Components – Electronics World https://www.electronicsworld.co.uk Electronic Engineering and Design Fri, 17 Oct 2025 14:08:41 +0000 en-GB hourly 1 https://www.electronicsworld.co.uk/wp-content/uploads/2019/02/cropped-ew-logo-square3-32x32.png Components – Electronics World https://www.electronicsworld.co.uk 32 32 Maximising industrial system performance through custom approach to cable assemblies https://www.electronicsworld.co.uk/maximising-industrial-system-performance-through-custom-approach-to-cable-assemblies/39765/ Fri, 17 Oct 2025 14:07:30 +0000 https://www.electronicsworld.co.uk/?p=39765 The UK’s industrial automation market is experiencing significant growth – and showing little signs of slowing down.

While the robotics market continues to be dominated by manufacturers in central Europe and Asia, UK manufacturers are increasingly leading in other areas of industrial automation, such as robotic process automation, packing, warehousing, logistics and more. Original equipment manufacturers in the UK therefore have a unique opportunity to innovate and compete by embracing smarter, more resilient machinery.

Taking a customised approach from the design and development stage will help limit downtime, streamline assembly and deliver leading performance, helping businesses capitalise on the situation.

Areas of focus

The rise of the smart factory has significantly increased the scope of industrial automation outside the realm of traditional robotics, both on and off the factory floor. Cobots (collaborative robots) are entering these areas, too, alongside robotic pickers, conveyor systems and high-speed sensors. This is in addition to autonomous guided vehicles used in warehousing, automated test rigs in use for in-house testing and measurement, and more.

Opting for custom cable assemblies and components at the earliest stages of a project ensures robustness and suitability of the design, but also it simplifies it, reducing component count and streamlining assembly. Custom wiring looms, for example, combine multiple complex types of wires and cables to meet space constraints, simplify installation and leave room to accommodate future growth or the addition of new features.

Ruggedisation against stress

Off-the-shelf solutions often fall short of this sector’s tough requirements, where high levels of vibration and temperature resistance are required to protect component from failure due to mechanical stress.

Similarly, design and development engineers might be required to specify cable assemblies rated to industrial IP standards for dust, moisture and shock protection to meet industry or country-specific compliance laws.

Giving engineers the ability to customise and ruggedise components means increasing the reliability of the system, particularly where physical impacts are likely – such as in material handling or packaging lines. This minimises the risk of failure and downtime.

Then, there is the testing and validation stage, which is just as important. Physical prototyping is a must, to ensure your customised assembly meets all performance and safety standards.

Precision for high-movement applications

Taking a custom approach to design and manufacturing can be especially relevant for OEMs that supply drives and motion control systems, where a high degree of precision, speed and control is required. This includes servo motors, linear actuators, or gear-driven robotic arms — machinery that operates with constant flexing, repetitive cycles, and high acceleration and deceleration forces.

Customising the assemblies and components provides peace of mind about the precision of your electronics, whilst guarding against assembly failure, which could cause misalignment. Where standard industrial cabling might fail in servo motors, due to either conductor fatigue or sheath breakdown, design and development engineers can specify customised cables with controlled bend radii, overmoulded strain reliefs and reinforced jacketing to deliver extended flex lives.

EMI shielding for signal integrity

Another vital consideration during the product development stages is the preservation of signal integrity, especially in the presence of other electronics. This is even an even greater concern for industrial electronics operating in ‘noisy’ factory floor environments.

Signal degradation can deliver faulty test results and unreliable system feedback, while control panels near heavy machinery can also be affected by electromagnetic interference (EMI). Selecting suitable materials for the cable, insulation, shielding and connectors – based on performance and environmental requirements – is a crucial design consideration for engineers.

Customising cable assemblies means that design engineers can combine power and signal functions into a single assembly, enjoying simpler routing without worrying about crosstalk. Instead, they can work with the manufacturer to specify shielded enclosures within the assembly, EMI filters on power and signal lines, and physical separation within the assembly. This can all be achieved while maintaining a minimal level of interference acceptable for high-spec environments.

Custom cable assemblies

In essence, engineers designing automation and industrial systems should consider specifying custom cable assemblies early in the design process to ensure system reliability, reduce on-site rework, and meet safety and compliance standards.

