“For over 25 years, we have been producing world-recognized timing receivers, serving critical applications and major industry players. With our next-generation technology, we are now bringing precise and resilient time in an ultra-compact form factor to high-volume applications,” explained Yasmine Hunter, Product Manager at Septentrio.

The mosaic-G5 T module receives signals on multiple frequencies from all available GNSS satellite constellations, achieving high precision even in challenging environments, such as in areas with radio interference. It enables precise, high-resolution timing through two independent and reliable pulse-per-second (PPS)  pulses and has clock and frequency input support for seamless synchronization. The mosaic-G5 T is ready to support Galileo High Accuracy Service (HAS)  and is built to stay agnostic towards other correction services that enhance timing accuracy.

www.hexagon.com

The TeleCANesis lean middleware platform lets developers address trends in sectors such as healthcare, smart industry, communications, and e-mobility. Embedded devices in these industries now typically demand complex distributed systems comprising multi-channel sensing, edge computing, gateways, and cloud services. Connecting the domains to capture, process, store, and analyze data, and communicate with actuators and HMIs, involves more than mere protocol translation to handle the different data formats, timing requirements, security, safety, and other issues. Conventional approaches call for intimate engagement with the different communication standards and even a simple application can involve writing tens of thousands of lines of code, which can add several months to a project. TeleCANesis now offers an alternative.

“The TeleCANesis framework builds on our own experience in embedded projects, tackling the same connectivity issues and facing the same coding challenges again and again,” said Jonathan Hacker, TeleCANesis Founder and CTO. “Developers facing these issues can now get to market faster and cut their development costs by up to 70 percent with TeleCANesis’ tools and support. Embedded World visitors can find out how by coming to our booth, 2062, any time during the show or, better still, arranging an appointment in advance.”

The event will feature live demonstrations of TeleCANesis running on the NXP i.MX 95 using QNX and DiSTI GL Studio, as well as on a Toradex i.MX 8 Yavia board using Linux and Slint. Additionally, an Ottawa Infotainment DragonFire Pro buck will be showcased, leveraging Crank Storyboard for its HMI capabilities, and TeleCANesis for connectivity.

With TeleCANesis, developers can design robust distributed systems and use automated code generation to bring them up quickly. Its powerful runtime core abstracts the complexity of connectivity, simplifying system integration. TeleCANesis supports a wide range of hardware buses, including—CAN, GPIO, and Modbus—and protocols like MQTT, ZeroMQ, and REST, with flexible data formats (JSON, BSON, CAN, RAW, and more). It also integrates seamlessly with HMI environments such as Crank Storyboard, DiSTI GL Studio, Slint, and Unity.

https://telecanesis.com/

Developers with ideas on how to revolutionise industries with new thermography apps can win up to $5,000 in cash, as well as Flir thermal cameras.

The global call is out for developers to create innovative Android apps using the Flir ACE SDK (Software Development Kit). Flir’s Hackathon App Challenge is an opportunity to harness thermal imaging for real-world impact, presenting coders, engineers, and creative thinkers with a chance to win big while overcoming genuine industry challenges. The idea is to build game-changing apps for sectors that include industrial condition monitoring, building diagnostics, or indeed any kind of ‘wildcard’ application the imagination conjures.

For industrial condition monitoring, innovative apps are required that facilitate the use of thermal imaging to keep power flowing and machines running – negating downtime that can cost thousands of dollars every minute. With a well-executed condition monitoring program, inspectors are able to locate and diagnose early failure signs in machines or electrical systems, prompting targeted and efficient rectification. An app idea here might include collecting and annotating the temperature of electrical components, and suggesting actions based on trends.

For building diagnostics and energy efficiency, apps can help maintain the health of a facility. Inspectors use thermal cameras to detect issues such as missing or defective insulation, moisture build-up, water infiltration, inefficient HVAC systems, and air leaks. Documenting and reporting issues is key for this industry as it deals with insurance companies and other stakeholders. How about developing an app that allows inspectors to collect data and easily report issues to building owners and insurance companies?

