With the new EMS Pavilion, the PCB, EMS & Components Marketplace, and a ZVEI panel discussion, electronica 2024 will have a clear focus in Munich from November 12-15. The world’s leading trade fair for electronics will show how EMS service providers are shaping future electronics production through innovations and sustainability strategies.

EMS offers comprehensive services ranging from the development to the production of complex electronic components for industries such as automotive, consumer electronics, and industrial automation. According to the German Association of the Electronics and Digital Industry (ZVEI), the EMS sector generated over 12bn euros in 2022 in Germany, Austria and Switzerland alone. It employs more than 50,000 people, is of major economic importance, and acts as a job engine. Fortune Business Insights even estimates the global EMS market at USD 573.75bn in 2024, and forecasts growth to USD 1,017.85bn by 2032.

Technological innovations and their significance

Thanks to the integration of Industry 4.0 technologies, EMS services are experiencing a true revolution. Companies in the EMS sector are being transformed from mere component producers into active partners in product development in many key industries. The use of IoT, AI and big data enables automated, networked production with more efficient processes and increased flexibility. As a result, EMS providers can respond better to rapidly changing customer requirements and market conditions.

Advanced manufacturing techniques, such as advanced production methods with 3D printing and robotics, enable more accurate and efficient production. These technologies simplify the manufacture of customized products and enable rapid adjustment to market changes and specific customer requirements. In prototype production, they offer the necessary flexibility to quickly test and implement new designs.

Sustainability as a key factor

The growing importance of sustainability in the manufacturing industry is also evident in the EMS sector. Production processes are becoming increasingly environmentally friendly, saving raw materials and reducing the carbon footprint. In addition to the use of sustainable materials and efficient use of resources, modern recycling processes and a focus on the circular economy reduce the industry’s ecological footprint. And that also pays off economically through lower operating costs.

Future-proof through smart supply chains, customer centricity, and local production

Like many internationally networked industries, EMS companies must also respond to global economic change and, in particular, disrupted supply chains. To optimize supply chains, forecast fluctuations in demand, and plan resources more efficiently, they rely on artificial intelligence (AI) and machine learning, for example. At the same time, the industry must also make strategic and long-term decisions, such as setting up local production facilities to reduce dependence on global supply chains. These strategies guarantee maximum flexibility and resilience, and make EMS service providers reliable partners in a dynamic industry.

electronica 2024: meeting place for knowledge transfer and networking in the EMS industry

All this shows that it has never been more important for the EMS industry to not only network within its own sector, but to also discuss challenges and innovations with its international customers. With presentations and discussions, the PCB, EMS & Components Marketplace at electronica 2024 offers a unique platform for exchanging information on current trends and solutions as well as the latest developments in the EMS industry.

A special highlight at the forum will be the ZVEI panel discussion at 10:30 a.m. on November 13 in Hall A1: Industry experts and decision-makers will discuss how European competitiveness in the high-tech sector can be secured, and what contribution EMS can make to building a resilient microelectronics ecosystem.

For the first time at electronica 2024, the EMS Pavilion offers small and medium-sized companies the opportunity to present their products and services as part of a joint stand. With 18 new exhibitors, the pavilion was fully booked within a very time. In addition, visitors to Halls A1, B1 and C6 will have the opportunity to find out about the latest technologies and trends in the EMS industry from other renowned companies in the sector, such as BMK, Cicor, Deltec, Lacroix, Prettl, SERO, SVI Austria, TQ and Zollner, to network and exchange information on current developments and best practices.

Researchers at UC Irvine have recently developed a method to produce ultra-thin bismuth crystals using a process akin to a tortilla press. These crystals, which exhibit important quantum oscillations, hold the potential to revolutionize the manufacturing of affordable, flexible electronics and quantum devices, making cost-effective flexible electronics an everyday reality.

GlobalData’s proprietary technology innovation intelligence tool “Technology Foresights” indicates a consistent increase in the number of patents associated with flexible electronic circuits over the years, totaling 2,882 between 2015 and 2023. The addition of 13 new companies in 2022 and 11 in 2023 to the patent landscape, demonstrates a growing emphasis on innovation with patents distributed across leading themes such as climate change, emissions reduction, and renewable energy.

Rahul Kumar Singh, Senior Analyst of Disruptive Tech at GlobalData, comments: “Flexible circuits enable new features and functionalities in electronic devices by conforming to the unconventional shapes and integrating with different components. A significant rise in patents related to climate change and emissions reduction highlights how these circuits are being leveraged to create more sustainable technologies. Moreover, innovations in printed circuit manufacturing, which account for more than 40% of flexible electronic circuit patents, are enabling more efficient production processes that reduce waste and energy consumption.”

An analysis of GlobalData’s Disruptor Intelligence Center highlights the recent innovations, notable partnerships, and strategic funding driving the sustainable manufacturing of flexible electronic circuits. For example, in April 2024, US-based ENNOVI introduced a sustainable method for producing flexible circuits in EV battery cell contact systems, aligning with the industry’s sustainability focus.

