“For over 25 years, we have been producing world-recognized timing receivers, serving critical applications and major industry players. With our next-generation technology, we are now bringing precise and resilient time in an ultra-compact form factor to high-volume applications,” explained Yasmine Hunter, Product Manager at Septentrio.

The mosaic-G5 T module receives signals on multiple frequencies from all available GNSS satellite constellations, achieving high precision even in challenging environments, such as in areas with radio interference. It enables precise, high-resolution timing through two independent and reliable pulse-per-second (PPS)  pulses and has clock and frequency input support for seamless synchronization. The mosaic-G5 T is ready to support Galileo High Accuracy Service (HAS)  and is built to stay agnostic towards other correction services that enhance timing accuracy.

www.hexagon.com

“The ACS37100 marks a critical inflection point for magnetic sensors. Our TMR technology is enabling current sensors that are ten times faster and four times lower noise versus typical Hall-based products,This leap in performance solves important challenges in high-voltage power conversion, especially related to wide bandgap solutions,” said Matt Hein, Business Line Director of Current Sensors at Allegro. “”

The new ACS37100 TMR current sensor helps power system designers master the control signal chain and unlock the full potential of fast-switching GaN and SiC FETs. Tailored to the needs of electric vehicles (xEVs), clean energy power conversion systems, and AI data centre power supplies, the ACS37100 achieves an industry-leading 50 ns response time, providing the high-fidelity data needed for optimal efficiency and protection in demanding high-frequency applications.

Migration to GaN and SiC promises greater power density and efficiency, but their faster switching speeds create significant control challenges. At sub-megahertz frequencies, conventional magnetic current sensors lack the speed and precision to provide the high-fidelity, real-time data required for stable control and protection loops. This can leave advanced systems vulnerable to damage and may prevent them from operating at their full potential.

The ACS37100 is engineered to solve this control challenge. Its industry-leading bandwidth and response time provide the high-fidelity current sense feedback essential for demanding control loops in high-speed switching applications. This magnetic current sensor enables designers to confidently and reliably control faster systems, maximise efficiency, and increase power density. Leveraging advanced TMR technology, the device delivers exceptionally low noise of 26 mA root mean square (RMS) across the full 10MHz bandwidth — enabling precise, high-speed current measurements for more accurate and responsive system performance.

The ACS37100 minimises energy loss while maximizing operational efficiency and reliability, making it the ideal choice for a variety of automotive and industrial uses like xEV charging, clean energy power conversion, and AI data centre power supplies.

The ACS37100 is available in the SOICW-16 package that supports a working reinforced isolation up to 565 V_RMS (basic 1,097 V_RMS) with 8 mm creepage and clearance. It features a voltage reference output and an adjustable overcurrent fault.

www.allegromicro.com/acs37100.

]]> https://www.electronicsworld.co.uk/molex-to-acquire-smiths-interconnect/39756/ Fri, 17 Oct 2025 08:26:57 +0000 https://www.electronicsworld.co.uk/?p=39756 Connectivity solutions maker, Molex, is acquiring Smiths Interconnect, a subsidiary of UK-based Smiths Group plc. Smiths is knowns for its high-reliability connectivity products serving the aerospace and defence, medical, semiconductor test and industrial markets.

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex.

The acquisition is a strategic plan to further strengthen Molex in aerospace and defence sectors, following its acquisition of AirBorn last November.

“The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways,” said Nelligan.

Smiths Interconnect designs and manufactures innovative electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications.

Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the US, UK, Canada, Mexico, Costa Rica, France, Germany, Italy, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

www.molex.com.

Each channel isolated to 1000VDC making the new device a significant advancement in thermocouple technology. Offering unparalleled precision with an accuracy of ±0.5°C from 0 to 85°C and ±1°C from -40 to 125°C, the module delivers reliable performance in the most challenging environments.

The thermocouple module measures temperatures across an exceptional range from -200°C to +1,800°C at sampling rates of up to 40Hz per channel. This capability makes it ideal for applications ranging from cryogenic research to high-temperature industrial processes.