By Paul Dearman, Head of Business Development, GTK

www.gtk.co.uk

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Molex to acquire Smiths Interconnect https://www.electronicsworld.co.uk/molex-to-acquire-smiths-interconnect/39756/ Fri, 17 Oct 2025 08:26:57 +0000 https://www.electronicsworld.co.uk/?p=39756 Connectivity solutions maker, Molex, is acquiring Smiths Interconnect, a subsidiary of UK-based Smiths Group plc. Smiths is knowns for its high-reliability connectivity products serving the aerospace and defence, medical, semiconductor test and industrial markets.

“Molex is excited to reinforce our commitment to the aerospace and defense market with the acquisition of Smiths Interconnect,” said Joe Nelligan, CEO, Molex.

The acquisition is a strategic plan to further strengthen Molex in aerospace and defence sectors, following its acquisition of AirBorn last November.

“The combination of Molex’s global scale, capabilities and financial stability with Smiths Interconnect’s complementary technologies, products, customers and footprint will enable us to expand our aerospace and defense business and support customers in new and innovative ways,” said Nelligan.

Smiths Interconnect designs and manufactures innovative electronic components, along with microwave, optical and radio frequency products and subsystems that connect, protect and control critical applications.

Smiths Interconnect has 21 sales, R&D and manufacturing locations across 12 countries, including the US, UK, Canada, Mexico, Costa Rica, France, Germany, Italy, Tunisia, India, China and Singapore.

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions. More information will be shared at that time. Jones Day is acting as Molex’s legal advisor and Rothschild & Co is serving as Molex’s exclusive financial advisor.

www.molex.com.

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High-precision 8-channel isolated thermocouple module addresses a critical challenge in high-voltage industrial applications https://www.electronicsworld.co.uk/high-precision-8-channel-isolated-thermocouple-module-addresses-a-critical-challenge-in-high-voltage-industrial-applications/39749/ Thu, 16 Oct 2025 09:39:34 +0000 https://www.electronicsworld.co.uk/?p=39749 Bristol-based Metis Engineering, a developer of advanced CAN-based sensor technology, launched its new 8-Channel Isolated Thermocouple to CAN module, that addresses temperature monitoring requirements of industrial, automotive and research applications.

Each channel isolated to 1000VDC making the new device a significant advancement in thermocouple technology. Offering unparalleled precision with an accuracy of ±0.5°C from 0 to 85°C and ±1°C from -40 to 125°C, the module delivers reliable performance in the most challenging environments.

The thermocouple module measures temperatures across an exceptional range from -200°C to +1,800°C at sampling rates of up to 40Hz per channel. This capability makes it ideal for applications ranging from cryogenic research to high-temperature industrial processes.

Each channel features galvanic isolation exceeding 1000VDC, enabling safe and accurate temperature measurement in high-voltage systems such as battery packs, power electronics, and electric vehicle components. This isolation eliminates current paths through thermocouple leads, ensuring reliable measurement accuracy by preventing ground loops and electrical interference that can compromise temperature readings.

“The combination of isolation, accuracy, and CAN bus integration makes it an ideal solution for applications where temperature monitoring is mission-critical,” said Joe Holdsworth, founder and CEO at Metis Engineering.

The device features comprehensive fault detection capabilities, including open-circuit and short-circuit detection that alerts users when thermocouple wires are broken, disconnected, or shorted to ground or power. This built-in diagnostic functionality ensures system reliability and reduces maintenance overhead.

Engineered for harsh industrial environments, the module with potted electronics features DIN rail mounting and IP67-rated JWPF connectors that enable daisy-chaining with additional modules for expanded measurement capabilities. The robust design supports input supply voltages from 9 to 32V, making it compatible with a wide range of industrial power systems.

The device ships with K-type miniature thermocouple connectors as standard, with support for multiple thermocouple types including K, J, T, N, S, E, B, and R configurations. This flexibility allows users to select the optimal thermocouple type for their specific application requirements.

The module’s configurable CAN bus speed and address, combined with the supplied DBC file, enables straightforward integration into existing CAN networks. This feature is particularly valuable for automotive applications and industrial automation systems where CAN bus communication is standard.