The 2025 Flir Hackathon App Challenge is about more than apps alone – it is about building directly into the Flir ACE platform that powers the new iXX-Series cameras (i34, i64, i35, and i65). The code runs directly on the camera, creating customized inspection workflows and tools. With built-in LTE and cloud connectivity, apps securely share thermal data and reports from the field, without Wi-Fi access.

By developing apps for Flir ACE, entrants to the Flir Hackathon App Challenge 2025 could be shaping how technicians around the world capture, analyse and act on thermal data in real time. It represents a chance to code the future of inspections by giving users a ‘sixth sense’.

Places are limited, so applicants are advised to register as soon as possible. The official deadline is 29 December 2025. Following idea submission, competition applicants can participate in the ‘Kick-off Webinar’ to learn more about the challenge and how to make their idea stand out. The opportunity also exists to team up with Flir experts and industry leaders to help develop the project.

Further details and registration are available at https://Flir.kreativdistrikt.com/

Flir is a Teledyne Technologies company, focusing on intelligent sensing solutions for industrial applications

“Each year, our Halloween competition highlights the ingenuity of the Element14 Community. It is an opportunity for makers and engineers to share ideas, learn from one another, and celebrate their passion for electronics in a unique and engaging way,” said ,” Andreea Teodorescu, Global Director of Product Marketing & Element14 community.

This year’s challenge encourages participants to design and build projects that capture the spirit of Halloween using electronic components. Example submissions could include electronic decorations, zombie defences, automatic spooking machines, or wearable electronic costumes and props.

The competition will award prizes across multiple categories, including one first-place winner, three second-place winners, and three runner-up winners. Each winning participant will be able to select from a set of prizes.

To qualify, participants must submit a project write-up detailing their design and build process by 9 November 2025. Submissions should be made directly on the official competition page.

The competition is open to both new and long-standing community members, with a focus on creativity, effort, and knowledge-sharing.

For full details and to enter the competition, visit: https://community.element14.com/challenges-projects/halloween/b/news/posts/join-the-element14-community-2025-halloween-competition.

ETAL UK is part of Kamic Group’s Magnetic Division and will be joined at the event by other members, including AGW Electronics, Avon Magnetics, Talema, SIGA Electronics and GST. With expertise spanning numerous sectors and applications, over 1,100 employees, manufacturing operations in four countries and customers located across the world, the group is a global force in the magnetics and components market.

“As a business we have continued to grow over the past 12 months, adding new expertise to an already impressive portfolio of market-leading products.  We have six world-class manufacturing sites that all offer different capabilities, and I am excited to meet customers old and new at EDS 2025 and showcase the breadth of solutions we can offer them,” said Stefan Ruuth, Sales Manager BA at ETAL Group.

Exhibiting on stand D4, visitors will have the opportunity to explore some of the group’s portfolio of customisable magnetic components and transformers, which are tailored for multiple industries, including aerospace, automotive, defence, transport, telecommunications and medical technology.

www.etalgroup.com/

With the rapid rise of AI clusters, cloud computing, and next-generation telecom networks, the demand for precise, reliable cooling has never been greater. Tark Thermal Solutions will showcase new thermoelectric designs that enable optical transceivers and high-performance imaging systems to operate at peak stability and efficiency.

“With the surge in power density across optoelectronic systems, thermal management is now a critical enabler of innovation. At ECOC, we’ll demonstrate how our advanced thermoelectric coolers help customers push the limits of speed, precision, and reliability in AI, cloud, and telecom applications.” – Andrew Dereka, Thermoelectrics Product Director, Tark Thermal Solutions.

