Analysis challenges, compliance tests of various protocols, and jitter analysis, are typical applications that can include:

• High-Speed Signal Protocol Compliance Analysis With the 13GHz bandwidth and 40GSa/s real-time sample rate, the DS80000 series digital oscilloscope can cover more high-speed signal protocol compliance analysis application scenarios, for compliance analysis tests such as PCIe, and USB2.0.
• High-Speed Components and System Performance Validation The DS80000 series provides advanced jitter and eye diagram analysis functions, which can be widely applied to scenarios such as embedded system debugging, high-speed serial and parallel bus performance testing, clock jitter, signal integrity, PLL performance validation, etc.
• High-Speed Protocol Compliance Analysis Supports physical layer testing for MIPI D-PHY, USB2.0/3.0, 100/1000Base-T, automotive Ethernet, etc. with built-in eye diagram templates, jitter analysis, and compliance verification tools.
• High-Speed Device and System Performance Validation Ideal for signal integrity testing in high-speed digital circuits, RF front-end modules, optical communication components, and performance evaluation of high-speed SerDes, FPGAs, ASICs, etc. Fast sampling ensures accurate transient signal capture for system stability analysis.
• Laser Pulse Signal Testing Delivers rapid rise and fall time response with high sampling precision, enabling detailed, accurate measurements of laser pulse characteristics.

DS80000 Oscilloscopes feature the Smart Probe 2.0 Intelligent Probe System, a newly-designed 3.5mm interface, compatible with both next-generation and legacy active differential and passive probes via adapters. This design auto-detects and simplifies probe switching for varying test scenarios, enhancing overall testing efficiency.

This latest addition to Rigol’s portfolio delivers powerful high-speed signal capture and analysis capabilities, providing engineers worldwide with a reliable tool for fault isolation and validation in high-speed designs. Built on Rigol’s custom-developed StationMax II modular hardware platform and UltraVision III technology framework, the DS80000 Series achieves new levels of measurement across the wide technology world. Suitable for rack-mounting (17.6” x 12.2” x 20.6”), these oscilloscopes are available now from Saelig, Rigol’s USA technical distributor.

https://www.saelig.com.

“We have always looked to partner with like-minded companies to ensure our customers have an ecosystem of options that seamlessly integrate, extend value, and bring the future of IoT communications to drive their business,” said Steve Ericson, Senior Vice President and General Manager of Digi OEM Solutions.

Digi International supplies secure embedded technology and connectivity such as system-on-modules, wireless communication systems, and cloud management software to developers in a diverse range of industries, including education, energy, industrial, medical, retail, smart cities and transportation. In every case, it is committed to ensuring that each customer is provided with precisely the right technology for their wireless connectivity requirements. Its technologies include a range of solutions to support Bluetooth, cellular IoT, edge computing, Fixed Wireless Access, LoRaWAN, 5G, Zigbee Wireless Mesh, and more.

Digi solutions can be ordered online from Farnell in EMEA, element14 in APAC and Newark in North America.

DSEI brings together global defence leaders, technology innovators, and industry stakeholders, making it the ideal platform for Lane Electronics to introduce its newest franchise—the FIBRECO range of expanded-beam connectors and cable assemblies. Designed for high-performance communication in harsh environments, the FIBRECO range offers flexible, cost-effective solutions for critical defence and aerospace applications.

In addition to the FIBRECO launch, Lane Electronics will feature a wide array of products from its leading global supplier partners, including:

• EATON Souriau: MIL-DTL-38999 connectors and derivatives (JVS, high power, ELIO fibre-optic), micro-38999, 8STA and rectangular microComp connectors.
• Weald Electronics: LMH, LMG, LMF, LMJ and MG circular connectors, and PCB connector solutions such as LM200, LMR, and 801/801CX.
• Huber & Suhner: High-performance RF and microwave connectors and cables.
• Positronic: SCORPION and high-power Goldfish connectors, plus standard, sealed, and combo D-Sub connectors.
• Nicomatic: CMM, DMM, EMM, and AMM high-density rectangular connectors.

Visitors can also explore a wide selection of accessories, including backshells, dust caps, and blanking/shorting covers from Weald Electronics, as well as heatshrink boots and shapes from HellermannTyton.

“We offer one of the most comprehensive connector portfolios for defence and security equipment,” said Nick Wheeler, Sales Director at Lane Electronics. “DSEI is a key event for us, and we’re looking forward to engaging with both longstanding customers and new contacts to discuss the latest technologies and applications.”