“The CAN bus integration reflects our commitment to providing sensors that integrate seamlessly into modern industrial and automotive systems,” added Holdsworth. “Engineers can quickly deploy multiple channels of high-precision temperature monitoring without complex integration challenges.”

https://metisengineering.com/product/8-channel-isolated-thermocouple/

https://metisengineering.com

 

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ETAL UK will show its comprehensive portfolio of transformers and inductors at EDS 2025 https://www.electronicsworld.co.uk/etal-uk-will-show-its-comprehensive-portfolio-of-transformers-and-inductors-at-eds-2025/39676/ Mon, 06 Oct 2025 13:06:13 +0000 https://www.electronicsworld.co.uk/?p=39676 ETAL UK is set to showcase its comprehensive portfolio of high-performance magnetic components at this year’s Engineering Design Show (EDS), which takes place on the 8th and 9th of October 2025 at the Coventry Building Society Arena.

ETAL UK is part of Kamic Group’s Magnetic Division and will be joined at the event by other members, including AGW ElectronicsAvon MagneticsTalemaSIGA Electronics and GST. With expertise spanning numerous sectors and applications, over 1,100 employees, manufacturing operations in four countries and customers located across the world, the group is a global force in the magnetics and components market.

“As a business we have continued to grow over the past 12 months, adding new expertise to an already impressive portfolio of market-leading products.  We have six world-class manufacturing sites that all offer different capabilities, and I am excited to meet customers old and new at EDS 2025 and showcase the breadth of solutions we can offer them,” said Stefan Ruuth, Sales Manager BA at ETAL Group.

Exhibiting on stand D4, visitors will have the opportunity to explore some of the group’s portfolio of customisable magnetic components and transformers, which are tailored for multiple industries, including aerospace, automotive, defence, transport, telecommunications and medical technology.

www.etalgroup.com/

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CLIFF Electronics adds 2-port MMC/MMC feedthrough adaptor to its range https://www.electronicsworld.co.uk/cliff-electronics-adds-2-port-mmc-mmc-feedthrough-adaptor-to-its-range/39640/ Tue, 30 Sep 2025 11:39:02 +0000 https://www.electronicsworld.co.uk/?p=39640 The new US CONEC MMC is a Very Small Form Factor (VSFF) multi-fibre optical connector has been designed for terminating multiple single-mode and multimode fibre cables in AI, cloud, and large data centre environments.

The 2-port MMC FeedThrough Adaptor accepts one or two US CONEC APC-polished connectors and is supplied with two single-port dust covers on both the front and rear (four in total).

It is initially offered in the following options:

  • Standard XLR shell, nickel-plated or matt black finished zinc metal frame, with countersunk or M3 threaded holes.
  • DUALSLIM narrow, nickel-plated or matt black finished zinc metal frame, with countersunk or M3 threaded holes.
  • Can be assembled in any of Cliff’s FT frames upon request.

Applications include:

  • Data Centres – high-density optical connections for server racks and patch panels, multi-fibre breakout in top-of-rack and middle-of-row configurations and is ideal for hyperscale environments where space is critical.
  • Cloud Infrastructure – backbone and interconnect solutions in cloud storage networks, supports fast deployment and scalable fibre distribution systems and compatible with VSFF (Very Small Form Factor) architectures.
  • AI / Machine Learning Clusters – fibre optic backbone for GPU-based compute clusters, high-bandwidth interconnections between AI training nodes and low-latency connections for real-time data processing.
  • Enterprise Networks – future-proofed fibre connectivity in modern office buildings, integration into structured cabling systems and suited for fibre-to-desk (FTTD) or high-density patch panels.
  • Telecom & ISP Equipment – multi-fibre solutions for central offices, POPs, or edge networks, scalable port density for broadband expansion and ready for 5G and next-gen fibre rollout
  • Test & Measurement Equipment – optical interface access in lab instrumentation, modular setup for R&D environments or production testing and supports quick changes in fibre topology without rework.