UK-based Smartkem collaborated with FlexiIC in February 2024 to streamline flexible circuit design and production using open-source EDA tools, enhancing rapid and low-cost production for new applications in sensors and IoT.

In the same month, US-based NextFlex secured $6.49 million in funding for seven projects under Project Call 8.0 to advance sustainability in flexible hybrid electronics manufacturing.

UK-based Pragmatic Semiconductor raised $231 million in Series D funding in December 2023 to expand flexible IC production for smart packaging and wearables, reflecting growing investment in flexible electronic circuits.

Singh concludes: “While the progress in flexible electronic circuits is excellent, challenges associated with scalability persist. Ensuring that these circuits can be produced at scale without compromising quality or increasing costs is crucial. Moreover, integrating flexible circuits into the existing manufacturing processes and ensuring their durability under various conditions is key. However, the continuous rise in patent activity and strategic investments suggest a bright future for flexible electronics.”

POLYN, a fabless semiconductor company supplying application-specific Neuromorphic Analog Signal Processing (NASP) technology and products, developed NeuroVoice, a Neuromorphic Front End (NFE) chip that performs on-device Voice Activity Recognition. SkyWater is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Foundry.

In always-on, at-microphone use cases, NeuroVoice can completely offload neural network processing for voice detection without the use of a microcontroller (MCU) or Digital Signal Processor (DSP). This enables an extremely energy-efficient AI-empowered sensor node, freeing up the MCU for other general-purpose computation. Working at 30µW in active mode, the solution is designed to wake up any other system in the IoT device upon voice detection.

The NeuroVoice chip supports various system configurations through standard interfaces for MCU and simple pin control, which assists customers in developing new solutions, and could be integrated either like a system-in-package (SIP) or module with minimal design complexity.

“This is an important milestone for our technology, to guarantee our first product and the continuous innovation of analog neuromorphic IP, expanding our NFE product lines,” said Aleksandr Timofeev, co-founder and CEO of POLYN Technology. “The first production chip using SkyWater’s S90LN platform will showcase the possibilities for the next generation of AI-enabled sensors – in a range of industries – for extracting useful information at ultra-low-power and inference latency.”

“We are pleased to see POLYN’s NeuroVoice chip move through the process development phase and into production at our Minnesota facility,” said Ross Miller SVP, Strategic Marketing at SkyWater. “The need for efficient, low-power distributed data processing at the edge is huge and growing, and POLYN’s solution addresses this need. Our Advanced Technology Services (ATS) business model allowed us to merge POLYN’s proprietary structures with our S90LN technology platform to build a hybrid technology solution.”

UK-based Hanover Displays manufactures and designs passenger information systems for the public transport industry, placing great emphasis on providing very high quality products.

The printed circuit boards (PCBs) in its display panels were originally produced in the Far East until recently, when Hanover decided to start manufacturing them in-house.

“We invested in high-speed production equipment to make the PCBs, a decision that gave us greater flexibility in our production control, but also enabled us to continue with product development,” said Reece Mills, the company’s Production Control Manager.

Automating the testing and inspection processes

However, moving production in-house presented Hanover Displays with a new set of challenges. It had to be able to both test and inspect the boards itself. Initially, this was a very manual process; even though it involved automated test equipment (ATE), the process was very hands-on and depended on complete operator concentration. Since the company processes some 240,000 printed circuit board assemblies (PCBAs) each year, there is a very high risk of the operators suffering from repetitive strain injury.

Hanover therefore took the decision to automate these processes more comprehensively, which required a new system for testing PCBAs. It chose Omron TM’s cobots for the tasks, supplied and installed by Absolute Robotics, a small robot integrator based in Bristol.

“As well as addressing the health and safety issue of our employees, we also wanted to guarantee a consistent cycle time. Unmanned running was really important to us, so we wanted to ensure that the cobots could run at night time, too, for more throughput, yet with less effort,” said Hanover Displays’s Operations Director, Sean Winter.

Omron TM cobots feature simple programming along with integrated vision capability. There are several models, offering different levels of payload and reach.

“One of the key drivers was that Hanover wanted the cobots to interact with the existing manual test equipment. The cobots therefore have special tooling that allows them to open and shut the manual testing equipment,” said Geoff Ferguson, Managing Director of Absolute Robotics.

Relying on cobots

Hanover wanted to use the cobots with both its processing and display boards, which meant exploiting their full potential. This included using the built-in vision systems, particularly for the display boards, to ensure that the LEDs were lighting up in correct sequence. Subsequently, the company invested in six more Omron TM cobots, installed in two production lines. These take the LED display boards from a standard storage rack and test them.

One of the challenges that Absolute Robotics faced was that Hanover Displays produces a wide variety of sizes and shapes of circuit boards for its display panels. The cobots needed to be able to handle these different types of boards, so Absolute Robotics built flexible tooling that can self-adjust, to successfully handle all of them. The programme can also handle any number of LEDs, from hundreds to tens of thousands.