Tark Thermal Solutions on Stand C1402
More than a simple product showcase, Tark Thermal Solutions will present targeted solutions for key application areas:

– AI clusters & optical transceivers: OptoTECTM MBX Series micro thermoelectric coolers, designed for temperature stabilization of EML and coherent lasers in high-density computing
– High-end imaging & sensing: OptoTECTM MSX Series micro multistage thermoelectric coolers for deep cooling of high-performance image sensors.
– High-temperature environments (up to 150 °C): Hi-Temp ETX Series thermoelectric coolers for autonomous systems, machine vision, and digital light processors
– Battery backup cooling: Outdoor Cooler Series thermoelectric assembly
– Precision laboratory imaging: Nextreme NRC400 thermoelectric recirculating chiller for cooling image sensors in cameras

www.tark-solutions.com

“Each year, the Back to School Giveaway is a celebration of curiosity, creativity and the bright future ahead,” said Brooks Vigen, senior director of global strategic marketing at DigiKey. “DigiKey is proud to support students as they turn bold ideas into real-world innovations, and we’re excited to see how this generation will shape the technologies of tomorrow.”

Five entrants will be randomly selected to win a prize package that includes products such as an Aven Tools LED lamp, a Pokit Innovations all-in-one digital tool, a Weidmüller wire stripper, an Adafruit Ladyada’s electronics toolkit, DigiKey-branded merchandise and more. The grand prize is a Teledyne LeCroy Power Supply unit.

The sweepstakes is open to any student with a university or college email address, and entries may be made in students’ local language. To enter the Back to School Giveaway, visit DigiKey’s website here. Submissions are open from Aug. 26 – Oct. 24, 2025, and winners will be announced around Nov. 15, 2025.

To learn more about DigiKey’s free educational tools and academic resources for coursework and projects, go to DigiKey website.

Now, by adding a new fibre-optic range, ODU are providing even greater performance.

ODU Expanded Beam Performance Connectors

Matching the optical performance of Physical Contact fibre-optics with an advanced Expanded Beam technology, offering high-end transmission characteristics over many mating cycles, with no cleaning required under normal conditions of 50,000 mating cycles at –65°C to +105°C

Insertion loss

Multimode: < 0.15 dB (typical) / < 0.3 dB (max.)

Singlemode: < 0.35 dB (typical) / < 0.7 dB (max.)

Return loss

Multimode: > 45 dB (typical) / ≥ 35 dB (min.)

Singlemode: > 60 dB (typical) / ≥ 55 dB (min.)

The Expanded Beam Performance ferrules are the heart of the new connectors.

Each ferrule can connect 12 optical fibres via a non-contact lens system.

A space saving cassette arrangement of the ferrules allows the system to be expanded to up to 96 optical fibres.

This has resulted in three new products, in differing configurations:

ODU BACKPLANE

Connects modules to the mission computer and allows them to be quickly replaced. Thanks to Expanded Beam insensitivity to dust and pollution, provides quick and easy maintenance.

In three versions, as defined in upcoming VITA standards:

VITA 96.1 (drop-in replacement for VITA 66.1) – up to 96 fibres

VITA 96.4 (drop-in replacement for VITA 66.4) – up to 48 fibres

VITA 96.5 (drop-in replacement for VITA 66.5) – up to 72 fibres

ODU TACTICS

Combines proven MIL-DTL 38999, Series III connectors with the highly innovative Expanded Beam Performance technology, the VITA 95 interconnect system takes fibre- optic transmission in aircraft to a new level.

Available with Expanded Beam Performance contacts

In four shell sizes:

Shell 11 (25.0mm plug) – up to 24 fibres

Shell 13 (29.4mm plug) – up to 48 fibres

Shell 15 (32.5mm plug) – up to 72 fibres

Shell 17 (35.7mm plug) – up to 96 fibres

• ODU AMC® Series T – Beyond 38999

This alternative to the standardized MIL-DTL-38999 Series lll connector, excels with its innovative 3-in-1 plug locking options of push-pull, snatch or screw-lock onto a common bulkhead. Qualified to 38999 test standards, but with an even smaller footprint.