Each channel features galvanic isolation exceeding 1000VDC, enabling safe and accurate temperature measurement in high-voltage systems such as battery packs, power electronics, and electric vehicle components. This isolation eliminates current paths through thermocouple leads, ensuring reliable measurement accuracy by preventing ground loops and electrical interference that can compromise temperature readings.

“The combination of isolation, accuracy, and CAN bus integration makes it an ideal solution for applications where temperature monitoring is mission-critical,” said Joe Holdsworth, founder and CEO at Metis Engineering.

The device features comprehensive fault detection capabilities, including open-circuit and short-circuit detection that alerts users when thermocouple wires are broken, disconnected, or shorted to ground or power. This built-in diagnostic functionality ensures system reliability and reduces maintenance overhead.

Engineered for harsh industrial environments, the module with potted electronics features DIN rail mounting and IP67-rated JWPF connectors that enable daisy-chaining with additional modules for expanded measurement capabilities. The robust design supports input supply voltages from 9 to 32V, making it compatible with a wide range of industrial power systems.

The device ships with K-type miniature thermocouple connectors as standard, with support for multiple thermocouple types including K, J, T, N, S, E, B, and R configurations. This flexibility allows users to select the optimal thermocouple type for their specific application requirements.

The module’s configurable CAN bus speed and address, combined with the supplied DBC file, enables straightforward integration into existing CAN networks. This feature is particularly valuable for automotive applications and industrial automation systems where CAN bus communication is standard.

“The CAN bus integration reflects our commitment to providing sensors that integrate seamlessly into modern industrial and automotive systems,” added Holdsworth. “Engineers can quickly deploy multiple channels of high-precision temperature monitoring without complex integration challenges.”

https://metisengineering.com/product/8-channel-isolated-thermocouple/

https://metisengineering.com

These are industry’s first PCIe Gen 6 switches manufactured using a 3nm process. The family is designed to deliver lower power consumption and support up to 160 lanes for high-density AI system connectivity. Advanced security features include a hardware root of trust and secure boot, utilizing post-quantum safe cryptography compliant with the Commercial National Security Algorithm Suite (CNSA) 2.0.

“Rapid innovation in the AI era is prompting data center architectures to move away from traditional designs and shift to a model where components are organised as a pool of shared resources,” said Brian McCarson, corporate vice president of Microchip’s data centre solutions business unit.

Previous PCIe generations created bandwidth bottlenecks as data transferred between CPUs, GPUs, memory and storage, leading to underutilisation and wasted compute cycles. PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied. Switchtec Gen 6 PCIe switches enable high-speed connectivity between CPUs, GPUs, SoCs, AI accelerators and storage devices, and are designed to help data center architects scale to the potential of next generation AI and cloud infrastructure.

“By expanding our proven Switchtec product line to PCIe 6.0, we’re enabling this transformation with technology that facilitates direct communication between critical compute resources and delivers the most powerful and energy efficient switch we’ve ever produced,” said McCarson.

By acting as a high-performance interconnect, the switches allow for simpler, more direct interfaces between GPUs in a server rack, which is crucial for reducing signal loss and maintaining the low latency required by AI fabrics. The PCIe 6.0 standard also introduces Flow Control Unit (FLIT) mode, a lightweight Forward Error Correction (FEC) system and dynamic resource allocation.

These changes make data transfer more efficient and reliable, especially for small packets which are common in AI workloads. These updates lead to higher overall throughput and lower effective latency.

Switchtec Gen 6 PCIe switches feature 20 ports and 10 stacks with each port featuring hot- and surprise-plug controllers. Switchtec also supports NTB (Non-Transparent Bridging) to connect and isolate multiple host domains and multicast for one-to-many data distribution within a single domain. The switches are designed with advanced error containment and comprehensive diagnostics and debug capabilities, a wide breadth of I/O interfaces and an integrated MIPS processor with bifurcation options at x8 and x16. Input and output reference clocks are based on PCIe stacks with four input clocks per stack. Visit the website to learn more about Microchip’s full portfolio of PCIe switches.