“We realised the benefits of the cobots quite quickly, after implementing the first system,” said Hanover’s Mills. “What we’d planned and hoped for was that we’d be able to run unmanned and this happened quite quickly. The return on investment for the whole system was just two years. The tests involve very repetitive processes, and I think the biggest thing for me is being able to redeploy and upskill our staff.”

Winter added: “From a quality assurance point of view, we have full traceability of our PCBAs. This means every time we inspect a PCBA, we get a record that tells us if it’s passed or failed. We’ve also benefited from an additional 1,100 hours per year of unmanned running. At Hanover, we always want to invest in our future. It’s about looking at technology, how it’s moved forward and how we can apply it to our business.”

By Omron field application engineers

“Interest in 3D-IC solutions has increased notably in the past year as our customers seek ways to boost design performance without sacrificing area or cost,” said Osbert Cheng, vice president of device technology development & design support at UMC. “Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.”

UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications. Using UMC’s 40nm low power (40LP) process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation, and system analysis in a single platform.

“With increasing design complexity for IoT, AI, and 5G applications, wafer-on-wafer technology automation is increasingly important for chip designers,” said Don Chan, vice president, R&D in the Digital & Signoff Group at Cadence. “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”

The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database. The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit. Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis. The reference flow also enables system-level layout versus schematic (LVS) checking to connectivity accuracy, electric rule-checking (ERC) for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.

In addition to the Integrity 3D-IC platform, the Cadence 3D-IC flow also includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Celsius Thermal Solver for system analysis.

The manufacturing process is growing complex with shrinking board sizes, tiny and fragile components, multilayer stack up, and high component density. Also, there is an increased chance of failures, wastages, and other assembly issues which can significantly delay the PCB production timelines. PCB manufacturers have to adopt advanced production techniques to stay ahead of the competition. Automation of the entire PCB assembly process will improve the production output and also reduces the overall manufacturing cost.
Impact of AI and Robotics in PCB manufacturing:

Automated Robots can be deployed in all the stages of the PCB production cycle like material handling, component creation, pick and place, inspection, testing, packing, etc. In short, AI and Robotics together can almost provide you with Turnkey PCB Assembly solution. This will considerably reduce the labor cost, wastages, and assembly faults. AI-based Robots are inherently precise and faster in operation which enables PCB manufacturers to optimize the entire production supply chain.

Modern circuits are more complicated with the introduction of surface mount technology. Finding faults among thousands of solder joints is not feasible using manual inspection methods. But machine vision systems are better equipped with deep learning to understand the distance and depth of the objects. This has resulted in obtaining accurate images for PCB testing using the Automated Optical Inspection (AOI) method which helps in detecting faults during the early stages of the production process.

AI-based robots can quickly learn and collect data during assembly operations. The enormous data collected is stored in the cloud which can be further used by other AI-based robots to self-learn. This saves a lot of time in training the robots and also ensures consistent quality. The flexibility and lightweight nature of the robots make it easier to deploy them in various applications without much change in the layout of the production line. This saves both space and setup time during PCB assembly.

Merits of using Robotics and AI in PCB Production:

• Quicker Material Management
Material supervision is efficient when the stocks are traceable and quickly available. Industrial Robots can speed up the process of uploading and downloading the PCB components and materials. While shifting the components, automated guided vehicles can reduce possible errors due to ambiguity. The overall productivity and usage of assembly equipment increase by swift material handling by the automated robots. Also, using robots during material movement can minimize the possible Electrostatic Discharge (ESD) damage to the components.

• Improved Product Quality
Robots and automated machines use AI-based sensors to perform different PCB assembly tasks with great accuracy. The sensors can easily adapt to the varying environmental condition and correct any error in the initial stages itself. The programmable vision systems can maximize the assembly line efficiency and overall product quality.

• Increased Shop Floor Flexibility
AI Robots depend on high-precision cameras during pick and placement to confirm the physical features of the components. The lightweight and adaptability of the robotic arms, along with the precise vision equipment support adequate pressure application on the components. This increased flexibility ensures that no layout change is required for different assembly applications and reduces setup time.

• Consistent Inspection Support
The deployment of industrial robots can be the best solution to achieve reliable inspection support during the PCB assembly. Unlike manual inspection, Robots can perform repetitive tasks without any error or break. Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) are the commonly used automated inspection methods. Robots with arm-mounted cameras ensure the correct component orientation and soldering.

• Safe Test Environment
Automatic test support like robotic flying probes can approve the circuit functionality by verifying the connections. Robotic arms attached with IR cameras can assess powered PCBs for any hotspots and other thermal issues. Robotic testing can access constricted test points and reduce the hazards of electrical shock or burns which can be detrimental in manual testing.