The new Cliff 2-port MMC Feedthrough Adaptor offers users many advantages  such as – accepts 1 or 2 US CONEC MMC APC connectors, supports multi-mode and single-mode fibres, enables high-density, low-footprint connectivity, mountable in XLR or DualSLIM FT panels (modular installation) and is supplied with front and rear dust covers for port protection

Cliff Electronics growing range of FeedThrough connectors now offers analogue, digital and optical connectivity in formats including BNC (50 or 75 ohm), DisplayPort, HDMI, Optical fibre (FC, LC Duplex, SC Simplex, ST BFOC, TOSLINK and US Conec MTP® brand MPO), RCA phono, RJ45 ethernet (UTP or FTP) in Cat6, Cat6a or Cat5e, USB 2, USB 3 and USB-C.

Cliffuk.co.uk

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Simkiss Group expands capabilities and strengthens market position https://www.electronicsworld.co.uk/simkiss-group-expands-capabilities-and-strengthens-market-position/39634/ Mon, 29 Sep 2025 11:15:33 +0000 https://www.electronicsworld.co.uk/?p=39634 Simkiss Group is marking a new chapter in its development, with significant growth plans and a strengthened presence in the UK electrical and control systems sector, following a series of investments, a move to a 73,000 sq ft headquarters, and a recruitment drive.

“We’ve reached a point where Simkiss Group is not only competing but leading in our sectors. Our expansion into larger premises earlier this year gave us the capacity to increase the amount of projects we can deliver, and the recruitment drive we are undertaking reflects the demand we’re seeing from clients. Growth for us isn’t just about size –  it’s about capability. We’re investing in people, in skills and in the systems that will keep us at the forefront of this industry,” said Simon Bodill, Managing Director at Simkiss Group.

As part of this momentum, Simkiss Group has completed the acquisition of Instrument Control Services (ICS) Ltd, a business with more than three decades of experience in low, medium and high-voltage systems. The addition of ICS brings expertise in panel build, testing and commissioning, preventative maintenance, cabling and jointing up to 33kV, and containerised electrical solutions. This acquisition is more than a growth move –  it positions Simkiss as a one-stop shop for complete, end-to-end solutions delivered through a single trusted partner.

“From the very beginning, our goal has been to evolve alongside our clients and offer them more of what they need, all under one roof. ICS shares that same approach, and bringing the two companies together feels like a natural fit. The combined capabilities mean our customers can expect a seamless service – from design to delivery to long-term support – with the reassurance of working with one team,” said Paul Simkiss, Chairman and Founder.

ICS will continue trading under its existing name and operating from its Stoke-on-Trent premises, ensuring continuity for its long-standing clients. At the same time, ICS’s people will become part of the wider Simkiss Group family, contributing to the culture of growth and innovation that defines the business today.

“This is an energising time for our teams,” added Bodill. “We are building something sustainable, forward-looking, and ambitious. Growth like this doesn’t happen by accident –  it comes from having talented people and a clear vision of where we’re going. The future for Simkiss Group is very bright.”

Founded in 1999 by Paul Simkiss, the business has grown steadily by supporting blue-chip clients with an ever-broadening range of services. Today, Simkiss Group operates at scale across the UK, delivering complex projects in design, manufacture, installation, commissioning and maintenance. Its growth is underpinned by a clear strategy to expand capabilities and invest in its people continually.

www.simkiss.co.uk

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Enabling the future of intelligent rail https://www.electronicsworld.co.uk/enabling-the-future-of-intelligent-rail/39586/ Mon, 08 Sep 2025 08:35:24 +0000 https://www.electronicsworld.co.uk/?p=39586 Rail transport is heading toward autonomy, promising increased efficiency, safety and sustainability. Central to this transformation are connectors, which ensure seamless communication between various subsystems. From real-time diagnostics to autonomous navigation, connectors underpin the intelligent infrastructure driving modern rail innovation.

Powered by investments

Rail operators are making significant investments in digitalisation and automation, worldwide. In Germany, Deutsche Bahn is trialling fully automated trains in Hamburg as part of its ‘Digital Rail Germany’ initiative, planning to increase capacity and reduce emissions without expanding the physical infrastructure. Meanwhile, East Japan Railway Company (JR East) is advancing plans to introduce driverless Shinkansen bullet trains by the mid-2030s, starting with a line between Tokyo and Niigata.