The Switchtec Gen 6 PCIe Switch family is supported by Microchip’s ChipLink diagnostic tools, offering comprehensive debug, diagnostics, configuration and analysis through an intuitive graphical user interface (GUI). ChipLink connects via in-band PCIe or sideband signals such as UART, TWI and EJTAG, enabling flexible, efficient monitoring and troubleshooting throughout design and deployment. The switches are also supported by the PM61160-KIT Switchtec Gen 6 PCIe Switch Evaluation Kit with multiple interfaces.

www.microchip.com

The Pi Vision 10.1 CM5 brings the power and flexibility of the Raspberry Pi Compute Module 5 to an industrial-grade, fully enclosed HMI platform. Designed for developers, makers and OEMs ready to move from prototyping to professional deployment, it delivers the full Raspberry Pi experience — now in a rugged, production-ready form.

Built from a solid aluminium structure and featuring a 10.1-inch multi-touch display with IP66 front protection, the Pi Vision 10.1 CM5 is engineered for durability in demanding environments. Every component, from the panel-mount enclosure to the high-brightness display, has been designed for continuous industrial operation.

With native compatibility with Raspberry Pi OS and full support for Clea OS, SECO’s Yocto-based secure operating system, developers can choose between rapid prototyping on Raspberry Pi OS and enterprise-grade management with Clea OS. This flexibility makes Pi Vision 10.1 CM5 the perfect bridge between the Raspberry Pi community and industrial-scale applications.

Running Clea OS, SECO’s Yocto-based operating system, Pi Vision 10.1 CM5 provides secure fleet management, real-time data processing, and AI-at-the-edge capabilities. Clea OS enables enterprises to manage connected devices, deploy and update applications seamlessly, and provides developers with an open, ready-to-use environment to accelerate innovation.

By combining the Raspberry Pi ecosystem with SECO’s industrial reliability, the Pi Vision 10.1 CM5 enables rapid development of intelligent HMI solutions with long-term durability and broad software compatibility. Its flexibility makes it ideal for a wide range of applications, including smart building and HVAC, industrial and factory control, retail and kiosk, vending and smart appliances.

The Pi Vision 10.1 CM5 is available in two configurations — 2 GB RAM / 16 GB eMMC and 8 GB RAM / 64 GB eMMC — both included in the limited launch offer.

Early access registration is now open to secure priority availability of the first production units and the exclusive launch price: SECO: Pi Vision 10.1 CM5

www.seco.com

“In an era of geopolitical uncertainty, with cybersecurity issues and armed conflicts on the rise, Europe’s technological sovereignty is more and more inseparable from sovereign hardware, whether for civil applications or, more importantly, defence. It was therefore natural for SiPearl to capitalise on the expertise developed by its R&D teams in HPC to develop a new version of our first processor that perfectly meets the needs of dual-use purposes. As part of the roadmap entrusted to us by Europe to foster the return of high-performance processor technologies to the continent, Athena1 is the perfect complement to Rhea1 in helping to assert Europe’s strategic independence”, concluded Philippe Notton, CEO and founder of SiPearl.

Based on the unique expertise in Europe developed for the design of Rhea1 (SiPearl’s first generation processor, dedicated to HPC), Athena1 will offer features specifically tailored to the workloads of government, defence and aerospace applications. These include, for example, secure communications and intelligence, cryptography and encryption, intelligence processing, tactical networks, electronic detection or local data processing on vehicles.

In addition to its computing power, Athena1 will be characterised by its security and integrity. The Athena1 family will offer skus of 16, 32, 48, 64 or 80 Arm Neoverse V1 cores, depending on the power required for each application and their thermal constraints, among other factors. Detailed technical specifications will be announced at a later date.

The manufacturing of Athena1’s die will be entrusted to TSMC, the world’s leading independent foundry for advanced semiconductors. Packaging will initially be carried out in Taiwan, but packaging is targeted to be moved to Europe to help to grow this industrial ecosystem in Europe.