Available with Expanded Beam Performance contacts

In four space-saving shell sizes:

Shell  9 (18.4mm plug) – up to 24 fibres

Shell 12 (24.9mm plug) – up to 48 fibres

Shell 14 (27.9mm plug) – up to 72 fibres

Shell 16 (30.9mm plug) – up to 96 fibres

So, whether your interest lies in Soldier Systems, C4ISR, Land & Naval Systems or Aerospace, why not drop by – Pod 13, in the Make UK Defence Pavillion, Stand 110 in Hall 4

ODU-UK Ltd                                          tel: 0330 002 0640   

sales@odu-uk.co.uk                            www.odu-connectors.com/uk    

498 words

 Links:

https://www.dsei.co.uk/

https://www.makeuk.org/defence

https://odu-connectors.com/uk/industries/military-security-and-communication/

This flagship event will showcase how UK-based companies are competing in automotive electronics and software systems innovation, fostering a technology-rich ecosystem that defines mobility in an electrified and automated future.

AESIN, the UK’s industry body for automotive electronics and software systems, brings together members from both the electronics and automotive sectors. Building on the success of last year’s conference, which attracted over 150 attendees, this year’s event promises an even more impactful program. The 2025 conference theme, “The Future is Electronic: from AI to Power,” will explore the UK’s contributions to the global automotive industry in areas such as electrification, automated and software-defined vehicles, AI and machine learning, and sensor technology.

Attendees can look forward to:

·       Over 25 speakers, including keynote addresses from industry leaders at Jaguar Land Rover, Green Hills Software and the Department for Business and Trade.

·       Leading industry exhibitors showcasing cutting-edge technologies.

·       Four dedicated sessions covering important and current topics 

·       Interactive panel discussions, masterclasses, and networking opportunities.

This year’s conference will conclude with a dedicated evening meal, offering a relaxed and informal setting for continued networking and deeper conversations. Attendees will also have the unique opportunity to hear exclusive insights from headline sponsors—leading voices shaping the future of automotive electronics and software.

Gunny Dhadyalla, AESIN Director, commented, “We are witnessing significant growth in electronics and software, driven by the global shift towards electrified and automated mobility. This year’s conference will focus on the role of the Software Defined Vehicle, AI and the future of electronics and how the UK can build on its position as a key player in the industry. We look forward to uniting the leading minds across this dynamic and exciting industry.”

Widely regarded as the most important event in the UK automotive and electronics industry calendar, the AESIN Conference brings together decision-makers, innovators, and technical experts from across the sector. 

Event registration is open, and event partnerships are also available.

For more details, please visit – https://aesin.org.uk/conference/

Harwin has unveiled a new report into the U.S. connector market at this year’s EDS Leadership Summit in Las Vegas. Entitled ‘Connecting with North America’, the report summarizes key findings from the company’s exclusive 2025 survey of connector specifiers from across the United States.

The new survey looked into some of the most important applications for connectors, the technologies being chosen and criteria that engineers and purchasers use to make product and supplier choices. It also examined the importance of online tools in the design and selection process and investigated where specifiers obtain information for making effective design and buying decisions.

Among the key takeaways from the survey are the importance of product reliability – over 60 per cent of respondents expected reliability from five years to beyond ten years – and how the availability of complementary products and rapid sampling are factors when selecting suppliers. The survey results also underline the importance of online

tools and how artificial intelligence (AI) is starting to be used for selection, design, qualification and testing.

“Harwin is a well-established player in the U.S. connector market, a market that is expected to exceed USD 14 billion by 2034,” says Peter Schneid, Harwin’s Vice President of Marketing. “We are committed to understanding and anticipating the needs of customers in the region and this new survey provides additional insight that both validates our approach and helps us further evolve our product and service offerings.

“The demand for long-life, high-performance technologies highlighted by the survey, for example, aligns perfectly with our specialism in reliable, high-quality technologies for demanding applications, while our innovative digital tools are already addressing the proven demand for online offerings that speed comparison, design and prototyping.”

Harwin’s survey was completed during April 2025 by a broad cross-section of connector buyers and engineers based in the U.S. Respondent responsibilities ranged from procurement and design to executive leadership and covered key sectors such as industrial, automotive, aerospace, and telecoms.

To download a copy of the Connecting with North America report please visit: https://www.harwin.com/connector-research-25

The EDS Leadership Summit takes place from May 19th to 23rd 2025 at Resorts World, Las Vegas.