All these efforts signal a wider shift toward rail systems built with AI at the heart, with real-time analytics and high-speed communication, all of which depend on reliable interconnect technology.

Connecting complexity

However, the railway environment has some of the most severe conditions for electrical cables and connectors. Rolling stock and trackside hardware are exposed to constant vibration, harsh temperature extremes from -55°C up to +200°C, as well as high humidity. Equally, connectors are also exposed to contaminants like dust, oil and de-icing agents.

Then, there is electromagnetic interference (EMI) generated by traction drives and overhead cables, which can affect signal integrity, unless connectors are effectively shielded.

Connectors designed for rail applications must be ruggedised to meet stringent international standards such as EN 50155 and EN 45545-2, NFPA 130, VG 95234 and MIL-DTL-5015. These benchmarks define the connector’s ability to withstand shock, vibration, fire exposure and long-term environmental stress. RoHS and REACH variations along with corrosion resistant plating make for rugged and reliable connector solutions in the harshest environments.

Autonomous trains bring added demands on the connectors: They must be capable of supporting high-speed data transmission protocols such as Gigabit and 10-Gigabit Ethernet (typically Cat 6A and Cat 7), USB 3.1 and fibre optic interfaces.

All these protocols are essential for handling real-time data streams from sensors, LiDAR systems, onboard diagnostics and communication networks. Data rates in these environments can exceed 10Gbps, especially when multiple high-bandwidth systems, such as video surveillance, telemetry and predictive maintenance sensors are operating concurrently.

We mustn’t forget the mechanical aspect of connectors, where resilience remains critical. Connectors generally incorporate bayonet or threaded coupling systems to maintain secure connections under vibration. Contact retention mechanisms are designed for longevity, often rated for thousands of mating cycles. Contacts are generally gold-plated to minimise corrosion and offer low contact resistance for a prolonged time. These are also available in silver-plated versions.

Then, there is ease of maintenance as another crucial factor, particularly for retrofit applications. Modular connector designs and coding schemes enable simple installation and error-proofing. In addition, quick-disconnect configurations ensure quick field servicing with minimal downtime.

Future-proofing rail connectivity

As Rail 4.0 evolves, so too must the technology that supports it. Upcoming innovations in train autonomy and electrification demand connectors with greater bandwidth, higher power ratings and smarter integration capabilities.

For example, the development of distributed traction systems and battery-electric multiple units (BEMUs) introduces new requirements for high-voltage, high-current connectors that can handle regenerative braking energy and rapid charging. These connectors must include safety interlocks, arc suppression features and compliance with standards such as IEC 61373 for shock and vibration.

Simultaneously, increased deployment of real-time diagnostics and condition monitoring means that connectors must support multiple sensor interfaces. Emerging designs now incorporate built-in diagnostics, enabling connectors themselves to report on temperature, contact resistance, or mechanical wear, turning passive components into intelligent assets.

Modularity is another key trend. Future rail systems will demand flexible, reconfigurable architectures to accommodate upgrades and regional customisations. Connectors that support daisy-chaining, backplane mounting and tool-less assembly are increasingly favoured to reduce downtime and simplify system expansion.

PEI-Genesis supplies a wide range of connectors engineered specifically for challenging rail environments. The portfolio includes high-power solutions designed to handle demanding electrical loads, as well as high-speed data connectors used in communications and control systems. These connectors are designed to meet strict global rail standards, including EN 50155. With modularity and rugged design as core principles, our connectors support applications ranging from onboard control systems to trackside signal units, playing an essential role in powering the next generation of autonomous rail technology.

Connectors remain vital

As the global rail industry accelerates towards full automation, the supporting technologies behind the scenes are just as vital as the software that guides the trains. Connectors play a crucial role in delivering the reliability, safety and performance required by Rail 4.0. They serve as the nervous system of modern trains, making real-time communication and electrified propulsion possible in even the harshest environments. Looking ahead, the connector landscape will continue to evolve alongside rail innovation, offering smarter, faster and more resilient solutions that keep the railways of the future on track.