• Higher Sustainability
Robots are used to desolder electronic components from discarded PCBs for recycling purposes. Image recognition software assists the robots to locate the components to be retrieved from the scrap boards. Upcycled components can support the PCB manufacturing industry to be more environment-friendly.

AI-based Robotics can reduce process bottlenecks and greatly optimize the PCB production process. They are flexible and can handle complex tasks with precision. Robotics with AI are revolutionising the PCB manufacturing industry by handling a wide range of tasks swiftly and more competently.

The introduction of AI in the automation process can assist PCB manufacturers in producing highly complicated circuit boards, compliant with industry standards. Robots are now affordable and can be used by contract manufacturers to build smart factories for more output and less wastage.

Industry 4.0 in PCB Manufacturing:

Industry 4.0 refers to the digitization of the manufacturing industry with the application of robotics, AI, IoT, and data aggregation. This will drive the production of electronic products with improved performance and reduced costs. In PCB manufacturing, it provides the ability to track PCB defects using the collected data and also brings increased process visibility. Following are some of the advantages of incorporating Industry 4.0 standards in PCB manufacturing:
 Enhanced performance
 Better quality control
 Seamless supply chain management
 Effective product maintenance
 Reduced scrap rate

It is necessary to choose the right CM while building PCBs as per Industry 4.0 standards. Adhering to an effective PCB development process, procuring reliable components from approved vendors, following necessary guidelines all through the development process, and ensuring that the CM employs the best quality control measures are the necessary steps to manufacture Industry 4.0 compliant PCBs. Robotics and AI together optimize the operations and accumulate huge data from every sensor and machine used in the PCB manufacturing process. The analyzed data can help in decision-making and error corrections leading to a high-yield PCB production. Though complete automation involves many technical challenges, CMs have started incorporating discrete systems at key production points to earn the benefits of AI-enabled Robots in PCB workshops.

By Ken Ghadia, Sales Engineer, Technotronix

Rochester Electronics has received the IATF 16949:2016 certification for the manufacture of semiconductor components at its US-based facilities. Developed by the International Automotive Task Force in conjunction with the international standards community, IATF 16949 is the industry’s highest standard for quality management systems in the automotive sector.

The use of semiconductor electronics in automotive applications has expanded rapidly over the last decades and continues to be one of the fastest-growing market segments. As a result, the semiconductor supply chain has now become integral to a manufacturer’s product planning. With a range of semiconductor manufacturing capabilities, Rochester Electronics supports its customers with individual services through to full turnkey manufacturing.

“This IATF certification further solidifies Rochester Electronics’ reputation for quality and reliability and highlights our commitment to our semiconductor partners and customers. We are extremely proud of our team for their work on achieving this milestone for the company.” said Mike Dube, VP Manufacturing and Engineering, Rochester Electronics.

Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers.

As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Storage and Processing, Assembly, Test and Reliability, providing single solutions through to full turnkey manufacturing.

Rochester is the Semiconductor Lifecycle Solution. No other company compares to the breadth of Rochester’s product selection, value-added services, and manufacturing solutions.

With direct sales and support staff in all major markets, complemented by a network of regional and global authorized channel partners, we aim to meet your needs over the phone or via our e-commerce platforms anytime, anywhere.

For more information visit: www.rocelec.com

As the demand for microelectronics continues to increase, electronic design and development engineers face numerous challenges, such as reducing energy consumption, increasing battery storage capacity whilst shortening battery charging times, and incorporating sustainable materials – at the same time reducing the size and weight of components. Solutions to many of these challenges can be found by considering advanced novel materials, such as energy-efficient semiconductors, organic photovoltaics, 2D coatings for sensitive components, and ultra-thin semiconductors and insulators.

Unlocking the benefits of these materials requires a deep understanding of their properties, particularly how their performance or stability varies under the environmental conditions found in real-world applications. Such sample characterisation can be done using well-established techniques such as Raman, FT-IR and X-ray spectroscopy, using instrument stages that allow experiments to be carried out under a range of conditions of temperature, atmosphere and vacuum pressure.

Here we will discuss two applications where being able to precisely control the temperature of the material using this approach has made a significant contribution to understanding its properties.

Studying crystallographic phase transitions

X-ray diffraction (XRD) generates diffraction patterns that are correlated directly with the presence of certain components in a material, giving a picture of the phases present and defect details.

XRD was historically used to examine crystalline materials, but two refinements of the technique are now frequently used to study non-crystalline or semi-crystalline materials in powdered or liquid form. Wide-angle X ray scattering (WAXS) measures scattering at 2θ angles of > 5°, and provides structural information down to 0.1nm, similar to traditional XRD.

Small-angle X ray scattering (SAXS) measures scattering at 2θ angles of 0-5°, and provides information on complex molecules and materials such as polymers, colloids and porous materials, with a feature size of up to 500nm.