As a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, Lane Electronics are the preferred connector source across many industry sectors including defence, avionics, motorsport, marine, communications, medical, test and measurement, general industrial solutions and geophysical. A major source for all key connector types, Lane Electronics has a multi-million-pound connector and piece-part stockholding and can offer next-day delivery.

For more information call +44 (0) 1403 790 661, email sales@fclane.com or visit https://www.fclane.com/

The RA8P1 has been designed to meet the growing number of edge and endpoint AI applications, which, according to Renesas’s figures, is growing at a CAGR of 85% between 2017 and 2025. Alongside it, there’s a growing integration of AI on the edge, which requires further acceleration, like NPUs, that can handle the load of neural networks (convolutional and recurrent neural networks). The Ethos-U55 supports most commonly used NNs, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own.

“There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “Customers are eager to employ these new MCUs in multiple AI applications.”

The RA8P1 MCUs also rely on embedded 1MB Magnetoresistive RAM (MRAM) in the new MCUs, which is one of the most retentive and enduring technologies, offering the highest speeds, compared with Flash.

For highest security and privacy of handling data on the edge, the RA8P1 MCUs include Renesas’s own Security IP (RSIP-E50D) which includes cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution.

The RA8P1 MCUs are available now. Renesas is also shipping an RA8P1 Evaluation Kit. More information is available at renesas.com/RA8P1. Samples and kits can be ordered either on the Renesas website or through distributors.

The sensor uses residual energy recovery technology, or energy harvesting, thus causing no excess current consumption. Installation is done non-invasively using pliers and requires no prior disconnection. The sensor communicates wirelessly via Bluetooth Low Energy (BLE) and LoRaWAN technologies, covering distances of up to 5km. The measurements can be read immediately after installation of the sensor in real time on a dedicated mobile application, developed by the Integral System team in partnership with TCT. The sensor is also equipped with an external probe that allows temperature readings to be taken.

The software, developed at Arrow’s engineering solutions centre in Gdansk, contains protocol stacks for ISO 15118 Vehicle-to-Grid (V2G) communication. There is also sample application code, as well as support for Open Charge-Point Protocol (OCCP) and Control Pilot interfaces as defined in IEC 61851 and SAE J1772.

“V2G is required for fast DC chargers and quickly becoming the preferred communication protocol for AC charging. It increases charger functionality with future-proof capabilities, including wireless charging, bi-directional power transfer and plug-and-charge feature,” said Vitali Damasevich, director of engineering for Eastern Europe and Arrow’s engineering solutions center EMEA. “Our reference design enables EV chargers producers to quickly adopt the new standard, relieving much of the software development needed by including the ISO 15118 protocol stack, and also providing a HomePlug Green PHY module to assist hardware design and integration.”

Completing the reference design, the hardware communication module contains the Lumissil CG5317 HomePlug Green PHY low-power communications transceiver. This integrated circuit is HomePlug compliant and AEC-Q100 Grade 2 qualified, allowing operation from -40°C to 105°C.

The Arrow GreenPHY reference design board is easily connected to various evaluation boards for testing and development, and Arrow’s engineers are ready to help customers integrate with their chosen MPU or MCU platform when finalising the design for production. Turnkey conformance tests are also available to help customers verify correct operation when connecting to various popular EV models. This saves significant time and development costs to secure the necessary product-level approvals.

The combination of software stacks and sample code, engineering support, and vehicle-specific tests presents a fast and efficient route to market. Moreover, the engineering team at Arrow’s engineering solutions centre is committed to ongoing development of the ISO 15118 stack as specifications evolve.

The software stack has recently been deployed by Arrow engineering services provider eInfochips in their DC charger design. THE DCFC is tailored for small and mid-sized commercial and public EV charging. With support for both U.S. and EU markets, and compliant with CE, FCC and UL standards, DCFC can also be managed remotely by drivers and charge point service providers via the eInfochips EVWER platform and mobile app.

As a result, medical care has undergone a transformative shift, granting individuals greater autonomy in monitoring and maintaining their health. With the help of modern wearables and health trackers such as smartwatches, fitness bands, and glucose monitors, for the first time in history, people can continuously measure and track their vital signs, activity levels, and other biometrics without visiting a doctor or hospital. Any data captured by such devices can then be shared wirelessly with healthcare professionals via a centralised database, providing them with real-time insights into a patient’s condition and enabling timely interventions if needed.

The IoMT has also opened new possibilities for personalised and preventive medicine as well as telemedicine and home care. By leveraging the power of large data analytics and artificial intelligence, digitised healthcare can help identify patterns, trends, and anomalies in a patient’s health and provide tailored recommendations and feedback. Technology can also be utilised through remote consultations and examinations, which can reduce the need for physical contact and travel and ultimately enhance convenience and safety for patients and providers.