By Karen James, Product Manager, PEI-Genesis

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Farnell lines up an extended portfolio of new Nexperia products https://www.electronicsworld.co.uk/farnell-powers-up-with-extensive-portfolio-of-new-nexperia-products/39581/ Fri, 05 Sep 2025 10:07:07 +0000 https://www.electronicsworld.co.uk/?p=39581 To support Nexperia’s product expansion, Farnell has expanded its SKU range in line with the growing portfolio to better serve engineers worldwide. Nexperia typically adds some 800 new product types to its range every year. In 2024, this included over 70 new parts for analogue and power management applications.

“The importance of leading-edge power products cannot be overstated, and Nexperia provides some of the best – whether they are targeted for automotive, industrial or portable or even wearable applications. We share their goal of ensuring developers can access the exact components they need, when they need them. With comprehensive Nexperia inventory available across the Americas, EMEA and APAC, we are ready to support engineers worldwide,” said  Jose Lok, Global Product Category Director, Passives and Semiconductors at Farnell.

Nexperia is known for the quality and reliability of its products, ranging from discrete components, power, to logic ICs. To sustain its portfolion, the company continues to invest in its manufacturing, which includes $200m for SiC and GaN technology at its facility Hamburg, Germany. The investment is now yielding results, with a rapidly growing portfolio that includes power MOSFETs, wide bandgap semiconductors, IGBTs, as well as analogue and power management ICs.

These manufacturing advancements and new product introductions highlight Nexperia’s commitment to advancing production capabilities and meeting future demands, and Farnell’s expansion of Nexperia power products in stock reflects the desire to meet demand.

Included in the new series available from Farnell are:

  • Power MOSFETs – Automotive-qualified power MOSFETs, small signal MOSFETs, and application specific MOSFETs from 20V to 100V. These devices provide excellent switching performance and robustness in copper-clip packages (LFPAK, CCPAK) and micro lead package (MLPAK) variants.
  • 650V IGBT discretes in H-series (high speed) and M-series (motor drive) options deliver ruggedness, high reliability and enhanced inverter power density for medium and high voltage industrial applications.
  • SiC diodes offer temperature-independent capacitive turn-off and zero recovery switching behaviour, combined with an outstanding figure-of-merit (Qc x VF).
  • SiC MOSFETs with excellent RDSon temperature stability, fast switching speed, and high short-circuit ruggedness for high-power and high-voltage industrial applications.
  • Low voltage e-mode GaN FETs, 650 V e-mode GaN FETs, 40 V bi-directional GaN FETs and 650 V cascode GaN FETs designed for enhanced power density through reduced conduction and switching losses in low- or high-power conversion applications
  • Power rectifiers that deliver power density while minimising reverse recovery time and loss

The new range of power products from Nexperia is now available and shipping from Farnell in EMEA, Newark in North America and element14 in APAC.

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New common mode choke from Schurter https://www.electronicsworld.co.uk/new-common-mode-choke-from-schurter/39516/ Mon, 18 Aug 2025 08:48:37 +0000 https://www.electronicsworld.co.uk/?p=39516 Schurter is launching a new family of vertically mountable chokes for PCBs with very high inductance values. The current-compensated DKCV-1 chokes are designed for currents from 0.5 to 10 A. Thanks to nanocrystalline cores, they offer exceptionally high inductance in an extremely compact dimension. Ideal for EMI suppression in industrial, medical, and test equipment up to 300 VAC/450 VDC.
Watch our latest product introduction video to learn more.

High attenuation in a compact design
Modern high-performance applications are becoming increasingly smaller and more energy-efficient – but this miniaturization also promotes electromagnetic interference. To effectively suppress such interference, powerful filter components are required. Thanks to their compact design, DKCV-1 chokes can be mounted directly on the PCB while providing exceptionally high attenuation.

Space-saving vertical layout
The nanocrystalline cores enable very high currents with extremely compact dimensions. Thanks to the vertical choke arrangement, they also require very little space on the PCB. All variants of the DKCV-1 family have the same footprint on the PCB.

Applications
The new chokes are ideal for demanding applications that require high inductance with compact dimensions. These include switching power supplies, industrial, medical, laboratory and test equipment. The chokes are suitable for currents up to 10 A and voltages up to 300 VAC or 450 VDC and have ENEC, cUR and UR approvals. 