The Centre for Nature-Inspired Engineering (CNIE) at the Department of Chemical Engineering of University College London has a SAXS/WAXS system. It is fitted with several stages to vary the conditions under observation, including a regular temperature-controlled stage for experiments to be conducted between –175°C and 350°C, and a capillary X-ray stage for observing small volumes of materials at temperatures from 4°C to 80°C.

The set-up at CNIE has been used to detect new polymorphs and phase changes in both solid and liquid samples. A good example of this is the analysis of two phase transitions in pyroglutamic acid (PGA); see Figure 1. It was found that the low-temperature phase change, from the α′ to the α phase, happens slowly and appears to be martensitic (a hard and very brittle solid solution) in character, in which the strain at the α–α′ interface in partially transformed crystals caused the transformation to occur in bursts. Applied to the microelectronics field, this opens up the prospect of detecting new polymorphs and phase changes in novel materials that might have consequences for real-world applications.

Figure 1: WAXS data for PGA acquired using a temperature-controlled capillary stage, showing the forward and reverse phase changes at (a, b) 80°C and 70°C (fast transition) and (c, d) -150°C and -130°C (slow transition). Data was collected over a period of 2s at temperature intervals of 10°C

 The protective effect of 2D coatings for copper

The components of electronic circuits must be protected as much as possible from environmental stresses, and materials that are one atomic layer thick  – 2D materials – are now receiving attention for this purpose because they do not affect the morphology of the substrate.

Graphene is one such material, which has the desirable property of being highly impermeable to liquids, gases and chemicals. However, it has high electronic conductivity, which could create a galvanic cell if placed in contact with a conductor, potentially causing degradation over time. Therefore, hexagonal boron nitride (hBN), which has the same permeability as graphene and does not form a galvanic cell, has been studied as an alternative.

A study carried out at the Micro and Nanotechnology Department at the Technical University of Denmark, Copenhagen, compared the protective properties of graphene and hBN under two oxidation environments using Raman spectroscopy. This uses a laser beam to study the vibrational modes of molecules, and so provides a ‘fingerprint’ enabling compound identity to be uncovered.

The study generated layers of the materials on copper through chemical vapour deposition, and examined their properties under two oxidation environments, one short-term and one long-term. The results from the short-term study (Figure 2) indicated graphene to be an effective barrier. However, between 150°C and 300°C, hBN was less effective, which was believed to be due to the higher density of grain boundaries and wrinkles, which are known to induce faster oxidation of the copper substrate.

Another observation was that above 300°C, the oxidation of the graphene coating increased, as measured by the increase in the Raman intensity of the CuO and Cu₂O peaks, which were seen to be larger than for hBN.

Figure 2: Short-term oxidation study: Evolution of the Raman signal intensity for (a) CuO at 500 cm⁻¹, (b) Cu₂O at 640 cm^–1, and (c) Cu(OH)₂ at 800 cm⁻¹ on bare copper (black squares), graphene-coated copper (blue triangles) and hBN-coated copper (red crosses) on heating from room temperature to 400°C over a period of 45 minutes. The grey area indicates when graphene is etched away upon reaction with ambient oxygen, thus leaving the copper surface uncoated. The vertical lines indicate where the temperature is ramped up, while being kept constant in between. [Credit source: Reproduced from Galbiati et al]

Results from the long-term study (Figure 3) showed the barrier properties of graphene were effective only for short periods. After being held for nine hours at 50°C, the oxidation of graphene resulted in an increase in copper oxide peaks, which were attributed to the formation of a galvanic cell. However, the performance of hBN was much better, with near-uniform signals for the duration of the study.

Figure 3: Long-term oxidation study: Evolution of the Raman signal intensity for (a) CuO at 500 cm⁻¹, (b) Cu₂O at 640 cm^–1, and (c) Cu(OH)₂ at 800 cm⁻¹ on bare copper (black squares), graphene-coated copper (blue triangles) and hBN-coated copper (red crosses) on being kept at 50 °C for a period of over 60 hours. [Credit source: Reproduced from Galbiati et al]

Easy temperature-dependent measurements

As demonstrated by these two examples, the easy acquisition of temperature-dependent measurements makes it possible to detect new polymorphs and phase changes in both solid and liquid samples. However, the options extend much further than the WAXS/SAXS and Raman studies highlighted here, with other analytical modalities including grazing-incidence XRD to obtain information about surface layers, Fourier-transform infra-red (FT-IR) to uncover the identity of (mostly) organic materials, and light microscopy to understand surface morphology.

In all of these, the availability of temperature-controlled stages allows rapid cooling and heating, with options for investigating the effect of controlled atmosphere, controlled vacuum or humidity. Stages can also be fitted with electrical connections probes allowing measurement of electrical properties or power devices during testing. With these tools available, microelectronics researchers will find it easier to gain a deeper understanding of potentially useful materials.

Such capabilities have clear benefits for microelectronics research and product development, particularly the identification of material phases both in bulk and in thin layers, as well as the understanding of nanoparticle characteristics, investigation of molecular assembly or disassembly, and the uncovering of atomic-level structures in metals, semiconductors or organic-based components.