For more information visit: https://edssummit.com.

The sessions take place on June 2-3 on the campus of Wayne State University in Detroit, MI, and cover topics ranging from controlling noise, using AI in hardware and PCB design, flex and rigid-flex materials and DfM, HDI via design, and PCB cost drivers, among others.

Conference sessions include:

• “Circuit Grounding to Control Noise and EMI,” Rick Hartley
• “Solving Routing Problems in Digital Boards,” Susy Webb
• “HDI Via Design: Planning the Energy Pipelines,” Dan Beeker
• “Low Layer Count and IoT PC Board Design,” Rick Hartley
• “Designing Complex PCBs,” Stephen Chavez
• “Design Guidelines Associated with Unique RF Features,” John Johnson
• “Designing with Embedded Materials,” Bob Carter
• “Using AI in Hardware and PCB Design: Real Strategies to Increase Efficiency and Output,” Ethan Pierce
• “Flex/Rigid Flex: Materials, DFM and Cost Impacts,” Dave Lackey
• “PCB Cost Drivers,” Michael Marshall
• “The Most Common Design Errors Caught by Fabrication (and How to Prevent Them),” Mike Tucker/Ray Fugitt

PCB Detroit will also feature a tabletop exhibition on June 2 with fourteen companies including: A2Z Electronics LLC, ADCO Circuits, AllSpice.io, ASC Sunstone Circuits, BarTron Inc., Cofactr, DirectPCB, DownStream Technologies, Electronic Interconnect, K&F Electronics, Polyonics, RBB, Summit Interconnect, and Zuken USA. 

A free reception on June 2 and special designers meetup (registration required) on June 3 will be held after classes end those days.

“PCB Detroit is the only place the electronics industry can see Rick Hartley, Susy Webb, Dan Beeker and Steph Chavez together at the same time in the Midwest,” said Mike Buetow, president of the Printed Circuit Engineering Association. “And the opportunities not just to learn but to network with fellow designers and engineers should not be missed.”

Registration for the two-day technical conference and the tabletop exhibition takes place at events.american-tradeshow.com/pcbdetroit/begin. Conference registration is required for both the conference and table top exhibition. Plus, lunch will be provided to registrants.

Wayne State University is Michigan’s third-largest university, and a licensee of the PCEA Training Certified Printed Circuit Designer curriculum. 

For more information about PCB Detroit, visit pcea.net/pcb-detroit or contact pcbdetroit@pcea.net.

Numerous companies are once again using the LogiMAT Campus as an additional recruiting tool this year. The shortage of skilled workers and workers is one of the current key challenges for competitiveness across all industries. According to the German Chamber of Industry and Commerce (DIHK), 43 per cent of companies are currently having problems filling vacancies. According to a Bitkom study, there is a shortage of around 149,000 experts in the IT sector of German companies alone. “We are currently experiencing a profound transformation of the labour market that is far from complete,” says Daniela Komolafe, Manager Talent Acquisition, Recruiting & Engagement, at the mechanical engineering company Konecranes.

As a result, most companies have now significantly expanded their recruiting tools beyond ad-based job offers. Miebach Consulting, for example, takes part in recruiting fairs, lectures and workshops at universities and, in addition to external recruiters with job postings on google for jobs, indeed and LinkedIn as well as active sourcing on LinkedIn, also uses social media to recruit skilled workers. In addition, attractive offers are offered to the skilled workers.

According to the ‘Trend Study 2025,’ which was presented by the Augsburg Institute for Generational Research at the beginning of January 2025, young applicants in particular expect their future employer to show appreciation, leadership skills and health promotion in addition to flexible working time models and home office. Companies like Miebach meet this demand, among other things, with a dynamic corporate culture, flat hierarchy, small teams and exciting projects at renowned international companies.

In addition, job aspirants can take advantage of attractive remuneration and career models, the assumption of accident insurance and company pension schemes, training programmes and flexible working hours. “With a well-thought-out recruiting strategy as well as the right tools and methods, we have once again succeeded in filling our positions promptly and appropriately this year,” says Ute Hittinger, Senior Recruiter & Process Owner, Viastore Group. “However, the time and financial effort for this has increased significantly.”