NPI Video DKCV-1

 

Datasheet DKCV-1

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TDK expands ultra-low voltage TVS diode portfolio for high-speed consumer electronics interfaces https://www.electronicsworld.co.uk/tdk-expands-ultra-low-voltage-tvs-diode-portfolio-for-high-speed-consumer-electronics-interfaces/39500/ Tue, 12 Aug 2025 08:37:11 +0000 https://www.electronicsworld.co.uk/?p=39500 TDK has expanded its ultra-low clamping voltage TVS diode line-up with three new models in the SD0201 series, tailored for high-speed consumer electronics interfaces. These TVS diodes offer compact protection for USB Type-C, HDMI, DisplayPort, and Thunderbolt connections in smartphones, laptops, tablets, wearables, and networking devices.

Each component comes in a 0201 chip-scale package (CSP), measuring just 0.58 x 0.28 x 0.15 mm (L x W x H) for space-constrained designs. Having working voltages of ±1 V, ±2 V, and ±3.6 V, the new TVS diodes safeguard sensitive circuits from electrostatic discharge (ESD) and transient surges. This means they meet IEC 61000-4-2 standards with ESD discharge robustness up to ±15 kV and support surge current handling up to 7 A, depending on the variant. Their symmetrical design enables bidirectional protection and thus flexible PCB routing, while very low leakage currents and dynamic resistance as low as 0.16 Ω enhance application-level efficiency.

The individual components differ in their DC working voltage and parasitic capacitance: the SD0201SL-S1-ULC101 (ordering code B74121U1036M060) has a working voltage of ±3.6 V and a parasitic capacitance of 0.65 pF, the SD0201-S2-ULC105 (B74121U1020M060) of ±2 V and 0.7 pF, and the SD0201SL-S1-ULC104 (B74121U2010M060) of ±1 V and 0.15 pF. A LTspice model library for SEED simulations for TVS diodes is available for download.

TDK’s new ultra-low clamping voltage TVS diodes are engineered to meet the challenges in today and tomorrow’s consumer electronics, ensuring reliable performance and safeguarding sensitive electronic devices from damaging transients.

www.tdk-electronics.tdk.com/en

 

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Renesas introduces GaN FETs for high-density power conversion aimed at AI data centres, industrial and charging systems https://www.electronicsworld.co.uk/renesas-introduces-gan-fets-for-high-density-power-conversion-aimed-at-ai-data-centres-industrial-and-charging-systems/39415/ Fri, 11 Jul 2025 13:32:04 +0000 https://www.electronicsworld.co.uk/?p=39415 Renesas has just introduced three new high-voltage 650V GaN FETs for AI data centres and server power supply systems including the new 800V HVDC architecture, e-mobility charging, UPS battery backup devices, battery energy storage and solar inverters. Designed for multi-kilowatt-class applications, these 4th-generation plus (Gen IV Plus) devices combine high-efficiency GaN technology with a silicon-compatible gate drive input, significantly reducing switching power loss while retaining the operating simplicity of silicon FETs. Offered in TOLT, TO-247 and TOLL package options, the devices give engineers the flexibility to customize their thermal management and board design for specific power architectures. 
 
The new TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS devices use the SuperGaN platform, a depletion mode (d-mode) normally-off architecture pioneered by Transphorm, which was acquired by Renesas in June 2024. Based on low-loss d-mode technology, the devices offer superior efficiency over silicon, silicon carbide (SiC), and other GaN offerings. Moreover, they minimise power loss with lower gate charge, output capacitance, crossover loss, and dynamic resistance impact, with a higher 4V threshold voltage, which is not achievable with today’s enhancement mode (e-mode) GaN devices.
 
The new Gen IV Plus products are built on a die that is 14 percent smaller than the previous Gen IV platform, and achieve a lower RDS(on) of 30mΩ, with a 20% improvement in on-resistance output-capacitance-product figure of merit. The smaller die size reduces system costs and lowers output capacitance, which results in higher efficiency and power density. These advantages make the Gen IV Plus devices ideal for cost-conscious, thermally demanding applications where high performance, efficiency and small footprint are critical. They are fully compatible with existing designs for easy upgrades, while preserving existing engineering investments.    
 