With these tools available, electronics design and development engineers will be in a better position than ever before to identify and take advantage of promising materials in their projects, and so remain at the cutting edge of innovation in a rapidly growing industry.

By Duncan Stacey, Sales and Marketing Director, Linkam Scientific Instruments

From the start of 2021 ecsn members saw ‘book-to-bill’ (B2B) ratios rise to levels rarely, if ever, seen in the electronic components supply network, with unprecedented ‘Bookings’ driven not only by the extending lead-times but also by price increases: “The high B2B ratios carried on throughout the first half of 2022,” continued Dunford. “but started to decline from the middle of the year with the ratios for Passives and Electro-Mechanical products heading towards unity in the summer months. Semiconductors, however, have continued to see a high B2B ratio throughout the third quarter. Our members are therefore confident that we will continue to see growth in the market for at least the first half of 2023. Looking further into the second half of the year is more difficult, however. Many uncertainties remain, especially in the light of predicted recession in the global economy, so we are forecasting for growth to slow at the end of the year”. Although the major industry analysts are forecasting that in electronic components markets and especially semiconductors, growth will decline and become negative in the global market in 2023, Dunford sees that decline being limited to the huge consumer electronics applications: “In the UK, and indeed in most of Europe the component market is driven primarily by the automotive, industrial and professional application areas. We expect projects, such as the roll out of 5G and faster data communications that are by nature longer term, will remain strong although there may be a slowing down in investment. Also, demand from the Military and Aerospace sector will for more obvious reasons, remain strong”.

Authorised Distributor Backlogs Remain High…

Customerorder backlog levels reported by ecsn’s manufacturer authorised distributor members reached unprecedented heights in 2022, a trend that looks likely to slowly reverse in 2023 due to improving customer confidence and declining components manufacturer lead-times. In collaboration with their supply network partners the association is advising customers to gently “roll back the throttle” as their confidence increases in the supply of components and an uptick in orders from their customers: “Rapid changes by customers expose their organisation and their supply network to increased risk”, Fletcher said. He believes that change will happen as manufacturer lead-times inevitably decline but his members’ opinions about when this will happen and by how much, vary: “The consensus opinion arrived at by ecsn members is that by mid-2023 lead-times will have stabilised at around 12-to-16 weeks for most Semiconductor and Passives, with Interconnect and e-Mech components remaining on 8-to-10 week lead-time. There will remain some ‘outliers’ on much longer lead-times across all components categories”. Fletcher remains concerned about availability: “I suspect that all electronic components will remain on lead-times in the 6-to-16 weeks timescale for at least the next few years, so we are not going to see a return to the virtually zero lead-times that characterised the first two decades of this century”.

Up and To the Right…

The trajectory for the electronic components markets continues to be up and to the right. Despite the ‘difficult’ market conditions in 2022, which Fletcher believes will continue throughout 2023, he remains confident that even stronger underlying growth will return to global electronic components markets, driven by a host of competing applications: “The roll-out of 5G handsets and infrastructure, cloud computing / high performance computing and automotive are the likely main ‘push’ applications but I expect industrial automation, medical, aviation and military to run these sectors a close second in 2023”.

The electronic components supply network fortunately still operates as a “people to people business” where great relationships, effective communication and collaboration, along with a large dose of good humour rank high amongst the key elements for success. A great many geopolitical and economic uncertainties remain that could impact the market but ecsn members remain very positive about their organisations’ and their customers’ prospects into 2023. The association will continue to provide timely guidance and updates to the market on its members’ outlook as appropriate: “To help mitigate the supply and demand imbalances in the market all organisations are encouraged to play their part in their industry’s continuing success by participating and contributing to the collaboration process up and down their supply network”, Fletcher concluded, “These initiatives really cost organisations very little but the improvements they can make to competitive advantage are immense and will benefit everyone as we move into 2023 and beyond”.

“Until Bizen, the Zpolar transistor and ZTL logic, high-performance chips for applications such as 5G and RISC-V could only be produced at facilities such as the Taiwanese giant, TSMC, which controls most of the world’s high-performance semiconductor production. Now, UK and other Western fabs can be competitive again, and even overtake the Taiwanese and Korean giants, while also securing best national interests and IP,” said Explains David Summerland, CEO of SFN.

SFN’s four ITMs include ITM180, which delivers ZTL chips with the performance of 180nm CMOS using one micron equipment; ITM35, which enables 35nm CMOS-equivalent ICs to be made in 180nm process node fabs; ITM5, which enables 5nm CMOS performance from 28nm steppers; and ITMSubnm, which leads to sub-nm, Angstrom-level capabilities for 3nm fabs . VHDL is taken into the chosen ITM, which delivers both the POR (Process Of Reference) and the GDSii for the resultant IC to the fabs. The Infographic shows this process.