Athena1 will be commercially available in the second half of 2027.

]]> https://www.electronicsworld.co.uk/silicon-labs-series-3-socs-now-available-to-power-the-next-generation-intelligent-edge/39653/ Thu, 02 Oct 2025 14:36:04 +0000 https://www.electronicsworld.co.uk/?p=39653 Silicon Labs introduces the first products in its new Series 3 platform: the SiMG301 and SiBG301 SoCs.

This series is aimed at the intelligent edge, delivering generational gains in compute, connectivity, integration and security while complementing the company’s proven Series 2 platform. Device makers can continue to build on Series 2’s breadth and maturity for ultra‑low‑power endpoints, and adopt Series 3 for more demanding and feature‑rich designs — without changing ecosystems, tools, or support models. With SiMG301 among the first in the Alliance’s Matter Compliant Platform Certification program, teams can deliver feature‑rich, Matter‑certified products faster with pre‑tested core functionality and a clearer certification path.

“SiMG301 and SiBG301 bring Series 3’s compute and integration with the world’s first PSA Level 4 security, giving customers a stronger foundation for long‑lived, secure IoT,” said Ross Sabolcik, Senior Vice President of IoT Products at Silicon Labs.

Built on an advanced 22 nm process, Series 3 introduces a multi‑core architecture that separates application, wireless, and security workloads, providing headroom for growing protocol stacks and emerging compute-intensive use cases at the edge. The SixG301 family consists of:

• SiMG301 (Multiprotocol): Concurrent Zigbee, Bluetooth LE, and Matter over Thread; ideal for smart lighting, and other Matter-focused switches, sensors, and controllers. An integrated LED pre‑driver reduces external components, BOM cost, and board space in line‑powered designs.
• SiBG301 (Bluetooth‑Optimized): Tailored for Bluetooth LE applications that benefit from Series 3 compute and security, with an easy migration path from Series 2 Bluetooth designs.

Both devices offer developers generous Flash/RAM headroom with up to 4 MB Flash and 512 kB RAM. They both include Silicon Labs’ PIXELRZ single wire communication interface for LED controller ICs as well as a LED pre-driver that enables low level and consistent dimming, which together simplify designs, reduce costs, and provide efficient power for smart home lighting, smart building lighting, and other lighting applications.

The SiMG301 is among the first devices included in the Connectivity Standards Alliance’s new Matter Compliant Platform Certification program. A Matter Compliant Platform is a tested combination of SDK and designated hardware that has been certified by the Alliance for core Matter functionality.

By building on a certified platform, device makers can inherit pre‑tested commissioning, networking, and message security, significantly reducing the number of tests required for end‑product certification. Teams can also take advantage of the Alliance’s Fast Track and Rapid Recertification programs when the underlying platform remains unchanged, shortening development cycles and lowering costs. Products built this way are referred to as Derived Matter Products (DMPs).

Security is foundational to Series 3. Series 3 Secure Vault, debuting with the SixG301 family, has achieved the world’s first PSA Level 4 certification, the highest level recognized by PSA Certified and addresses advanced physical attacks.

This certification validates Silicon Labs SoCs equipped with Series 3 Secure Vault, like the SiMG301 and SiBG301, for resilience against laser fault injection, side-channel analysis, micro-probing, and voltage manipulation. This raises the bar for edge protection and supports alignment with tightening global regulations. The certification followed independent lab evaluation.

Built on Silicon Labs’ Series 2 security legacy, Series 3 Secure Vault includes a hardened root of trust, lifecycle controls, and secure OTA update support for products expected to live in the field for years. Silicon Labs’ Secure Vault’s features help developers reach compliance with emerging regulations including the EU’s RED and CRA and the U.S. Cyber Trust Mark, among others.

The devices, the first in the SixG301 family, are now shipping from Silicon Labs and authorized distribution partners worldwide.

www.silabs.com

Previously, detecting mechanical rotational motion required two ICs, each capable of sensing magnetic flux in only one direction. The S-57W1/W2, however, contains a single chip with built-in Hall elements that detect magnetic flux density in two different directions, enabling detection with just one IC. With the industry’s highest magnetic sensitivity of 0.8 mT (typ.) (*2), the IC achieves high-resolution rotational detection.