Continual advancements in technology are allowing engineers to leverage faster wireless connectivity and create devices with greater processing power, storage, and sensing functionality. Apart from the familiar fitness watches, a plethora of wearables like rings and smart clothing have hit the market. These cutting-edge gadgets offer an extensive range of medical services, from tracking fitness and monitoring vital signs to detecting early stages of cancer.^[1]

However, smart medical devices can pose significant design challenges for engineers and developers, who need to ensure that the devices are reliable, secure, and efficient. Personal IoMT devices must be able to perform complex functions such as sensing, processing, and communicating biometric data while consuming minimal power and space. Additionally, since these devices are meant to engage with us, they are typically designed to be ergonomic, battery-powered, and wearable, which requires them to be lightweight, compact, and long-lasting. For designers of such products, it is usually a case of carefully balancing form and functionality.

A common approach to meeting these requirements in intelligent medical devices is to incorporate 8-bit microcontroller units (MCUs) into their core components. The reason why 8-bit PIC^® and AVR^® MCUs are so advantageous for medical devices is that they allow for effortless customisation of onboard hardware with minimal overhead, providing a desirable blend of performance capabilities and power efficiency. As a result, they enable the production of products that achieve incredible system efficiency without compromising on performance or costs.

Microchip Technology, a prominent company in the field of 8-bit MCUs, has been designing and manufacturing 8-bit PIC and AVR MCUs since the 1970s. Similar to their tailored automotive offerings, Microchip’s 8-bit MCUs offer several advantages specifically for IoMT and wider medical applications.

Microchip offers a variety of wireless modules and transceivers that can be seamlessly connected to their 8-bit MCUs, simplifying design considerations and enhancing system integration, making them ideal for compact wearable devices with limited space. Another key aspect of Microchip’s PIC and AVR solutions is the integration of on-chip Core Independent Peripherals (CIPs) which enhance versatility and provide a distinctive level of configurability to the market. By utilising CIPs, engineers can create efficient programs with minimal code overhead, design compact packaging, and decrease the overall cost of their bill of materials (BOM), all of which are essential for the success of wearable technology.

Microchip’s 8-bit MCUs are unique in that they do not impose any restrictions on customers who want to use their parts in devices that conform to the US Food and Drug Administration (FDA) Class I, II, or III medical device regulations. This flexibility allows customers to select the most suitable solution for their specific requirements. Development of Microchip 8-bit solutions is further simplified with the Microchip MPLAB PICkit 5 In-Circuit Debugger/Programmer. The kit, when used with the MPLAB X integrated development environment (IDE), offers a user-friendly graphical user interface (GUI) that facilitates rapid prototyping and portable programming for Microchip components such as PIC, dsPIC^®, AVR, and SAM (Arm^®) devices.

By utilising efficient 8-bit MCUs, the IoMT can thrive, offering increased benefits and possibilities for the medical industry and society. By incorporating intelligence into medical devices and making them accessible to users, we can empower individuals with the ability to take control of their healthcare. The simplicity and efficiency of 8-bit MCUs combined with the intelligence and connectivity of the IoMT enable engineers and developers to create revolutionary and meaningful solutions that have the potential to enhance the health and well-being of millions of people worldwide.

^[1] https://news.mit.edu/2023/wearable-ultrasound-scanner-breast-cancer-0728

By Mark Patrick, Director of Technical Content EMEA, Mouser Electronics

Within automotive design, some initiatives are persistent across every model and manufacturer. First is the obvious shift away from fossil-fuel-powered internal combustion engines to sustainable electric vehicles (EVs), and the second is the rise in automotive intelligence. Looking to increase the functionality and safety of their vehicles, in the hope of providing a competitive edge in a busy market, more OEMs are adding advanced driver-assistance system (ADAS) functions as well as greater infotainment and driver convenience features.

Similarly, the industry is actively transitioning from powering automotive subsystems with mechanical solutions to using networked electronic solutions to support greater system electrification, intelligence, and efficiency. As a result, modern vehicles have evolved to the point where they are now essentially data centres on wheels, with every area of the vehicle continuously capturing or processing small frames of data. But data and sophisticated control can come at a cost, beyond monetary terms. With a vehicle’s weight severely impacting performance and range, manufacturers have to be smart about their system architecture. Connecting endless vehicle subsystems, ranging from chassis control modules to motorised mirror drivers to centralised processing systems, would significantly impact vehicle performance, adding hundreds of kilos of wiring looms into already tightly packaged designs.