Bizen applies quantum mechanics to any wafer process technology. Bizen ZTL chips require far fewer processing layers, enabling complex devices to be manufactured in large-geometry fabs around the world. Details Summerland: “A 180nm fab using ITM35 delivering ZTL chips with the equivalent performance of 35nm CMOS will have ten times fewer process steps than an actual 35nm CMOS process, resulting in a 10 fold reduction in production time. This translates into a 40-50 fold increase in net profit for the Bizen-converted fab. At the same time, this massively contributes to solving semiconductor shortages.”

Although a new technology, the Bizen process can run on standard silicon process technologies using standard CMOS processing equipment. Bizen has been in development at a UK fab for four years, and SFN has produced ‘gold standard’ test wafers, which have been characterized. The extracted characterization data has been put into a JMP data book and used to produce SPICE models which run in the Cadence design environment, and matches the results from the Synopsis wafer process flow.

“We are aware of CMOS technology roads stretching out to at least 2036 with device geometries down to two angstroms. It is important to understand CMOS is logic, MOS a transistor. Even CFETS are stacked nMOS and pMOS. Bizen/ZTL is a huge step forward and will render other complex approaches redundant. Zpolar transistors move away from a reliance on the unipolar structure of CMOS, to take advantage of an inherent hair trigger input and minimized vertical size. We believe ‘Time Machine’ is the best description for the compound combination of the Bizen wafer process, Zpolar transistor and Zpolar Tunnel Logic (ZTL): using this technology, IC designers can go back 10 years in manufacturing capabilities, then forward 10 years – or more – in performance terms, with the ZTL devices they create. Since the ICs are so much simpler to produce, and/or more chips can be made per wafer, we are also solving the semiconductor shortage crisis, and at the same time, eliminating our reliance on foreign powers and their roads. Where we’re going, we don’t need roads,” said Summerland.

Connext Drive 2.0 offers an accelerated path to deliver high performance compute capabilities via safety-certification components and teleoperation plug-ins. Connext Drive is based on the Data Distribution Service (DDS) standard, the leading data connectivity standard that has also been adopted by Automotive standard organizations, AUTOSAR and ROS. This will help OEMs rapidly design multiple vehicle architectures by selecting the optimal features and functions for any specific use case. New Connext Drive 2.0 features include:

• Connext Integration Toolkit for AUTOSAR Classic: includes a set of tools bridging AUTOSAR Classic ECU modeling and configuration workflows with RTI Connext Drive 2.0 for rapid and scalable communication of embedded, real-time and secure systems. This integration simplifies the design and evolution of DDS-enabled automotive ECUs.
• Connext ROS 2 Toolkit: includes a growing library of tools that eases ROS 2 and Connext Drive ecosystem integration, providing ROS 2 developers with a bridge to production-grade systems. Through this integration, users can slash latency in their ROS 2 systems through a custom ROS Middleware Wrapper developed by RTI. 
• Connext Drive Launcher: helps users design a vehicle according to a specific use case, including Next Generation E/E, ADAS, Teleoperations, Simulation or High Performance Compute. By selecting the optimal features for a specific use case, developers achieve increased productivity and accelerated time to market. Users can now ease project development with direct access to the full set of utilities, services and tools available in Connext Drive. 

With today’s announcement, Connext Drive 2.0 includes components safety-certified to ASIL D levels by TUV SUD – the highest level of software certification – ensuring functional vehicle safety to the needs of each individual component, from the ECU to the Central Gateways. Additionally, it now includes interoperability with two popular Real-Time Operating Systems: QNX for Safety over armv8; and AUTOSAR Classic OS implementation over Infineon TriCore, offering a reliable and low-risk path to safe, production-grade vehicles. Connext Drive 2.0 is in production vehicles on the road in the US, Europe and Asia.

“RTI Connext Drive helps address a fundamental challenge for the vehicle of tomorrow by providing a data-centric architecture,” said Nelson Quintana, Head of the Infineon Automotive Silicon Valley Innovation Center (SVIC). “We recognize the value of such technology and look forward to expanding our cooperation with RTI to bring its DDS-based technology, combined with Infineon’s leading automotive microcontroller portfolio including the AURIX family, to enable next-generation E/E architectures.”

“Connext Drive 2.0 reinforces the market commitment from RTI by initiating a use-case driven product,” said Pedro Lopez Estepa, Market Development Director, Automotive at RTI. “At RTI, we’re dedicated to helping our customers overcome the current architectural limitations in automotive with a product that secures several annual releases including a long-term safety-certified modular solution to enable Autonomous and Electric Vehicle innovation.”

For more information on Connext Drive 2.0 and a full list of new features, please visit: www.rti.com/drive.

Connext Drive 2.0 is available today. For pricing and licensing, please contact drive@rti.com. 

Beyond visual line of sight (BVLOS) drone flight is making steady inroads. Since 2018, the US Federal Aviation Authority has waived its CFR Part 107.31 rules over 70 times, authorising operators of small unmanned aerial systems (sUAS) to fly beyond BVLOS. For UAS weighing over 55 pounds, the FAA also offers Part 91 and 61 exemptions.