Against

this background, the LogiMAT trade fair organiser EUROEXPO Messe- und Kongress-GmbH has launched a career and networking event with the LogiMAT Campus. On Thursday, March 13, 2025, LogiMATCampus will take place for the second time as part of LogiMAT 2025 from 9:00 a.m. to 5:00 p.m. at the new location in the ICS foyer at the Stuttgart Exhibition Center. “The LogiMAT Campus was launched last year to expand the exhibitors’ recruiting tools and to open a door to logistics for those interested in jobs with the platform,” explains LogiMAT Exhibition Director Michael RuchTy.

“The matching offer was still in its infancy, but was already well received by both sides. Many exhibitors will be there again this year. In addition, we have further optimised the concept over the past twelve months. I am confident that with the LogiMAT Campus 2025 we will experience a successful event focus within the framework of LogiMAT.”

With the LogiMAT Campus, the trade fair organiser offers all interested students, vocational school students, career changers and job seekers who want to get started in logistics a platform for initial contacts and further information from logistics-related companies. Among others, well-known system integrators and plant manufacturers as well as software companies, industrial truck manufacturers, logistics consultants and service providers such as the Beumer Group, Konecranes, Miebach Consulting and the Viastore Group will be at the start.

At their information booths on the LogiMAT Campus, potential job aspirants will come into direct contact with contact persons from the exhibitors’ specialist and personnel departments. The focus is on the job profiles and requirements of the current job offers as well as the career prospects and further training opportunities in the companies. In addition, the LogiMAT Campus offers an informative supporting program for potential junior staff with the Campus Sessions. There, industry experts will give helpful tips and report on their career experiences and their own career entry into logistics.

“We see a very large added value potential in this trade fair offer,” says Viastore recruiter Ute Hittinger. “Specifically, with our participation in 2025, we want to fill sales positions, project management and technical positions of PLC/mechatronics technician in particular. Our target group are graduates and young professionals from intralogistics in the areas of systems and software. Last year, however, experienced people from the industry also came to the campus to find out more.”

After the first contacts on the LogiMAT Campus, interested parties can deepen the information offered at the companies’ presentation booths in the exhibition halls and find out more about the industry and career opportunities. The University of Stuttgart, the WGTL e.V., the VDI and the fashion company HUGO BOSS, among others, support the LogiMAT Campus as event partners.

Applications directly on the LogiMAT Campus and afterwards

The fact that experienced specialists from the industry also come to the LogiMAT Campus fits perfectly into the requirements profile of Miebach’s management consultants. “Interested parties who came in 2024 were suitable, also a few experienced candidates and definitely interested,” says Sarah O’Brien, Human Resources Manager at Miebach Consulting. “We received applications directly at the trade fair and afterwards.” This year, the consultants want to attract experienced engineers with a degree in engineering and professional experience in the planning and implementation of logistics systems.

At Konecranes, however, the LogiMAT Campus appearance is more about attracting electricians and mechatronics engineers, “who can work with us as service technicians throughout Germany,” says Konecranes manager Daniela Komolafe. The mechanical engineering company, which is bound by collective bargaining agreements, offers them benefits, among other thingss for Remuneration Security including Special Payments, a Positive Working Atmosphere and Promotion of a Healthy Work-Life Balance, Good Internal Development Prospects and 30 Days of Vacation.

“The broad candidate and job profile offered by the exhibitors on the LogiMAT Campus reflects the diverse job profiles, fields of work and exciting areas of intralogistics that are often not even known to the public and potential job candidates, from electricians and mechatronics engineers to experienced engineers,” sums up trade fair director Ruchty. “With the LogiMAT Campus as part of LogiMAT, we have successfully set up an informative format that supports companies in recruiting skilled workers and opens up information and options for new perspectives in intralogistics for the young professionals and skilled workers among around 68,000 trade visitors to LogiMAT.”