The product is available in the standard SOT-23-5 package (2.9 × 2.8 × t1.3 mm) and the HSNT-6 package (2025, 1.96 × 2.46 × t0.5 mm), which is the industry’s thinnest (*3) 2D dual hall effect latch IC package, making it suitable for space-constrained applications.

With the rise of vehicle electrification and advances in autonomous driving, the number of motors in automobiles continues to grow, components such as power windows, sunroofs, power sliding doors, and power liftgates now require smooth operation and precise positioning. The S-57W1/W2 detects the rotational speed and direction of motors driving these components with high precision, all on a single chip.

Its high sensitivity enables detection of weak magnetic flux in multi-pole ring magnets. Increasing the number of magnetic poles on a ring magnet is an effective way to improve the resolution of rotational detection. However, adding more poles reduces the volume of each magnetized section, which in turn weakens the magnetic flux density.

The S-57W1/W2 series includes a high-sensitivity version with a value of 0.8 mT typ., enabling detection of even weak magnetic flux densities. This makes it suitable for use with ring magnets featuring a high number of poles.

It has industry’s thinnest small package for low-profile motor applications. Motors must meet various size and thickness requirements depending on their application. The S-57W1/W2 is offered in the HSNT-6 (2025) package, the thinnest small package for a 2D dual hall effect latch IC. This makes it ideal for compact, low-profile motor applications with limited mounting space.

The S-57W1/W2 has a short output delay time of 8.4 µs typ., allowing it to detect rapid changes in the magnetic field. This allows reliable rotational detection for high-speed motors.

www.ablic.com/en/semicon/

“The solutions that are being brought to life through our partnership with Grinn utilize AI capabilities and advanced connectivity, enabling a wide variety of benefits in the SOM and wireless module space,” said CK Wang, General Manager of the IoT Business Group at MediaTek.

The partnership with MediaTek also helps Grinn to develop innovative and effective custom embedded computing solutions for its customers, enabling it to draw directly on advanced technical support from MediaTek, early access to MediaTek product roadmaps, and privileged supply-chain support.

“The MediaTek Genio 700 makes it possible for Grinn to effectively address a diverse range of IoT applications and market segments,” said Wang.

The Grinn GenioSOM-700’s processor features dual 2.2GHz Arm Cortex-A78 cores for intensive compute workloads, six 2.0GHz Cortex-A55 cores for efficient multi-tasking, and an Arm Mali-G57 graphics processing unit (GPU) for sophisticated graphics and smooth image rendering. The MT8390 supports real-time AI operation thanks to an on-chip 4 TOPS neural processing unit (NPU).

The Grinn GenioSOM-700, which supports demanding compute and AI workloads in machine vision and audio applications, offers a combination of high-speed interfaces, image signal processing and video codecs.

This is a high-performance SOM for smart home devices, industrial automation equipment and computer vision systems which require high-throughput vision processing capability and advanced AI acceleration. The industry’s smallest SOM based on the Genio 700 processor, it is supplied in an LGA-312 format which has a footprint of just 37.0mm x 42.6mm.

Grinn also added the Grinn GenioSOM-510 based on the MediaTek Genio 510 processor, and featuring dual 2.2GHz Arm Cortex-A78 cores and four Cortex-A55 cores, this SOM also features a an on-chip NPU.

The Grinn GenioEVB gives developers a versatile evaluation platform for the Grinn GenioSOM family of modules. Featuring a wide range of headers, the Grinn GenioEVB ensures effortless integration of sensors and modules with Grinn GenioSOM products. It serves as an ideal reference for developers, streamlining the creation of schematics and PCB layouts for new product development.

The Grinn GenioSOM-700, Grinn GenioSOM-510 and Grinn GenioEVB are available to order online now from grinn-global.com.

grinn-global.com.