Among the Part 107 waiver recipients to date are Alphabet’s Project Wing, which is trialling drone package deliveries; Matternet, which is trialling drone delivery of medical samples; and ARE, which offers drone-based inspection for utility lines. These are all promising UAS applications, and the FAA is committed to enabling the “virtually limitless benefits” that operations like these can provide.

Challenges

To get to a seamless scenario, there are several BVLOS challenges to address. First, FAA and its counterparts around the world must ensure drones can operate BVLOS without creating safety risks – either for other airspace users or people and structures on the ground. This huge task involves rethinking how airspace is segregated, how air traffic is managed when it includes millions of unmanned vehicles and traditional aircraft, and how drone safety and airworthiness are assessed and demonstrated.

That process is ongoing with the FAA BVLOS Aviation Rulemaking Committee (ARC), which will lead to formal regulation to come. In the meantime, any company wanting to fly BVLOS must apply for a CFR Part 107.31 waiver or Part 61/91 exemption. To obtain one, they must demonstrate their UAS safe-worthiness.

Reliable GPS is a fundamental safety condition for all BVLOS waivers: For Part 107 waivers, this starts with the FAA Order 8040.6 “Unmanned Aircraft Systems Safety Risk Management Policy”. A key requirement of this order relates to GPS reliability.

Every Part 107 waiver we’ve seen (all published on the FAA website) specifies that the drone must have a reliable GPS signal throughout its flight. Part 107 waivers granted to Wing, Matternet and ARE, for example, all include the following requirement: “Operations subject to this waiver must cease if, at any time: GPS signal is lost, or GPS location information is degraded”.

For Part 61/91 exemptions relating to larger and heavier drones, the FAA states that the flight must not even start if GPS reliability is not assured throughout the flight. The exemption issued to A-Cam Aerials, for example, states that: “The PIC may not begin or continue a flight if any global positioning system (GPS) outage, signal fault, integrity issue, Notice to Airmen in effect for any part of the planned operational area, or any other condition that affects or could affect the functionality or validity of the GPS signal”.

To highlight a related consideration of GPS reliability and performance, the waiver also includes: “Geo fencing relies on GPS accuracy. For this software to be effective as a mitigation, the PIC must know the GPS location certitude of its UAS system and factor that in to his or her planning. For example, if the GPS location certitude of the UAS is ±10 feet, then add 10 feet to the buffers between the UAS and filming personnel.”

These requirements point to a future where navigation will form a crucial part of any defined regulation. That may not be so much of an issue for operations in open rural spaces, but for services in urban or suburban areas, it could be a deal-breaker. That’s because the drone needs radio line of sight to at least four satellites – or six, if it’s also using an augmentation service like Wide Area Augmentation System (WAAS) or Satellite-based Augmentation System (SBAS) – to accurately calculate its position. If line of sight to those satellites is blocked or distorted by trees or buildings, even for a few seconds, the drone’s GPS receiver may temporarily lose lock on the signal.

GPS reliability

Clearly, GPS reliability could be a deal-breaker for UAS-based business models. If a drone has to land unexpectedly, the costs of recovery and mission failure could become punitive. Hence, a solution is needed to address GPS signal degradation. Without one, regulators may not be convinced that a drone can operate safely in certain areas, businesses may find it tough to gain approval to fly in those areas, and operations that do obtain authorisation for BVLOS flight may be disrupted if GPS problems occur.

As a provider of GNSS test, measurement and assurance solutions, Spirent Communications offers a two-fold solution to the GPS signal degradation, which were developed in close cooperation with the aviation industry:

Solution 1

GNSS availability forecasting solution, in the form of Spirent’s GNSS Foresight, which uses advanced 3D modelling and ray tracing to predict and map areas where GNSS signals might be degraded, and when. Drone operators can use Foresight before and during drone’s flight, to identify, anticipate and avoid areas of known GPS degradation.

Foresight is available as two separate solutions, depending on the requirement: Foresight Live calculates GNSS for every metre, every second, from 1-100m above ground, for the current time and days/hours in the future. In doing so it enables planning and real-time decision making to ensure GNSS continuity and reliability. Whereas Foresight Risk Analysis provides best-case, worst-case and 90^th-percentile predictions over a given service area, to determine where GPS can always be assured.

Solution 2

The second solution relies on reliable test services for GNSS-reliant equipment. From GNSS chipsets to whole UAS, Spirent hardware and software solutions can test the equipment’s ability to navigate in areas of GPS degradation. Drone operators can combine this knowledge with data from GNSS Foresight to make intelligent decisions about where and when the drone can safely fly BVLOS.

For more on safe autonomous drone flight beyond visual line of sight, see Spirent Communications’s ebook “Achieving Reliable GNSS Performance for Autonomous UAS Navigation”.