, and low ‘ozone depleting potential’ content to comply with strict regional air quality regulations. Choosing environmentally-sustainable cleaning fluids contributes to maintaining a cleaner and safer environment.

By Elizabeth Norwood, Senior Chemist, MicroCare

Omron’s G9KA high-power relay series guarantees a mechanical lifetime of 100,000 operations. The ultra-low contact resistance of 0.2mOhm maximum minimises contact terminal heating allowing it to carry high current loads. The plunger-type relay structure provides high endurance and lower power consumption, whilst well-designed terminals improve heat dissipation, further enhancing safety and longevity.

Applications include grid-tie inverters and uninterruptible power supplies. The G9KA series can be applied to inverters for photovoltaic and energy storage systems. Specifically, the G9KA-E is suitable for use in 200-400kVA/600-800VAC inverters. Omron’s G9KA-E AC PCB relay is also ideal for UPS input and output lines, providing disconnect from the grid and the load. A particular advantage here is G9KA-E’s suitability for power supplies that incorporate 100-200kVA, 3-phase 400VAC input/output circuits.

Replacing conventional contactors in all applications, these new PCB high-power relays reduce system weight and size whilst enabling simpler manual or automated assembly.

The manufacturing process is growing complex with shrinking board sizes, tiny and fragile components, multilayer stack up, and high component density. Also, there is an increased chance of failures, wastages, and other assembly issues which can significantly delay the PCB production timelines. PCB manufacturers have to adopt advanced production techniques to stay ahead of the competition. Automation of the entire PCB assembly process will improve the production output and also reduces the overall manufacturing cost.
Impact of AI and Robotics in PCB manufacturing:

Automated Robots can be deployed in all the stages of the PCB production cycle like material handling, component creation, pick and place, inspection, testing, packing, etc. In short, AI and Robotics together can almost provide you with Turnkey PCB Assembly solution. This will considerably reduce the labor cost, wastages, and assembly faults. AI-based Robots are inherently precise and faster in operation which enables PCB manufacturers to optimize the entire production supply chain.

Modern circuits are more complicated with the introduction of surface mount technology. Finding faults among thousands of solder joints is not feasible using manual inspection methods. But machine vision systems are better equipped with deep learning to understand the distance and depth of the objects. This has resulted in obtaining accurate images for PCB testing using the Automated Optical Inspection (AOI) method which helps in detecting faults during the early stages of the production process.

AI-based robots can quickly learn and collect data during assembly operations. The enormous data collected is stored in the cloud which can be further used by other AI-based robots to self-learn. This saves a lot of time in training the robots and also ensures consistent quality. The flexibility and lightweight nature of the robots make it easier to deploy them in various applications without much change in the layout of the production line. This saves both space and setup time during PCB assembly.

Merits of using Robotics and AI in PCB Production:

• Quicker Material Management
Material supervision is efficient when the stocks are traceable and quickly available. Industrial Robots can speed up the process of uploading and downloading the PCB components and materials. While shifting the components, automated guided vehicles can reduce possible errors due to ambiguity. The overall productivity and usage of assembly equipment increase by swift material handling by the automated robots. Also, using robots during material movement can minimize the possible Electrostatic Discharge (ESD) damage to the components.

• Improved Product Quality
Robots and automated machines use AI-based sensors to perform different PCB assembly tasks with great accuracy. The sensors can easily adapt to the varying environmental condition and correct any error in the initial stages itself. The programmable vision systems can maximize the assembly line efficiency and overall product quality.

• Increased Shop Floor Flexibility
AI Robots depend on high-precision cameras during pick and placement to confirm the physical features of the components. The lightweight and adaptability of the robotic arms, along with the precise vision equipment support adequate pressure application on the components. This increased flexibility ensures that no layout change is required for different assembly applications and reduces setup time.

• Consistent Inspection Support
The deployment of industrial robots can be the best solution to achieve reliable inspection support during the PCB assembly. Unlike manual inspection, Robots can perform repetitive tasks without any error or break. Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) are the commonly used automated inspection methods. Robots with arm-mounted cameras ensure the correct component orientation and soldering.

• Safe Test Environment
Automatic test support like robotic flying probes can approve the circuit functionality by verifying the connections. Robotic arms attached with IR cameras can assess powered PCBs for any hotspots and other thermal issues. Robotic testing can access constricted test points and reduce the hazards of electrical shock or burns which can be detrimental in manual testing.

• Higher Sustainability
Robots are used to desolder electronic components from discarded PCBs for recycling purposes. Image recognition software assists the robots to locate the components to be retrieved from the scrap boards. Upcycled components can support the PCB manufacturing industry to be more environment-friendly.

AI-based Robotics can reduce process bottlenecks and greatly optimize the PCB production process. They are flexible and can handle complex tasks with precision. Robotics with AI are revolutionising the PCB manufacturing industry by handling a wide range of tasks swiftly and more competently.

The introduction of AI in the automation process can assist PCB manufacturers in producing highly complicated circuit boards, compliant with industry standards. Robots are now affordable and can be used by contract manufacturers to build smart factories for more output and less wastage.

Industry 4.0 in PCB Manufacturing:

Industry 4.0 refers to the digitization of the manufacturing industry with the application of robotics, AI, IoT, and data aggregation. This will drive the production of electronic products with improved performance and reduced costs. In PCB manufacturing, it provides the ability to track PCB defects using the collected data and also brings increased process visibility. Following are some of the advantages of incorporating Industry 4.0 standards in PCB manufacturing:
 Enhanced performance
 Better quality control
 Seamless supply chain management
 Effective product maintenance
 Reduced scrap rate

It is necessary to choose the right CM while building PCBs as per Industry 4.0 standards. Adhering to an effective PCB development process, procuring reliable components from approved vendors, following necessary guidelines all through the development process, and ensuring that the CM employs the best quality control measures are the necessary steps to manufacture Industry 4.0 compliant PCBs. Robotics and AI together optimize the operations and accumulate huge data from every sensor and machine used in the PCB manufacturing process. The analyzed data can help in decision-making and error corrections leading to a high-yield PCB production. Though complete automation involves many technical challenges, CMs have started incorporating discrete systems at key production points to earn the benefits of AI-enabled Robots in PCB workshops.

By Ken Ghadia, Sales Engineer, Technotronix