The alternative approach is to implement a zonal architecture, in which systems are organised based on the specific area of the vehicle they occupy rather than their functionality. This enables data processing and some decision-making to be kept localised, handled by smaller MCUs at the edge of the vehicle’s architecture, as opposed to centralised body domain controllers (BDCs). This reduces the need for extensive wiring connecting back to central processing systems. The shift in design ethos, coupled with a greater dependence on electronically controlled functions (as opposed to mechanical ones), has resulted in a substantial increase in the need for MCUs that can provide convenient, cost-effective, and dependable integration and operation.

Upon closer examination of any vehicle zone or module, it becomes evident that MCUs serve as a fundamental component, providing control of peripheral functions and sensors without adding significant complexity or overhead to the vehicle’s architecture. MCUs are used to govern systems such as seat controls, in-vehicle and exterior lighting, mirror and side-mirror control, steering wheel controls, switchgear, capacitive controls, and much more.

Yet, even with the abundance of MCUs to choose from to control these modules, why are 8-bit Microchip Technology PIC and AVR MCU models often considered the most advantageous option? One of the main reasons for this preference for vehicle subsystems is their simplicity and efficiency. Their focus is on delivering the necessary functionality while ensuring the design is simple and lightweight and minimises power consumption. For many vehicle subsystems, even those deemed ‘intelligent’, the level of control and processing needed is relatively basic, and they do not need the level of functionality seen with 16-bit and 32-bit microprocessors.

Instead, many automotive OEMs are turning to solutions like PIC and AVR MCUs from Microchip Technology, which are essentially an extension of a typical 8-bit microprocessor. At the core is the same low-cost and low-power performance expected, with simple system integration and programming but with an added range of additional features and Microchip’s Core Independent Peripherals (CIPs) tailored to the market’s precise requirements.

Microchip’s latest PIC and AVR solutions come with features such as an integrated ADC and flash memory as well as automotive-qualified models with on-board controller area network (CAN) bus to allow for easier communication between vehicle systems without the need for external hardware. Furthermore, they have been designed to ensure reliable performance in harsh automotive environments, providing off-the-shelf compliance with the latest rigorous safety standards required by the automotive industry.

By taking what is, in comparative terms, a very simple electronic component and integrating key additional functionality, electronics manufacturers can create devices that are of real value to the automotive industry. With modern vehicle makers seeking greater system intelligence and moving to zonal distribution, there is now a bigger demand than ever for low-powered MCUs. In essence, MCUs have now become a fundamental automotive component. While 16- and 32-bit microprocessors will have their place, 8-bit variants—with their low cost and low complexity—are arguably best suited to fill a large number of core vehicle applications.

By Mark Patrick, Director of Technical Content EMEA, Mouser Electronics

The first stage of implementation will be to include Adlink’s Computer-on-Module range in the Rutronik portfolio. The integration of further products such as monitors, panel PCs or GPUs will follow. An essential part of the co-operation is the intensive training of Rutronik’s international teams of experts to provide customers with competent support for design-in projects.

“We see many synergies with Rutronik and are convinced that this cooperation will enable us to significantly expand our market presence, especially internationally,” explains Xavier Serra, Director Distribution Network Adlink Technology. “With Rutronik, we have a renowned and experienced partner at our side whose product and market expertise in EMEA will enable us to achieve our strategic goals.”

The Prism4’s design supports remote hardware systems with cameras, modular lights and evaluation boards. The platform also includes a set of Phase Dock workbench bases where devices can be attached using clicks and slides.

Each Prism4 hosts specific ready-to-ship Prism4 hardware systems that are available for different technologies, including field programmable gate arrays (FPGAs), select microprocessors and microcontrollers. In addition, the Prism4’s extensible system design supports the creation of remote laboratories for other fields, allowing for a variety of uses, such as remote education and training using real equipment.

“LabsLand has created an incredible technology that has the ability to control hardware platforms remotely anywhere in the world, 24 hours a day, seven days a week,” said David Sandys, senior director of technical marketing for DigiKey. “By partnering with LabsLand to design and launch Prism4, DigiKey can now offer this technology solution to students, schools, engineers and designers worldwide for real-time evaluation and education.”

“We are excited to take our relationship with DigiKey to the next level with the launch of Prism4, which offers new features and more extensibility and robustness,” said Pablo Orduna, founder and CEO of LabsLand. “DigiKey has helped us continue our mission to provide universal access to real labs with real instruments and equipment.”