The devices are available in TOLT, TO-247 and TOLL packages, and have thermal performance and layout optimization for power systems ranging from 1kW to 10kW, and even higher with paralleling. The new surface-mount packages include bottom side (TOLL) and top-side (TOLT) thermal conduction paths for cooler case temperatures, allowing easier device paralleling when higher conduction currents are needed. Further, the commonly used TO-247 package provides customers with higher thermal capability to achieve higher power.
 
“The rollout of Gen IV Plus GaN devices marks the first major new product milestone since Renesas’ acquisition of Transphorm last year,” said Primit Parikh, Vice President of the GaN Business Division at Renesas. “Future versions will combine the field-proven SuperGaN technology with our drivers and controllers to deliver complete power solutions. Whether used as standalone FETs or integrated into complete system solution designs with Renesas controllers or drivers, these devices will provide a clear path to designing products with higher power density, reduced footprint and better efficiency at a lower total system cost.”
 
Unique d-mode Normally-off Design for Reliability and Easy Integration
Like previous d-mode GaN products, the new Renesas devices use an integrated low-voltage silicon MOSFET – a unique configuration that achieves seamless normally-off operation while fully capturing the low loss, high efficiency switching benefits of the high- voltage GaN. As they use silicon FETs for the input stage, the SuperGaN FETs are easy to drive with standard off-the-shelf gate drivers rather than specialized drivers that are normally required for e-mode GaN. This compatibility simplifies design and lowers the barrier to GaN adaptation for system developers.
 
GaN-based switching devices are quickly growing as key technologies for next-generation power semiconductors, fuelled by demand from electric vehicles (EVs), inverters, AI data center servers, renewable energy, and industrial power conversion. Compared to SiC and silicon-based semiconductor switching devices, they provide superior efficiency, higher switching frequency and smaller footprints.
 
Renesas is uniquely positioned in the GaN market with its comprehensive solutions, offering both high- and low-power GaN FETs, unlike many providers whose success in the field has been primarily limited to lower power devices. This diverse portfolio enables Renesas to serve a broader range of applications and customer needs. To date, Renesas has shipped over 20 million GaN devices for high- and low-power applications, representing more than 300 billion hours of field usage.
More information about Renesas’ GaN solutions is available at: renesas.com/gan-fets.
 
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Schurter expands its proven DG11 power entry module with a new version https://www.electronicsworld.co.uk/schurter-expands-its-proven-dg11-power-entry-module-with-a-new-version/39393/ Fri, 04 Jul 2025 09:23:56 +0000 https://www.electronicsworld.co.uk/?p=39393 Schurter expands its proven DG11 power entry module with a new version, featuring integrated magnetic overcurrent protection. No additional fuses required, splash-proof and dust-tight (IP67) – perfect for harsh industrial and medical environments.

Thermal-magnetic protection without additional fuse
The Schurter DG11 power entry module (PEM) is now available in a version with an additional magnetic release to protect against very high over-currents (short circuits) at the integrated TA35 circuit breaker.

In addition to the thermal bimetal principle, the new magnetic module reliably protects against very high over-currents (short circuits). This eliminates the need for additional fuses. Depending on the application, slow or fast-acting characteristics are available.

Splash-proof and dust-tight to IP67
The DG11 power entry module and the mains connection cable are fitted with special sealing elements (gaskets) to achieve the very high degree of protection IP67.

Practical V-Lock cord retention
The new variants are equipped as standard with the proven V-Lock cord retention system, which prevents unintentional disconnection of the power supply.

For industrial and medical applications
The new DG11 is ideal for environments exposed to dirt, dust, or splashing water, where the highest safety standards apply. Typical applications include harsh industrial environments or demanding medical applications, where regular cleaning, disinfection, and reliable overcurrent (short-circuit) protection are essential.

DG11 with Magnetic Release

Schurter is a company, providing components for supply of power, input systems and HMI for ease of use and better solutions. Its target markets are industrial, medical, mobility, energy, aerospace and consumer.

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