Initially developed for educational settings, LabsLand remote engineering hardware systems allow engineers, students and educators access to hardware and software solutions that are often price-prohibitive. With the development and release of the Prism4 through DigiKey, engineers, designers and suppliers have access to a remote engineering platform for new product demonstration, evaluation, product testing and design, allowing engineers to try out hardware before purchasing. Software engineers can also use the platform to learn and develop code and program remote targets using actual hardware instead of simulators. The Prism4 hardware system enables users to control and interact with the target platforms while providing video feedback demonstrating outcomes and results in real-time.

DigiKey engaged with a design integration service provider to jump-start the design process and then collaborated with Phase Dock and LabsLand on the final product.

Commenting on the award, John Bowman, Marketing Director at Anglia, said, “Bulgin is Anglia’s number one connector franchise. This is not just down to their innovative products, but the exceptional support provided by the Bulgin team at all levels from management, commercial, engineering, marketing and logistics. Bulgin’s customer orientated focus matches our own at Anglia, and this award recognises the unwavering commitment and support Bulgin provides on a daily basis.”

German Casillas, Chief Commercial Officer, and Eric Smith, Distribution Sales Director, at Bulgin, added, “We’re delighted to receive this award from Anglia. They represent a key part of our distribution network and we value the team’s strong relationships with their customer base. We’ve seen significant sales growth and great customer acceptance of Bulgin through Anglia, and we hope that this partnership may long continue.”

Headquartered in Cambridgeshire, in 2023 Bulgin celebrated 100 years of manufacturing components to cater for a global customer base across a variety of markets, including marine, agriculture and consumer electronics. In 2016, Bulgin announced the strategic incorporation of sister company Arcolectric into its business offering to expand Bulgin’s expertise and range, particularly in electromechanical switches.

Although difficult to estimate the IoMT market size due to the sensitive nature of information, a 2022 report by GlobalData estimates it at $486bn in 2020, and predicts its growth to $807bn by 2025, at a compound annual growth rate of 11%.

Soldier wearables

Among IoMT devices, the development of innovative soldier wearables is the most prominent. According to a research by ReportLinker, the military wearables market is expected to exceed $5.6bn by the end of 2023 and double by 2030.

Programs like the US Army’s “Nett Warrior” outline systems for the development of the “future soldier”, ensuring every piece of equipment down to the smallest connector is designed for enhanced tactical capabilities. Similarly, head-mounted command-and-control displays equipped with augmented reality such as Microsoft’s Integrated Visual Augmentation System headset are rapidly gaining popularity.

Integrating wearable devices to monitor vital signs, fatigue levels and the location data of soldiers enables better health management and operational planning. Biometric sensors play an essential role here, since they track in real time heart rate, hydration levels, body temperature and other critical parameters. Connector types commonly used in these applications include magnetic and push-pull options for quick and easy mating, USB-C, micro-USB and HDMI connectors for power, video and data transfer.

Robust data transmission

Military operations often take place in challenging environments, where conditions can be extreme. This means that the IoMT connectors must be suitable for these environments, too, withstanding wide temperature ranges, vibrations and exposure to water, dust and other contaminants. A reliable and rugged connector ensures uninterrupted data transmission between sensors, devices and control centres, enabling real-time situational awareness and rapid decision making.

Data collected from IoMT systems can be analysed by machine-learning algorithms, to provide predictive insights regarding potential threats, equipment failures and supply chain disruptions.

To ensure the reliable acquisition and transmission of data, circular connectors are typically used: MIL-DTL-38999, MIL-DTL-26482 and military-grade RJ45 are known for their robustness, reliability and resistance to harsh environmental conditions. Most prevalent MIL-SPEC standards include MIL-DTL-5015 and MIL-DTL-26500.

Similarly, numerous other standards exist that cover different aspects of military equipment, such as the Generic Open Soldier System Reference Architecture (GOSSRA), German VG standards and NATO Standardization Agreement (STANAG), which establish a common set of technical requirements ensuring interoperability and compatibility in joint military operations.

Interoperability

IoMT is characterised by a diverse array of interconnected devices that could be from different manufacturers, nations or military branches. Standardised connectors allow interoperability between numerous military assets, enabling seamless integration and cooperation across the battlefield.

To enhance IoT equipment connectivity, middleware platforms and standardised APIs, as well as Message Queuing Telemetry Transport, are used to facilitate communication and data exchange between diverse devices and systems.

IoMT is certainly a growing trend in defence and security, and here connectors play an essential role, to underpin this platform’s successful integration and operation.

PEI-Genesis offers rugged and reliable interconnect options from many manufacturers, which comply with MIL-SPEC standards and encompass all aspects of IoMT – from soldier-worn applications to land vehicles, aircraft and weapon systems.

By Alex Raymond, Product Manager, PEI-Genesis